공시 • May 29
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE Forum 2026 SEMIFIVE announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE Forum 2026) in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE, will deliver a presentation titled 'Leading 3D-IC/Big Die Solution for AI Innovation.' SEMIFIVE presents its 3-dimensional integrated circuit (3D-IC) ASIC design solution as a core strategy to resolve the 'Memory Wall,' the bottleneck between computing devices and memory, which has emerged as a major challenge in the AI industry. SEMIFIVE's 3D-IC solution vertically integrates logic and memory into a single system architecture, significantly shortening data transmission distances. Compared to conventional High Bandwidth Memory (HBM) configurations, this architecture achieves higher memory bandwidth, lower latency, higher power efficiency, and lower cost. Specifically, the reduced chip footprint enables compact packaging and greater design flexibility for a wide range of AI chip development, spanning from edge devices with space and power constraints to high-performance data centers. SEMIFIVE is currently accelerating the commercialization of AI chips that vertically stack a 4-layer memory on top of a large logic chip, in collaboration with global customers. Furthermore, leveraging its proprietary design platform and robust global supply chain, the company is proactively responding to the surging demand for next-generation AI chips while expanding its market influence. SEMIFIVE delivers its optimized Big Die Solution for reliable large-scale AI semiconductor design and will showcase its latest achievements in Big Die design at this forum. The company highlights its collaboration with AI semiconductor startup HyperAccel on 'Bertha,' the LLM Processing Unit (LPU)-based AI inference accelerator. SEMIFIVE successfully executed the comprehensive design and verification process for the Big Die exceeding 500mm² based on Samsung Foundry's 4nm (SF4X) process technology. At the event, SEMIFIVE will host a dedicated exhibition booth to solidify business collaboration and strengthen networking with global customers and partners. Breakeven Date Change • May 26
Forecast breakeven date moved forward to 2026 The analyst covering SemiFive previously expected the company to break even in 2027. New forecast suggests the company will make a profit of ₩5.59b in 2026. Earnings growth of 99% is required to achieve expected profit on schedule. New Risk • Apr 10
New major risk - Share price stability The company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of South Korean stocks, typically moving 17% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. This is currently the only risk that has been identified for the company. 공시 • Feb 14
SemiFive Inc., Annual General Meeting, Mar 31, 2026 SemiFive Inc., Annual General Meeting, Mar 31, 2026, at 10:00 Tokyo Standard Time. Location: conference room, 8, seongnam-daero 331beon-gil, bundang-gu, gyeonggi-do, seongnam South Korea Board Change • Jan 02
No independent directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 4 experienced directors. No highly experienced directors. No independent directors (4 non-independent directors). President & Director Steve H. Park was the last director to join the board, commencing their role in 2019. The following issues are considered to be risks according to the Simply Wall St Risk Model: Lack of independent directors. Insufficient board refreshment.