공고 • Jul 28
Synopsys Introduces Autonomous Agentic AI EDA Workflows For Chip Design in Collaboration with Microsoft And AMD Synopsys, Inc. announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. Synopsys is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle. Synopsys is introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design. This includes Synopsys fully-autonomous debug closure workflow: a fully autonomous AI-powered verification and root cause analysis (RCA) workflow orchestrated with Microsoft Discovery, brings together domain-specific and task-level agents to identify design failures, automate debug tasks, and accelerate validation—helping engineering teams resolve issues faster and improve silicon quality. Early evaluations show reductions of 25–40% in debug cycle time, saving many weeks of engineering efforts and improving productivity. Synopsys fully-autonomous implementation and closure workflow: an autonomous workflow leveraging Synopsys implementation agents and Fusion Compiler on Azure brings together domain-specific and task-level agents to automate implementation quality-of-results (QoR) tuning and closure. Initial results demonstrate improved QoR. Synopsys, AMD, and Microsoft are enabling AI-powered design workflows that combine large-scale reasoning, domain expertise, and cloud-scale compute to accelerate the development of the next generation of AI infrastructure silicon. This milestone builds on the existing collaboration and previously announced agentic specification to RTL workflow, marking the first EDA applications available for evaluation on Microsoft Discovery. AMD is actively evaluating the application of autonomous workflows to accelerate the development of their next-generation products. 공고 • Jul 23
Synopsys, Inc. to Report Q3, 2026 Results on Aug 26, 2026 Synopsys, Inc. announced that they will report Q3, 2026 results on Aug 26, 2026 공고 • Jun 19
Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions Synopsys, Inc. announced availability of its first Multiphysics Fusion solutions for customer deployment. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. The first Multiphysics Fusion solutions include targeted GPU-accelerated flows powered by NVIDIA CUDA-X libraries such as cuDSS. Multiphysics Fusion for Timing Signoff enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis. Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with unified full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to incorporate IR, thermal, and stress effects, improving margins and reducing IR-induced timing escapes. Multiphysics Fusion for Design Closure delivers up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA). Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization, accelerating convergence with fewer iterations. Multiphysics Fusion for Multi-die Designs provides unified Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis, providing early system insights from exploration to golden signoff with correct-by-construction design. Multiphysics Fusion for Analog & Photonic Design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip, high accuracy electromagnetic analysis into the analog design flow, and Synopsys OptoCompiler with Lumerical enabling end-to-end photonic IC and co-packaged optics systems. Early engagements with semiconductor and systems companies validate the value of Multiphysics Fusion solutions. Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs. Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. The Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available.