Declared Dividend • May 20
Second quarter dividend of US$0.53 announced Shareholders will receive a dividend of US$0.53. Ex-date: 21st May 2026 Payment date: 11th June 2026 Dividend yield will be 0.5%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 18%. Cash payout ratio: 31%. Board Change • May 20
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 4 experienced directors. 8 highly experienced directors. Independent Director Kevin March was the last director to join the board, commencing their role in 2022. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Aankondiging • May 16
Applied Materials, Inc. Provides Earnings Guidance for the Third Quarter of Fiscal 2026 Applied Materials, Inc. provided earnings guidance for the third quarter of fiscal 2026. For the quarter, the company expects total net revenue of $8,950 million +/- $500 million. Aankondiging • May 06
Applied Materials, Inc. (NasdaqGS:AMAT) entered into a stock purchase agreement to acquire ASMPT NEXX, Inc. from Asm Assembly Systems, LLC for $120 million. Applied Materials, Inc. (NasdaqGS:AMAT) entered into a stock purchase agreement to acquire ASMPT NEXX, Inc. from Asm Assembly Systems, LLC for $120 million on April 30, 2026. The aggregate purchase price is $120 million in cash subject to certain adjustments as provided in the agreement. At closing, Applied Materials will deliver the purchase price to Asm Assembly Systems, subject to adjustments under the agreement, and will retain $18 million as an indemnification holdback to secure the Asm Assembly Systems' obligations for 18 months, with no interest payable.
Closing is expected to occur within five business days after the satisfaction or waiver of all closing conditions. The transaction is subject to the satisfaction or waiver of customary conditions under the agreement, including the absence of any legal or regulatory prohibition, accuracy of the parties’ fundamental representations and warranties, material compliance with covenants and obligations, receipt of required governmental filings, consents and approvals, absence of any material adverse effect, completion of agreed closing deliverables, settlement of outstanding insider receivables, retention of key employees and a majority of other personnel of ASMPT NEXX through closing, no pending or threatened legal proceedings affecting the transaction, and receipt by Asm Assembly Systems of the duly executed closing certificate from Applied Materials, Inc. Aankondiging • Apr 24
Applied Materials, Inc. to Report Q2, 2026 Results on May 14, 2026 Applied Materials, Inc. announced that they will report Q2, 2026 results at 4:00 PM, US Eastern Standard Time on May 14, 2026 Aankondiging • Mar 13
Applied Materials, Inc. Approves Quarterly Cash Dividend, Payable on June 11, 2026 Applied Materials, Inc. announced that its Board of Directors has approved a 15% increase in the quarterly cash dividend, from $0.46 to $0.53 per share, payable on June 11, 2026 to shareholders of record as of May 21, 2026. This marks nine consecutive years of dividend increases. Aankondiging • Feb 13
Applied Materials, Inc. Provides Earnings Guidance for the Second Quarter of Fiscal 2026 Applied Materials, Inc. provided earnings guidance for the second quarter of fiscal 2026. For the quarter, the company expects total net revenue of $7,650 million +/- $500 million. Aankondiging • Feb 11
Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips Applied Materials, Inc. introduced new deposition, etch and materials modification systems that boost the performance of logic chips at 2nm and beyond. The technologies supercharge AI compute through atomic-scale improvements to the most fundamental electronic building block - the transistor. The transition to Gate-All-Around (GAA) transistors is a major industry inflection and a critical enabler of the energy-efficient computing needed to deliver more powerful AI chips. As 2nm-class GAA chips ramp to volume production this year, Applied is introducing new material innovations to enhance next-generation GAA transistors for angstrom nodes. The combined impact of the new chipmaking systems contributes a significant portion of the total energy-efficient performance gains of GAA process node transitions. New Viva™? Radical Treatment System Enables Precision Engineering of GAA Transistor Nanosheets: At the heart of GAA transistors are horizontal stacks of current-carrying "nanosheets." Made of ultra-thin silicon just a few nanometers wide, the physical features of these nanosheets must be exceptionally well defined to ensure that each one acts as an efficient conducting path for charge carriers. The Viva system is being adopted by leading logic chipmakers for advanced channel engineering at 2nm and beyond process nodes. The new Viva system has additional applications across both logic and memory. When combined with the Applied Producer Pyra™? thermal annealing process, the supplemental radical treatment further reduces the resistance of conducting copper wires, promising to extend the use of copper in the lower metal layers of the most advanced nodes. These capabilities deliver far more defined ion contacts directly to the wafer surface. By pairing PVT2 with the system's new source technology, Sym3 Z Magnum produces clean, precise trenches that enable uniform nanosheets, faster switching, and higher-quality ion contacts - boosting transistor speed and overall chip performance. Beyond angstrom-class logic, Sym3 Z Magnum advances DRAM and high-bandwidth memory (HBM) technologies by delivering the precise profiles needed for denser arrays and taller stacks. Its broad applications drive rapid adoption among leading chipmakers and strengthen Applied's leadership in advanced etch. New Spectral™? ALD System Lowers Contact Resistance with Selective Deposition of Molybdenum: Delivering more powerful AI requires innovation beyond the transistor device. As scaling continues below 2nm, the tiny metal contacts that link each transistor to the wiring network become ever thinner, contributing significantly to the chip's total resistance and creating a bottleneck to performance and energy efficiency. An animation of the system's capabilities can be view ed here. A media kit with additional information on the Viva, Sym3 Z and Spectral systems is available on the Applied Materials website. Aankondiging • Jan 29
Applied Materials, Inc., Annual General Meeting, Mar 12, 2026 Applied Materials, Inc., Annual General Meeting, Mar 12, 2026. Location: 3333 scott boulevard, building 52, california 95054, santa clara United States Aankondiging • Jan 22
Applied Materials, Inc. to Report Q1, 2026 Results on Feb 12, 2026 Applied Materials, Inc. announced that they will report Q1, 2026 results at 4:00 PM, US Eastern Standard Time on Feb 12, 2026 Aankondiging • Dec 12
Applied Materials Approves Quarterly Cash Dividend, Payable on March 12, 2026 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.46 per share payable on the company’s common stock. The dividend is payable on March 12, 2026 to shareholders of record as of Feb. 19, 2026. Aankondiging • Oct 30
Applied Materials, Inc. to Report Q4, 2025 Results on Nov 13, 2025 Applied Materials, Inc. announced that they will report Q4, 2025 results at 4:00 PM, US Eastern Standard Time on Nov 13, 2025 Aankondiging • Oct 07
Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge AI Performance Applied Materials, Inc. introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. To optimize performance and power efficiency, today's leading GPUs and high-performance computing (HPC) chips use advanced packaging schemes to combine multiple chiplets into complex systems. Hybrid bonding is an emerging chip-stacking technology that uses direct copper-to-copper bonds, resulting in significant improvements in overall performance, power consumption and cost; Increasingly complex chip packages create challenges for hybrid bonding in high-volume manufacturing. To accelerate the use of hybrid bonding in advanced logic and memory chips, Applied Materials, in collaboration with BE Semiconductor Industries N.V. (Besi), developed the Kinex™? Bonding system - the industry's first integrated die-to-wafer hybrid bonder. The system brings together Applied's expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi's leading die placement, interconnect and assembly solutions. The Kinex system integrates all the critical hybrid bonding process steps into one system, offering several major advantages compared to non-integrated approaches: Better management of complex multi-die packages because of superior die-level tracing; Smaller interconnect pitches enabled by high-accuracy bonding and clean, controlled environment; Improved bonding consistency and quality through precise control over the queue time between hybrid bonding process steps; Faster overlay measurement and drift detection achieved by integrated, in-line metrology. The Kinex system is being used by multiple leading logic, memory and OSAT customers. Among the most critical features affecting the performance and reliability of today's GAA transistors are the source and drain structures, which form the transistor channel. The source and drain are created by precisely depositing materials in deep trenches using an epitaxial (epi) process. Filling the highpect ratio source/drain trenches of 3D GAA transistors using conventional epi is challenging and can lead tooids and uneven growth which reduces performance and reliability. Its unique capabilities support key process control tasks, such as EUV layer overlay and nanosheet measurement and epi void detection in GAA transistors, making it a critical tool for 2nm and beyond, as well as HBM integration. The PROVision 10 system is being used by many leading logic and memory chipmakers. A media kit with additional information on the Kinex, Xtera and PROVision 10 systems is available on the Applied Materials website. The new systems, along with other innovations for making future AI chips, will be discussed at Applied's SEMICON West 2025 Technology Breakfast. The presentation from the event will be available on the Applied Materials website at:::: The company is collaborating earlier and deeper with customers to co-develop solutions that accelerate chipmaker roadmaps and enable major device inflections in logic, memory and advanced packaging. Aankondiging • Sep 16
Applied Materials, Inc. Announces Resignation of Yvonne McGill from the Board of Directors, Effective September 12, 2025 Yvonne McGill resigned from the Board of Directors of Applied Materials, Inc., effective September 12, 2025. Ms. McGill's resignation is not due to any disagreement with the Company related to the company's operations, policies or practices. Aankondiging • Sep 12
Applied Materials, Inc. Announces Quarterly Cash Dividend, Payable on December 11, 2025 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.46 per share payable on the company’s common stock. The dividend is payable on December 11, 2025 to shareholders of record as of November 20, 2025. Aankondiging • Aug 15
Applied Materials, Inc. Provides Earnings Guidance for the Fiscal Year 2025 Applied Materials, Inc. provided earnings guidance for the fiscal year 2025. For the quarter, the company expects total revenue of $6,700 Million, plus or minus $500 million. Aankondiging • Jul 24
Applied Materials, Inc. to Report Q3, 2025 Results on Aug 14, 2025 Applied Materials, Inc. announced that they will report Q3, 2025 results at 4:00 PM, US Eastern Standard Time on Aug 14, 2025 Aankondiging • Jul 22
Applied Materials, Inc. Appoints Jim Anderson to its Board of Directors and Strategy and Investment Committee Applied Materials, Inc. on July 22, 2025, announced the appointment of Jim Anderson to serve on its board of directors. Mr. Anderson brings over 25 years of experience in the technology sector and semiconductor ecosystem. Mr. Anderson has also been appointed to the board’s Strategy and Investment Committee. Mr. Anderson has served as the Chief Executive Officer and a member of the Board of Directors of Coherent Corp., since June 2024. He previously served as a director and as President and Chief Executive Officer of Lattice Semiconductor Corporation since 2018. Prior to joining Lattice, Mr. Anderson was the Senior Vice President and General Manager of the Computing and Graphics Business Group at Advanced Micro Devices, Inc. Prior to that, he held a broad range of leadership positions spanning general management, engineering, sales, marketing and corporate strategy at companies including Intel, Broadcom (formerly Avago Technologies Limited) and LSI Corporation. Mr. Anderson sits on the Americas Executive Board for the MIT Sloan School of Management and the US-Japan Business Council. Mr. Anderson earned an MBA and Master of Science degree in electrical engineering and computer science from the Massachusetts Institute of Technology, a Master of Science degree in electrical engineering from Purdue University, and a bachelor’s degree in electrical engineering from the University of Minnesota. Aankondiging • Jun 28
Applied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell Top 50 Index Applied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell Top 50 Index Aankondiging • Jun 11
Applied Materials, Inc. Announces Quarterly Cash Dividend, Payable on September 11, 2025 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.46 per share payable on the company’s common stock. The dividend is payable on Sept. 11, 2025 to shareholders of record as of Aug. 21, 2025. Aankondiging • May 16
Applied Materials, Inc. Provides Earnings Guidance for the Third Quarter of Fiscal Year 2025 Applied Materials, Inc. provided earnings guidance for the third quarter of fiscal year 2025. For the quarter, the company expects total revenue of $7.2 billion, plus or minus $500 million, representing a 6% increase year-over-year at the midpoint. Aankondiging • Apr 25
Applied Materials, Inc. to Report Q2, 2025 Results on May 15, 2025 Applied Materials, Inc. announced that they will report Q2, 2025 results on May 15, 2025 Aankondiging • Mar 11
Applied Materials, Inc. (NasdaqGS:AMAT) announces an Equity Buyback for $10,000 million worth of its shares. Applied Materials, Inc. (NasdaqGS:AMAT) announces a share repurchase program. Under the program, the company will repurchase up to $10,000 million worth of its shares. Aankondiging • Mar 10
Applied Materials, Inc. Increases Quarterly Cash Dividend, Payable on June 12, 2025 Applied Materials, Inc. announced that its Board of Directors has approved a 15% increase in the quarterly cash dividend, marking eight consecutive years of higher dividends. The increase results in a quarterly dividend of $0.46 per share payable on June 12, 2025 to shareholders of record as of May 22, 2025. Aankondiging • Feb 21
Applied Materials, Inc. Introduces A New Defect Review System to Help Leading Semiconductor Manufacturers Continue Pushing the Limits of Chip Scaling Applied Materials, Inc. introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling. The company’s SEMVision™ H20 system combines the industry’s most sensitive electron beam (eBeam) technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects in the world’s most advanced chips. eBeam imaging has long been an important tool for examining defects that are too small to be seen with optical techniques. Its ultra-high resolution enables analysis of the tiniest imperfections in a sea of billions of nanoscale circuit patterns. Traditionally, optical techniques are used to scan a wafer for potential defects, and then eBeam is deployed to better characterize these defects. In the emerging “angstrom era” – where the smallest chip features can be just a few atoms thick – it is becoming increasingly difficult to differentiate true defects from false alarms. At today’s most advanced nodes, optical inspection creates much denser defect maps, which can require as much as a 100X increase in the number of defect candidates delivered to eBeam review. Process control engineers increasingly need defect review systems that can analyze exponentially more samples while maintaining the speed and sensitivity required for high-volume production. Applied’s new eBeam technology is critical for complex 3D architecture inflections required to manufacture logic chips at the 2nm node and beyond – including new Gate-All-Around (GAA) transistors – as well as the formation of higher-density DRAM and 3D NAND memories. Applied’s SEMVision H20 defect review system has been adopted by leading logic and memory chipmakers for emerging technology nodes. The new SEMVision H20 system leverages two significant innovations to classify defects with remarkable accuracy, while delivering results as much as 3X faster than today’s most advanced techniques. Next-generation CFE technology: Applied’s “cold field emission” (CFE) technology is a breakthrough in eBeam imaging that enables sub-nanometer resolution for identifying the smallest buried defects. Operating at room temperature, CFE produces a narrower beam with more electrons, thereby increasing nanoscale image resolution by up to 50% and imaging speed by up to 10X compared to conventional thermal field emission (TFE) technology. With SEMVision H20, Applied is introducing the second generation of its CFE technology, delivering even faster throughput while maintaining the industry’s highest sensitivity and resolution. This faster imaging speed provides increased coverage across each wafer, allowing chipmakers to gather the same amount of information in one third of the time. Deep learning AI image models: SEMVision H20 uses deep learning AI capabilities for automatic extraction of true defects from false “nuisance” defects. Applied’s proprietary deep learning network is continuously trained with data from a chipmaker’s fab and sorts the defects into a distribution including voids, residues, scratches, particles and dozens of other defect types, enabling more accurate and efficient defect characterization. Applied’s SEMVision product family is the most advanced and widely used eBeam review system in the world. The new SEMVision H20 extends this leadership by combining next-generation CFE technology and advanced AI models to deliver faster and more accurate defect analysis, allowing chipmakers to accelerate chip development and make greater use of eBeam technology in high-volume manufacturing. Aankondiging • Feb 14
Applied Materials, Inc. Provides Earnings Guidance for the Second Quarter of Fiscal Year 2025 Applied Materials, Inc. provided earnings guidance for the second quarter of fiscal year 2025. For the quarter, the company expects total net revenue to be in the range of $7,100 million, plus or minus $400 million. Aankondiging • Dec 13
Applied Materials, Inc. Approves Quarterly Cash Dividend, Payable on March 13, 2025 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.40 per share payable on the company’s common stock. The dividend is payable on March 13, 2025 to shareholders of record as of February 20, 2025. Aankondiging • Nov 21
Applied Materials, Inc. Introduces the MAX OLED Solution Applied Materials, Inc. introduced the MAX OLED™ solution, a patented OLED pixel architecture and revolutionary display manufacturing technology designed to bring the superior OLED displays found in high-end smartphones to tablets, PCs and eventually TVs. OLED is the display technology of choice for the world’s leading smartphone manufacturers because it offers superior display quality, light and flexible form factors, and durability. However, until now, it has proven challenging to scale OLED display manufacturing to the larger glass panels used to make displays for tablets, PCs and TVs. Applied’s MAX OLED solution makes it easier to scale OLED manufacturing from Gen 6 glass substrates to Gen 8 substrates, which are approximately two times larger, and beyond. In addition, the MAX OLED solution deposits OLED materials in a new way that increases pixel brightness and resolution, reduces display energy consumption, and lengthens display lifetime. The MAX OLED solution has strong customer interest, with repeat orders from multiple leading display manufacturers. Additionally, Applied will supply a MAX OLED solution to Samsung Display, a leading global manufacturer of OLED and QD-OLED panels. Samsung Display will be bringing in an alpha system to assess this new technology. Making OLED Displays Brighter, Longer-Lasting and More Energy-Efficient: OLED displays are difficult to manufacture because the materials used to emit red, green and blue are fragile and ruined by any exposure to air or moisture. Applied’s MAX OLED solution is a breakthrough technology that deposits and encapsulates each pixel individually using a specially designed maskless process. Applied’s approach is precise, fast and superior at maintaining the purity of delicate OLED materials. Applied’s proprietary solution uses selective deposition to enable excellent pixel placement accuracy, more than doubling the amount of OLED material per area as compared to previous technologies. The technology can increase OLED display brightness by as much as 3X and increase resolution by as much as 2.5X, to approximately 2,000 pixels per square inch. The solution can also reduce display power consumption by more than 30% and increase display lifetime by up to 5X. New OLED Pixel Architecture, Process Recipe and Integrated Materials Solution: The MAX OLED solution is more than equipment: it begins with a proprietary pixel architecture built using a patented manufacturing recipe that results in best-in-class OLED pixels and displays. The manufacturing system combines a number of critical manufacturing modules in a single, high-vacuum system that protects the delicate OLED materials from the environment and reduces yield-killing particles. The MAX OLED system integrates display glass handling, multiple OLED deposition steps, and OLED encapsulation. Many of the core technologies used by the MAX OLED solution have already been proven by Applied in making large-area LCD screens at panel sizes up to Gen 10.5. The MAX OLED solution reduces the energy consumption of OLED display fabs, requires significantly less OLED materials, and eliminates the need for mask cleaning chemicals, thereby reducing the environmental impact of display manufacturing. A Growing OLED Display Opportunity: Applied is already the world’s largest provider of display manufacturing equipment, with a broad portfolio of products spanning CVD and PVD deposition, CVD thin-film encapsulation, and eBeam testing and inspection. The MAX OLED solution is expected to more than double Applied’s served addressable market opportunity in OLED display manufacturing. Aankondiging • Nov 19
Applied Materials, Inc. Announces New Collaboration Model for Advanced Packaging At Summit on Energy-Efficient Computing Applied Materials, Inc. announced plans to expand its global EPIC innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiative, Applied convened more than two dozen top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies and research institutes. The goal is to fast-track new technologies for the next generation of energy-efficient computing. Applied hosted the summit in Singapore, where the company has been collaborating on advanced packaging R&D with its customers and partners for over a decade. The dramatic rise in the number of connected devices and the emergence of AI are creating tremendous growth opportunities for the chip industry. At the same time, the industry is confronting several challenges, foremost of which is the exponential increase in energy consumption fueled by the intense compute power required to support the growth of AI. In response, chipmakers and system designers are increasingly turning to advanced packaging and heterogeneous integration of multiple chips as a way to achieve more energy-efficient system performance. Today’s most capable AI chips are enabled by multiple advanced packaging technologies, such as micro-bumps, through-silicon vias (TSVs) and silicon interposers. To tap the true potential of AI, the industry is developing a new set of packaging building blocks to dramatically increase the interconnect density and bandwidth of next-generation systems. The need to develop multiple technologies simultaneously – combined with a faster cadence of product introductions – creates challenges for system designers, who must navigate a complex array of solution paths and packaging architectures. This increased complexity adds additional risk, time and cost to chipmaker roadmaps. There is a clear need for increased collaboration across this complicated ecosystem, as well as earlier engagement with all parts of the value chain. Applied’s strategy with EPIC Advanced Packaging is to address this need by driving co-innovation and changing the way foundational packaging technologies are developed and commercialized. Leveraging a global network of innovation centers, the strategy aims to give leading chipmakers and system designers early access to next-generation technologies and equipment, while also providing an opportunity for deep collaboration with suppliers and university partners to strengthen the lab-to-fab pipeline and develop future semiconductor talent. Aankondiging • Nov 15
Applied Materials, Inc. Provides Earnings Guidance for the First Quarter of Fiscal 2025 Applied Materials, Inc. provided earnings guidance for the first quarter of fiscal 2025. For the period, the company expects net revenue to be approximately $7.15 billion, plus or minus $400 million. Aankondiging • Sep 13
Applied Materials, Inc. Approves Quarterly Cash Dividend, Payable on Dec. 12, 2024 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.40 per share payable on the company’s common stock. The dividend is payable on Dec. 12, 2024 to shareholders of record as of Nov. 21, 2024. Aankondiging • Sep 04
Applied Materials, Inc. Announces Management Changes Applied Materials, Inc. announced Florent Ducrot, Vice President and General Manager, to serve as the Head of European Operations. Mr. Ducrot has more than three decades of experience in the semiconductor industry, spanning marketing, service and business development. During his 21 years at Applied Materials, he has led initiatives which contributed to significant growth of the company's services business. Mr. Ducrot succeeds James Robson who is retiring after more than 35 years at Applied. Mr. Ducrot's previous role at Applied was Vice President of Business Development for Applied Global Services, where he was instrumental in the strong growth of the business by developing, defining and supporting innovative services to help customers accelerate the ramp of new technologies to high-volume production, improve yield and optimize costs. Also during his time at Applied, Mr. Ducrot held leadership positions in service marketing for 200mm equipment, regional sales for services in Europe, and he served as Country President for Applied Materials in France. Mr. Ducrot holds a technical and sales degree from Orleans University. Aankondiging • Aug 16
Applied Materials, Inc. Provides Revenue Guidance for Fourth Quarter of Fiscal 2024 Applied Materials, Inc. provided revenue guidance for fourth quarter of fiscal 2024. In the quarter, the company expects net revenue to be approximately $6.93 billion, plus or minus $400 million. Aankondiging • Jul 08
Applied Materials, Inc. Unveils Chip Wiring Innovations for More Energy-Efficient Computing Applied Materials, Inc. introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond. Applied Materials introduced an enhanced version of Black Diamond, the latest in the company's Producer™? Black Diamond™? PECVD™? family. This new material reduces the minimum k-value to enable scaling to 2nm and below, while offering increased mechanical strength which is becoming critical as chipmakers and systems companies take 3D logic and memory stacking to new heights. The latest Black Diamond technology is being adopted by all leading logic and DRAM chipmakers. To scale chip wiring, chipmakers etch each layer of low-k film to create trenches, then deposit a barrier layer that prevents copper from migrating into the chip and creating yield issues. As chipmakers further scale the wiring, the barrier and liner take up a larger percentage of the volume intended for wiring, and it becomes physically impossible to create low-resistance, void-free copper wiring in the remaining space. Applied Materials publicly introduced its latest IMS™? (Integrated Materials Solution™?) which combines six different technologies in one high-vacuum system, including an industry-first combination of materials that enables chipmakers to scale copper wiring to the 2nm node and beyond. The solution is a binary metal combination of ruthenium and cobalt (RuCo), which simultaneously reduces the thickness of the liner by 33% to 2nm, produces better surface properties for void-free copper reflow, and reduces electrical line resistance by up to 25% to improve chip performance and power consumption. Looking ahead, the introduction of backside power delivery is expected to increase Applied's wiring opportunity by another $1 billion per 100K WSPM, to approximately $7 billion. The new chip wiring products, along with other materials engineering innovations for making future AI chips, will be discussed at Applied's SEMICON West 2024 Technology Breakfast. The presentation and other materials from the event will be available on the Applied Materials website at: <URL> on July 9, 2024 at approximately 9:00 a.m. ET /6:00 a.m. PT. PECVD = Plasma-Enhanced Chemical Vapor Deposition;CVD = Chemical Vapor Deposition. Aankondiging • Jun 15
Applied Materials, Inc. Approves Quarterly Cash Dividend, Payable on September 12, 2024 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.40 per share payable on the company’s common stock. The dividend is payable on September 12, 2024 to shareholders of record as of August 22, 2024. Reported Earnings • May 17
Second quarter 2024 earnings released: EPS: US$2.08 (vs US$1.87 in 2Q 2023) Second quarter 2024 results: EPS: US$2.08 (up from US$1.87 in 2Q 2023). Revenue: US$6.65b (flat on 2Q 2023). Net income: US$1.72b (up 9.3% from 2Q 2023). Profit margin: 26% (up from 24% in 2Q 2023). Revenue is forecast to grow 8.0% p.a. on average during the next 3 years, compared to a 18% growth forecast for the Semiconductor industry in the United Kingdom. Aankondiging • May 17
Applied Materials, Inc. Provides Earnings Guidance for the Third Quarter of Fiscal 2024 Applied Materials, Inc. provided earnings guidance for the third quarter of fiscal 2024. For the quarter, the company expects revenue to be approximately $6.65 billion, plus or minus $400 million. Upcoming Dividend • May 15
Upcoming dividend of US$0.40 per share Eligible shareholders must have bought the stock before 22 May 2024. Payment date: 13 June 2024. Payout ratio is a comfortable 15% and this is well supported by cash flows. Trailing yield: 0.8%. Lower than top quartile of British dividend payers (5.7%). In line with average of industry peers (0.8%). Declared Dividend • Apr 08
First quarter dividend of US$0.40 announced Shareholders will receive a dividend of US$0.40. Ex-date: 22nd May 2024 Payment date: 13th June 2024 Dividend yield will be 0.7%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 15%. Cash payout ratio: 17%. Board Change • Apr 08
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 6 experienced directors. 6 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Declared Dividend • Mar 14
Dividend of US$0.40 announced Shareholders will receive a dividend of US$0.40. Ex-date: 22nd May 2024 Payment date: 13th June 2024 Dividend yield will be 0.7%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 15%. Cash payout ratio: 14%. Aankondiging • Mar 11
Applied Materials Announces Cash Dividend, Payable on June 13, 2024 Applied Materials, Inc. announced that its Board of Directors has approved a 25% increase in the quarterly cash dividend from $0.32 to $0.40 per share. The dividend is payable on June 13, 2024 to shareholders of record as of May 23, 2024. Board Change • Mar 08
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 6 experienced directors. 6 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Aankondiging • Mar 01
Applied Materials, Inc. Announces Executive Changes, Effective March 4, 2024 Applied Materials, Inc. appointed Adam Sanders as the company’s Vice President, Corporate Controller and Chief Accounting Officer (Chief Accounting Officer), effective March 4, 2024 (the Effective Date). Mr. Sanders will serve as the company’s principal accounting officer, effective as of the Effective Date, succeeding Charles Read, who has served as the company’s interim principal accounting officer since December 2023. Mr. Sanders, age 52, is currently a Semiconductor Segment Group CFO of the Company, a position he has held since June 2023. Prior to that role, Mr. Sanders served as the Company’s Global Accounting Controller from 2016 to June 2023. Mr. Sanders previously served in various Finance roles of increasing responsibility since joining Applied in 1999, including as Finance Controller for the Europe, Middle East and Africa region. Aankondiging • Feb 16
Applied Materials, Inc. Provides Earnings Guidance for the Second Quarter of Fiscal 2024 Applied Materials, Inc. provided earnings guidance for the second quarter of fiscal 2024. For the quarter, the company expected net revenue to be approximately $6.50 billion, plus or minus $400 million. Aankondiging • Jan 25
Applied Materials, Inc., Annual General Meeting, Mar 07, 2024 Applied Materials, Inc., Annual General Meeting, Mar 07, 2024, at 10:00 Central Standard Time. Location: offices at 9700 US 290 East, Building 37, Austin, Texas 78724 Austin Texas United States Agenda: To elect ten directors to serve for a one-year term and until their successors have been duly elected and qualified; to approve, on an advisory basis, the compensation of named executive officers for fiscal year 2023; to ratify the appointment of KPMG LLP as our independent registered public accounting firm for fiscal year 2024; to consider two shareholder proposals, if properly presented at the Annual Meeting; and to consider other business matters. Board Change • Jan 02
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 6 experienced directors. 6 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Reported Earnings • Dec 21
Full year 2023 earnings released: EPS: US$8.16 (vs US$7.49 in FY 2022) Full year 2023 results: EPS: US$8.16 (up from US$7.49 in FY 2022). Revenue: US$26.5b (up 2.8% from FY 2022). Net income: US$6.86b (up 5.1% from FY 2022). Profit margin: 26% (in line with FY 2022). Revenue is forecast to grow 5.0% p.a. on average during the next 3 years, compared to a 19% growth forecast for the Semiconductor industry in the United Kingdom. Aankondiging • Dec 13
Applied Materials, Inc. Announces Principal Accounting Officer Changes On December 11, 2023, Jeff Bodner, the principal accounting officer of Applied Materials, Inc. departed the Company. Mr. Bodner’s departure is not the result of any disagreement with the Company relating to the Company’s financial controls, financial statements, operations, policies, or practices. Charles Read will serve as the Company’s interim principal accounting officer, effective immediately. Mr. Read will continue to serve as Applied’s Corporate Vice President, Business Units and Operations CFO, a position he has held since September 2022. Prior to that role, Mr. Read, age 57, was Corporate Vice President, Corporate Controller and Chief Accounting Officer of Applied since joining the Company in September 2013. Prior to Applied, Mr. Read worked at Brocade Communications Systems, Inc., a provider of semiconductor and software-based network solutions, since October 2002, where he most recently served as Vice President, Corporate Controller. Prior to Brocade, Mr. Read worked at KPMG LLP, an audit, tax and advisory firm, from 1996 to 2002. Board Change • Dec 04
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 6 experienced directors. 6 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Reported Earnings • Nov 18
Full year 2023 earnings released: EPS: US$8.16 (vs US$7.49 in FY 2022) Full year 2023 results: EPS: US$8.16 (up from US$7.49 in FY 2022). Revenue: US$26.5b (up 2.8% from FY 2022). Net income: US$6.86b (up 5.1% from FY 2022). Profit margin: 26% (in line with FY 2022). Revenue is forecast to grow 4.6% p.a. on average during the next 3 years, compared to a 20% growth forecast for the Semiconductor industry in the United Kingdom. Aankondiging • Nov 17
Applied Materials, Inc. Provides Sales Guidance for the First Quarter of Fiscal 2024 Applied Materials, Inc. provided sales guidance for the first quarter of fiscal 2024. In the first quarter of fiscal 2024, the company expects net sales to be approximately $6.47 billion, plus or minus $400 million. Upcoming Dividend • Nov 15
Upcoming dividend of US$0.32 per share at 0.8% yield Eligible shareholders must have bought the stock before 22 November 2023. Payment date: 14 December 2023. Payout ratio is a comfortable 15% and this is well supported by cash flows. Trailing yield: 0.8%. Lower than top quartile of British dividend payers (6.4%). Lower than average of industry peers (1.0%). Board Change • Oct 13
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 7 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Board Change • Sep 15
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 7 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Aankondiging • Sep 08
Applied Materials, Inc. Announces Quarterly Cash Dividend, Payable on December 14, 2023 Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.32 per share payable on the company’s common stock. The dividend is payable on December 14, 2023 to shareholders of record as of November 24, 2023. Aankondiging • Aug 18
Applied Materials, Inc. Provides Earnings Guidance for the Fourth Quarter of Fiscal 2023 Applied Materials, Inc. provided earnings guidance for the fourth quarter of fiscal 2023. For the fourth quarter of fiscal 2023, the company expects net sales to be approximately $6.51 billion, plus or minus $400 million. Board Change • Jul 31
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 7 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Recent Insider Transactions • Jul 14
Senior VP recently sold €1.3m worth of stock On the 7th of July, Teri Little sold around 10k shares on-market at roughly €130 per share. This transaction amounted to 40% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of €6.5m more than they bought in the last 12 months. Aankondiging • Jul 12
Applied Materials, Inc dvances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias Applied Materials, Inc. introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied's breadth of technologies for heterogeneous integration (HI). HI helps semiconductor companies combine chiplets based on a variety of functions, technology nodes and sizes in advanced packages, enabling the combination to perform as a single product. HI helps solve industry challenges created in part because the need for transistors in applications like high-performance computing and artificial intelligence continues to increase at an exponential rate, while the ability to shrink transistors with classic 2D scaling is slowing and becoming more expensive. HI is a core component of a new playbook that enables chipmakers to improve chip performance, power, area-cost and time to market (PPACt) in new ways. Applied is the largest supplier of technologies for HI with optimized chipmaking systems spanning etch, physical vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, chemical mechanical polishing (CMP), an annealing and surface treatments. Chip-to-wafer and wafer-to-wafer hybrid bonding can be used to connect chips using direct, copper-to-copper bonds that enable the combined elements to perform as one. Hybrid bonding is the industry's most advanced HI technology in production, improving throughput and power by packing more wiring into smaller spaces and reducing the distances signals need to travel. Introduced: The Insepra SiCN deposition system expands Applied's hybrid bonding product portfolio. The system uses a new silicon carbon nitride (SiCN) material that delivers the highest dielectric bonding strength in the industry and offers superior copper diffusion barrier properties. The stronger dielectric bonding strength give designers the structural stability needed to integrate far more copper-to-copper interconnects a given area, which lowers power consumption and increases device performance. The Catalyst™ CMP solution helps customers control the amount of “dishing,” the intentional recessing of copper material on two surfaces that will be bonded in a subsequent high-temperature annealing step. CMP dishing can create unwanted metal loss at the top surfaces of the copper pads, which can cause air gaps that decrease the fidelity and strength of the copper-to-copper bonds. Applied’s Catalyst solution is a dynamic temperature control technique that reduces dishing and increases throughput. Bringing Through-Silicon Vias to New Heights Used in high-volume manufacturing for more than a decade, TSVs are vertical wires used to precisely connect stacked chips. They are formed by etching trenches into silicon and then filling them with insulating liners and metal wires. As designers continue to integrate more logic, memory and specialty chips into advanced 2.5D and 3D packages, the number of TSV interconnects has expanded from a few hundred per package to thousands. To integrate more interconnects and accommodate taller stacks of chips, designers need the vias to become increasingly narrow and tall, which results in deposition uniformity variations that degrade performance and increase resistance and power consumption. Applied introduced new technologies for both dielectric and metal deposition that enable higher-aspect-ratio TSVs and help chipmakers achieve their integration, performance and power goals: The Producer® InVia® 2 CVD System is a new CVD process that makes dielectric liners uniform and electrically robust at the extreme aspect ratios needed by logic and memory customers in a growing variety of TSV applications. The InVia 2 system uses a propriety in-situ deposition process which enables excellent conformality for high-aspect-ratio TSVs. The system also offers higher throughput than ALD technologies, thereby reducing the per-wafer cost of TSV to help further expand its adoption. The Endura®Ventura® 2 PVD System extends its widely adopted predecessor to TSV applications with aspect ratios of up to 20:1. The Ventura 2 system increases the control of metal TSV wire deposition to ensure a complete fill that delivers high electrical performance and reliability. The new TSV PVD process has been co-optimized for use with the Producer® InVia® 2 CVD process, giving customers a ready solution to their most challenging TSV designs. The Ventura 2 system is being deployed by all advanced foundry/logic chipmakers and all major DRAM producers. The latest generation of Applied’s Producer® Avila® PECVD System is designed for TSV “reveal” applications. In the TSV process flow, wafers are bonded to temporary glass or silicon carriers and then thinned using CMP and etching to make the TSVs accessible. Following the TSV reveal steps, plasma-enhanced CVD technology is used to deposit a thin dielectric layer that electrically isolates the TSVs from each other. If the PECVD process generates heat above approximately 200o C, the delicate temporary bonding adhesive can be damaged, resulting in costly wafer yield loss. Applied’s Producer Avila PECVD system creates high-quality dielectric films at ultra-low temperatures and at high speed, meeting the low thermal budgets and high productivity required for TSV quality and cost. Board Change • Jul 07
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 7 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Reported Earnings • Jun 01
Second quarter 2023 earnings released: EPS: US$1.87 (vs US$1.75 in 2Q 2022) Second quarter 2023 results: EPS: US$1.87 (up from US$1.75 in 2Q 2022). Revenue: US$6.63b (up 6.2% from 2Q 2022). Net income: US$1.58b (up 2.5% from 2Q 2022). Profit margin: 24% (in line with 2Q 2022). Revenue is forecast to grow 4.2% p.a. on average during the next 3 years, compared to a 24% growth forecast for the Semiconductor industry in the United Kingdom. Board Change • May 30
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 7 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Aankondiging • May 19
Applied Materials, Inc. Provides Revenue Guidance for the Third Quarter of Fiscal 2023 Applied Materials, Inc. provided revenue guidance for the third quarter of fiscal 2023. In the third quarter of fiscal 2023, Applied expects net sales to be approximately $6.15 billion, plus or minus $400 million. Board Change • May 04
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 7 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Recent Insider Transactions • Mar 25
Senior VP recently sold €3.4m worth of stock On the 20th of March, Omkaram Nalamasu sold around 29k shares on-market at roughly €116 per share. This transaction amounted to 20% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of €6.3m more than they bought in the last 12 months. Board Change • Mar 14
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 6 experienced directors. 5 highly experienced directors. Member of the Growth Technical Advisory Board Stephen Forrest was the last director to join the board, commencing their role in 2020. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. Aankondiging • Jan 26
Applied Materials, Inc., Annual General Meeting, Mar 09, 2023 Applied Materials, Inc., Annual General Meeting, Mar 09, 2023, at 11:00 Pacific Standard Time. Location: Applied Materials, Inc., 3050 Bowers Avenue, Building 1 Santa Clara, California 95054 Santa Clara California United States Agenda: To consider financial results for the fourth quarter and fiscal year 2022; to consider approve, on an advisory basis, the compensation of our named executive officers for fiscal year 2022; to consider ratify the appointment of KPMG LLP as our independent registered public accounting firm for fiscal year 2023; to consider approve, on an advisory basis, the frequency of holding an advisory vote on executive compensation; to consider two shareholder proposals, if properly presented at the Annual Meeting; and to consider transact any other business that may properly come before the Annual Meeting or any adjournment or postponement of the Annual Meeting. 
