Announcement • May 29
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE Forum 2026 SEMIFIVE announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE Forum 2026) in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE, will deliver a presentation titled 'Leading 3D-IC/Big Die Solution for AI Innovation.' SEMIFIVE presents its 3-dimensional integrated circuit (3D-IC) ASIC design solution as a core strategy to resolve the 'Memory Wall,' the bottleneck between computing devices and memory, which has emerged as a major challenge in the AI industry. SEMIFIVE's 3D-IC solution vertically integrates logic and memory into a single system architecture, significantly shortening data transmission distances. Compared to conventional High Bandwidth Memory (HBM) configurations, this architecture achieves higher memory bandwidth, lower latency, higher power efficiency, and lower cost. Specifically, the reduced chip footprint enables compact packaging and greater design flexibility for a wide range of AI chip development, spanning from edge devices with space and power constraints to high-performance data centers. SEMIFIVE is currently accelerating the commercialization of AI chips that vertically stack a 4-layer memory on top of a large logic chip, in collaboration with global customers. Furthermore, leveraging its proprietary design platform and robust global supply chain, the company is proactively responding to the surging demand for next-generation AI chips while expanding its market influence. SEMIFIVE delivers its optimized Big Die Solution for reliable large-scale AI semiconductor design and will showcase its latest achievements in Big Die design at this forum. The company highlights its collaboration with AI semiconductor startup HyperAccel on 'Bertha,' the LLM Processing Unit (LPU)-based AI inference accelerator. SEMIFIVE successfully executed the comprehensive design and verification process for the Big Die exceeding 500mm² based on Samsung Foundry's 4nm (SF4X) process technology. At the event, SEMIFIVE will host a dedicated exhibition booth to solidify business collaboration and strengthen networking with global customers and partners. Breakeven Date Change • May 26
Forecast breakeven date moved forward to 2026 The analyst covering SemiFive previously expected the company to break even in 2027. New forecast suggests the company will make a profit of ₩5.59b in 2026. Earnings growth of 99% is required to achieve expected profit on schedule. 
