Announcement • Jun 03
Wolfspeed, Inc. Appoints Ganesh Srinivasan as Senior Vice President Wolfspeed, Inc. announced that Ganesh Srinivasan joins as Senior Vice President to lead its data center solutions team. Ganesh brings deep data center experience to Wolfspeed, having worked closely not only with hyperscalers but also with the entire ODM ecosystem to deliver end-to-end power and signal connectivity solutions for high-density AI clusters. Previous to his appointment at Wolfspeed, Ganesh served as VP of Product Management for the AI, Cloud, and Enterprise business at TE Connectivity. Prior to TE Connectivity, he spent more than 17 years leading multiple power business product lines at Texas Instruments. He holds M.S. and Ph.D. degrees in Electrical Engineering from Georgia Tech. WOLF
Live News • Jun 01
Wolfspeed Faces Heavy Short Interest as New Data Center Power Team Targets AI Expansion Short interest in Wolfspeed has reached 117% of the float, indicating heavy bearish positioning in the stock.
Commentary around the stock highlights the possibility of a large short squeeze if buying pressure returns.
Wolfspeed has formed a dedicated data center solutions team in the San Francisco Bay Area to work closely with hyperscalers, ODMs and partners on compact, efficient power solutions for AI infrastructure, led by industry veterans Ganesh Srinivasan and Yogesh Ramadass.
The combination of very high short interest and Wolfspeed’s push into AI-focused data center power solutions puts the stock at the center of both trading speculation and a key technology theme.
Investors may want to weigh the potential volatility that comes with a crowded short position against the execution risks and opportunities tied to Wolfspeed’s expansion into the data center market. Announcement • May 23
Wolfspeed Inc Introduces New 3.3 Kv Sic Power Modules In Two Industry-Standard Footprints Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge baseplate modules and scalable full-bridge baseplate-less modules in industry-standard footprints — that are purpose-built to address the rapidly approaching power constraints driven by AI data centers and the broader energy transition. Meeting this moment requires power generation, conversion, and distribution that is faster, smaller, more efficient, cost-effective, and more resilient than anything silicon alone can deliver. These new module families give engineers the tools to modernize energy infrastructure across the entire energy life cycle. The 3.3 kV silicon carbide (SiC) power module families are purpose-built to address the rapidly approaching power constraints driven by AI data centers and the broader energy transition. The two 3.3 kV families enable design engineers to reduce power stages and move to a 2-level topology for 2 kV and higher DC-link architectures — with the choice of baseplate and baseplate-less SiC power modules. The high-power half-bridge baseplate SiC power module (LM platform) is designed for >800 amp (A) applications and optimized for demanding converter topologies used in solar, grid-scale energy storage, and wind-power infrastructure. The scalable full-bridge baseplate-less (part of the Wolfspeed WolfPACK family) SiC power module is engineered for modularity, offering flexibility to configure multi-level, series-stacked, or parallel converter architectures with consistent, matched performance — and is optimized for solid-state transformers (SSTs) and modular renewable energy infrastructure. Both families are engineered for the relentless demands of always-on infrastructure. The Wolfspeed WolfPACK module leverages cutting-edge sintered die attach and epoxy encapsulant material to deliver a significant improvement in power cycling performance over standard silicon gel encapsulated modules. Similarly, the baseplate module achieves improved system durability and power cycling through advanced packaging technology featuring sintered die attach and a copper die-top system. Both families feature Gen 4 technology with improved cosmic ray susceptibility. The Wolfspeed WolfPACK module enables solid-state transformer systems to deliver over 50% footprint reduction compared to traditional equipment through improved switching performance and system architecture improvements. The new high-power baseplate module delivers up to 42% improvement in switching losses over other market-available SiC solutions and greater than 90% over IGBTs — both measured at 125°C on a 1.8 kV bus in the same package. Both families achieve improved switching over temperature, reducing magnetics and EMI filter sizes, ultimately leading to system power density and reduced system costs. Samples for the full-bridge Wolfspeed WolfPACK IBB020A33GM4, IBB020A33GM4T and for HAB900C33LM4 are available for select customers through Wolfspeed’s direct sales representatives. Both families will be demonstrated at PCIM, June 9–11, 2026, at booth 7-435, with live demonstrations showcasing system-level performance and scalability.