JAPAN MATERIAL Dividend
Dividend criteriumcontroles 3/6
JAPAN MATERIAL is a dividend paying company with a current yield of 1.26% that is well covered by earnings.
Belangrijke informatie
1.3%
Dividendrendement
n/a
Terugkoop Rendement
| Totaal aandeelhoudersrendement | n/a |
| Toekomstig dividendrendement | 1.5% |
| Dividendgroei | -4.8% |
| Volgende betaaldatum dividend | n/a |
| Ex-dividenddatum | n/a |
| Dividend per aandeel | JP¥22.000 |
| Uitbetalingsratio | 34% |
Recente dividendupdates
Recent updates
JAPAN MATERIAL (TSE:6055) Will Be Hoping To Turn Its Returns On Capital Around
Oct 18
JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Popularity With Investors Is Clear
Jul 19Estimating The Intrinsic Value Of JAPAN MATERIAL Co., Ltd. (TSE:6055)
May 08What Does JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Share Price Indicate?
Apr 17Market Participants Recognise JAPAN MATERIAL Co., Ltd.'s (TSE:6055) Earnings
Apr 01Stabiliteit en groei van betalingen
Dividenden ophalen
Stabiel dividend: 6055's dividends per share have been stable in the past 10 years.
Groeiend dividend: 6055's dividend payments have increased over the past 10 years.
Dividendrendement versus markt
| JAPAN MATERIAL Dividendrendement versus markt |
|---|
| Segment | Dividendrendement |
|---|---|
| Bedrijf (6055) | 1.3% |
| Markt onderkant 25% (JP) | 1.8% |
| Markt Top 25% (JP) | 3.8% |
| Gemiddelde industrie (Semiconductor) | 1.5% |
| Analist prognose (6055) (tot 3 jaar) | 1.5% |
Opmerkelijk dividend: 6055's dividend (1.26%) isn’t notable compared to the bottom 25% of dividend payers in the JP market (1.83%).
Hoog dividend: 6055's dividend (1.26%) is low compared to the top 25% of dividend payers in the JP market (3.82%).
Winstuitkering aan aandeelhouders
Verdiendekking: With its reasonably low payout ratio (33.7%), 6055's dividend payments are well covered by earnings.
Contante uitbetaling aan aandeelhouders
Kasstroomdekking: With its high cash payout ratio (645.8%), 6055's dividend payments are not well covered by cash flows.