공시 • Mar 24
AEM Holdings Ltd. announced that it expects to receive SGD 12.02985 million in funding from ASE Technology Holding Co., Ltd. AEM Holdings Ltd. announced a private placement to issue 3,350,000 shares at an issue price of SGD 3.591 per share for gross proceeds of SGD 12,029,850 on March 23, 2026. The transaction will include participation from new investor ASE Technology Holding Co., Ltd. The company also issued warrants 28,111,856 million free detachable warrants, divided equally into two exercisable tranches, with each tranche subject to certain ASE-attributable revenue-related conditions. Each warrant is exercisable into one ordinary share, with the Tranche 1 exercise price set at 103% of the volume weighted average price (“VWAP”) of AEM’s shares for the full market day on which the subscription agreement is signed, and the Tranche 2 exercise price set at 105% of such VWAP. 공시 • Feb 27
AEM Holdings Ltd. announces Annual dividend, payable on May 22, 2026 AEM Holdings Ltd. announced Annual dividend of SGD 0.0130 per share payable on May 22, 2026, ex-date on May 07, 2026 and record date on May 08, 2026. 공시 • Feb 26
AEM Holdings Ltd., Annual General Meeting, Apr 28, 2026 AEM Holdings Ltd., Annual General Meeting, Apr 28, 2026. 공시 • Apr 07
AEM Holdings Ltd., Annual General Meeting, Apr 23, 2025 AEM Holdings Ltd., Annual General Meeting, Apr 23, 2025, at 15:00 Singapore Standard Time. Location: the singpost auditorium, singapore post centre, 10 eunos road 8, 05-30, singapore 408600, Singapore 공시 • Jan 03
AEM Holdings Ltd. Appoints Kwek You-Cheer as Chief Financial Officer The Board of Directors of AEM Holdings Ltd, having reviewed and considered the experience and knowledge that Mr. Kwek You-Cheer, age 48, has and believes that he will be able to contribute effectively to AEM. Role And Responsibilities: Executive - overall management of the Group's financial and investor relation matters. Job Title: Chief Financial Officer. Effective January 2, 2025. Mr. Kwek has over 20 years' experience in strategic financial leadership and operations internationally, which positions him well to guide AEM's financial strategy and drive operational efficiency across the Group. Working Experience: 2018 to present Chief Financial Officer, Asia Pacific, Infrastructure Solutions Business and Director, Lenovo Enterprise Solutions (Singapore) Pte Ltd. 2016 to 2018 Chief Financial Officer, Microsoft Hong Kong Limited 2003 to 2016 Schneider Electric: - 2015 to 2016: Director, Finance & Control for Asia Pacific Solutions Execution Center, Schneider Electric Asia Pacific Limited - 2012 to 2015: Chief Financial Officer, Schneider Electric Hong Kong Limited. Other DirectorShips Past: Lenovo Enterprise Solutions (Private) Limited. Other DirectorShips Present: C-Infinity Pte Ltd. Professional Qualifications: Bachelor of Accountancy, Nanyang Technological University - Member of The Institute of Singapore Chartered Accountants. 공시 • Nov 22
AEM Holdings Ltd. Announces Resignation of Oei Jun Long as Joint Company Secretary AEM Holdings Ltd. announced the resignation of Mr. Oei Jun Long as Joint Company Secretary of the Company with effect from 22 November 2024. The Board wishes to take this opportunity to thank Mr. Oei Jun Long for his services to the Company during his term of office. Consequent upon the aforesaid change, Mr. Cho Form Po will remain as the Company Secretary of the Company. 공시 • Jul 10
AEM Holdings Ltd. Introduces the New Generation of Automated Burn-In Systems for AI and High Performance Compute Chip Testing AEM Holdings Ltd. announced the launch of a new burn-in capability for its high-parallel test platform, AMPS. The new variant, named AMPS-BI, is a high-power, high-throughput, fully automated burn-in system featuring patented advanced multi-zone Intelligent Thermal Control. AMPS-BI is designed to efficiently perform accelerated high voltage stress testing on advanced semiconductor devices such as AI processors and high-performance computing units. High voltage stress testing is critical to ensure the reliability of AI chips and other semiconductor devices. It exposes devices under test to extended periods of operation under stressful conditions to detect potential failures or defects before reaching the end consumer. As AI processors and high-performance compute devices are manufactured with rocess technology nodes and advanced heterogeneous packages with chiplets, the overall cost of test to provide the quality of the final package is increasing significantly. AMPS-BI leverages AEM's decades of experience in automation, thermal management, and application-specific test instruments to offer customers a scalable solution that reduces test times while increasing overall test coverage, delivering a cost-of-test advantage for its users. AEM's AMPS-BI delivers: Fully automated modular system - Capable of simultaneous high voltage stress testing of hundreds of devices in parallel. Patented Multi-zone Intelligent Thermal Control (ITC). Scalable to >2KW per device, with precision control for thermal stability during test. Application-specific test instruments - Optimized for customer requirements to ensure optimal yield. Individual device test control and instrumentation allow for asynchronous operation, pattern changing on the fly, and high system utilization. Support for device-specific change kits and consumables, including burn-in boards and sockets. Support for advanced package formats, scalable beyond 100mm x 100mm package sizes. Upgradable for System Level Test, tri-temperature, and higher throughput. Fully supports JEDEC-based I/O with full Factory 4.0 automation support. 
