View Financial HealthSynopsys 배당 및 자사주 매입배당 기준 점검 0/6Synopsys 배당금을 지급한 기록이 없습니다.핵심 정보n/a배당 수익률-2.2%자사주 매입 수익률총 주주 수익률-2.2%미래 배당 수익률0%배당 성장률n/a다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향n/a최근 배당 및 자사주 매입 업데이트업데이트 없음모든 업데이트 보기Recent updates공고 • Jul 28Synopsys Introduces Autonomous Agentic AI EDA Workflows For Chip Design in Collaboration with Microsoft And AMDSynopsys, Inc. announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. Synopsys is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle. Synopsys is introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design. This includes Synopsys fully-autonomous debug closure workflow: a fully autonomous AI-powered verification and root cause analysis (RCA) workflow orchestrated with Microsoft Discovery, brings together domain-specific and task-level agents to identify design failures, automate debug tasks, and accelerate validation—helping engineering teams resolve issues faster and improve silicon quality. Early evaluations show reductions of 25–40% in debug cycle time, saving many weeks of engineering efforts and improving productivity. Synopsys fully-autonomous implementation and closure workflow: an autonomous workflow leveraging Synopsys implementation agents and Fusion Compiler on Azure brings together domain-specific and task-level agents to automate implementation quality-of-results (QoR) tuning and closure. Initial results demonstrate improved QoR. Synopsys, AMD, and Microsoft are enabling AI-powered design workflows that combine large-scale reasoning, domain expertise, and cloud-scale compute to accelerate the development of the next generation of AI infrastructure silicon. This milestone builds on the existing collaboration and previously announced agentic specification to RTL workflow, marking the first EDA applications available for evaluation on Microsoft Discovery. AMD is actively evaluating the application of autonomous workflows to accelerate the development of their next-generation products.공고 • Jul 23Synopsys, Inc. to Report Q3, 2026 Results on Aug 26, 2026Synopsys, Inc. announced that they will report Q3, 2026 results on Aug 26, 2026공고 • Jun 29+ 6 more updatesSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth BenchmarkSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth Benchmark공고 • Jun 19Synopsys Announces Availability of the First Wave of Multiphysics Fusion SolutionsSynopsys, Inc. announced availability of its first Multiphysics Fusion solutions for customer deployment. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. The first Multiphysics Fusion solutions include targeted GPU-accelerated flows powered by NVIDIA CUDA-X libraries such as cuDSS. Multiphysics Fusion for Timing Signoff enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis. Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with unified full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to incorporate IR, thermal, and stress effects, improving margins and reducing IR-induced timing escapes. Multiphysics Fusion for Design Closure delivers up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA). Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization, accelerating convergence with fewer iterations. Multiphysics Fusion for Multi-die Designs provides unified Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis, providing early system insights from exploration to golden signoff with correct-by-construction design. Multiphysics Fusion for Analog & Photonic Design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip, high accuracy electromagnetic analysis into the analog design flow, and Synopsys OptoCompiler with Lumerical enabling end-to-end photonic IC and co-packaged optics systems. Early engagements with semiconductor and systems companies validate the value of Multiphysics Fusion solutions. Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs. Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. The Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: 과거에 SYNP23 의 주당 배당금이 안정적이었는지 판단하기에는 데이터가 부족합니다.배당금 증가: SYNP23 의 배당금 지급이 증가했는지 판단하기에는 데이터가 부족합니다.배당 수익률 vs 시장Synopsys 배당 수익률 vs 시장SYNP23의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (SYNP23)n/a시장 하위 25% (TH)3.1%시장 상위 25% (TH)7.1%업계 평균 (Software)1.2%분석가 예측 (SYNP23) (최대 3년)0%주목할만한 배당금: 회사가 최근 지급을 보고하지 않았기 때문에 하위 25%의 배당금 지급자에 대해 SYNP23 의 배당 수익률을 평가할 수 없습니다.고배당: 회사가 최근 지급을 보고하지 않았기 때문에 배당금 지급자의 상위 25%에 대해 SYNP23 의 배당 수익률을 평가할 수 없습니다.주주 대상 이익 배당수익 보장: 배당금 지급이 수익으로 충당되는지 확인하기 위해 SYNP23 의 지급 비율을 계산하기에는 데이터가 부족합니다.주주 현금 배당현금 흐름 범위: SYNP23 에서 지급을 보고하지 않았기 때문에 배당 지속 가능성을 계산할 수 없습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YTH 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/08/02 22:07종가2026/07/31 00:00수익2026/04/30연간 수익2025/10/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델의 세부 정보는 당사의 GitHub 페이지에서 확인하실 수 있습니다. 또한 보고서 사용 방법에 대한 가이드와 YouTube 튜토리얼도 제공하고 있습니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Synopsys, Inc.는 33명의 분석가가 다루고 있습니다. 이 중 24명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Joseph VruwinkBairdGary MobleyBenchmark CompanyNay Soe NaingBerenberg30명의 분석가 더 보기
공고 • Jul 28Synopsys Introduces Autonomous Agentic AI EDA Workflows For Chip Design in Collaboration with Microsoft And AMDSynopsys, Inc. announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. Synopsys is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle. Synopsys is introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design. This includes Synopsys fully-autonomous debug closure workflow: a fully autonomous AI-powered verification and root cause analysis (RCA) workflow orchestrated with Microsoft Discovery, brings together domain-specific and task-level agents to identify design failures, automate debug tasks, and accelerate validation—helping engineering teams resolve issues faster and improve silicon quality. Early evaluations show reductions of 25–40% in debug cycle time, saving many weeks of engineering efforts and improving productivity. Synopsys fully-autonomous implementation and closure workflow: an autonomous workflow leveraging Synopsys implementation agents and Fusion Compiler on Azure brings together domain-specific and task-level agents to automate implementation quality-of-results (QoR) tuning and closure. Initial results demonstrate improved QoR. Synopsys, AMD, and Microsoft are enabling AI-powered design workflows that combine large-scale reasoning, domain expertise, and cloud-scale compute to accelerate the development of the next generation of AI infrastructure silicon. This milestone builds on the existing collaboration and previously announced agentic specification to RTL workflow, marking the first EDA applications available for evaluation on Microsoft Discovery. AMD is actively evaluating the application of autonomous workflows to accelerate the development of their next-generation products.
공고 • Jul 23Synopsys, Inc. to Report Q3, 2026 Results on Aug 26, 2026Synopsys, Inc. announced that they will report Q3, 2026 results on Aug 26, 2026
공고 • Jun 29+ 6 more updatesSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth BenchmarkSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth Benchmark
공고 • Jun 19Synopsys Announces Availability of the First Wave of Multiphysics Fusion SolutionsSynopsys, Inc. announced availability of its first Multiphysics Fusion solutions for customer deployment. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. The first Multiphysics Fusion solutions include targeted GPU-accelerated flows powered by NVIDIA CUDA-X libraries such as cuDSS. Multiphysics Fusion for Timing Signoff enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis. Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with unified full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to incorporate IR, thermal, and stress effects, improving margins and reducing IR-induced timing escapes. Multiphysics Fusion for Design Closure delivers up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA). Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization, accelerating convergence with fewer iterations. Multiphysics Fusion for Multi-die Designs provides unified Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis, providing early system insights from exploration to golden signoff with correct-by-construction design. Multiphysics Fusion for Analog & Photonic Design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip, high accuracy electromagnetic analysis into the analog design flow, and Synopsys OptoCompiler with Lumerical enabling end-to-end photonic IC and co-packaged optics systems. Early engagements with semiconductor and systems companies validate the value of Multiphysics Fusion solutions. Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs. Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. The Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available.