Reported Earnings • Aug 02
Second quarter 2026 earnings released: US$0.21 loss per share (vs US$0.23 profit in 2Q 2025) Second quarter 2026 results: US$0.21 loss per share (down from US$0.23 profit in 2Q 2025). Revenue: US$44.7m (down 6.1% from 2Q 2025). Net loss: US$7.60m (down 190% from profit in 2Q 2025). Over the last 3 years on average, earnings per share has increased by 21% per year but the company’s share price has fallen by 31% per year, which means it is significantly lagging earnings. 공고 • Jul 30
Magnachip Semiconductor Corporation Provides Consolidated Earnings Guidance for the Third Quarter of 2026 Magnachip Semiconductor Corporation provided consolidated earnings guidance for the third quarter of 2026. Magnachip currently expects the following: Consolidated revenue from continuing operations (which includes Power Analog Solutions and Power IC businesses) to be in the range of $41.5 million to $45.5 million, a decrease of 2.7% sequentially and a decrease of 5.2% year-over-year at the mid-point. This compares with $44.7 million in Second Quarter 2026 and $45.9 million in Third Quarter 2025. 공고 • Jul 09
Magnachip Semiconductor Corporation to Report Q2, 2026 Results on Jul 29, 2026 Magnachip Semiconductor Corporation announced that they will report Q2, 2026 results After-Market on Jul 29, 2026 공고 • Jun 30
Magnachip Semiconductor Corporation Announces CEO Changes On June 26, 2026, the Board of Directors of Magnachip Semiconductor Corporation (the “Company”) appointed Chae Lee to serve as the Company’s Chief Executive Officer and as its principal executive officer, effective July 1, 2026. In connection with Mr. Lee’s appointment, Camillo Martino resigned from his position as Interim Chief Executive Officer of the Company as of the effective date of Mr. Lee’s appointment, thereby concluding his service in that interim capacity. Mr. Martino will continue to serve as Chairman of the Board. Mr. Lee, age 61, served as Chief Executive Officer of Tagore Technology Inc., a pioneer in high-power GaN-based RF switches and power management applications, from January 2023 through July 2024. He previously served as Chief Executive Officer of Insyte Systems Inc. from February 2020 to June 2022. From January 2016 to December 2019, Mr. Lee served as Senior Vice President and General Manager of the Secure Interface and Power Solutions business unit of NXP Semiconductors N.V. From June 1999 to March 2015, Mr. Lee served as Senior Vice President of Maxim Integrated Products Inc. Mr. Lee holds a Bachelor of Science degree in Electrical and Electronics Engineering from the Missouri University of Science and Technology. Effective as of July 1, 2026 (the “Effective Date”), the Company entered into an Executive Service Agreement with Mr. Lee (the “Executive Service Agreement”). In connection with Mr. Martino stepping down as Interim Chief Executive Officer, the Company and Mr. Martino terminated his Consulting Agreement and Executive Services Agreement effective as of July 1, 2026. Lee brings more than 30 years of global semiconductor industry experience spanning power semiconductors, power management integrated circuits (PMIC), sensors, audio amplifiers with expertise in applications, sales, marketing, operations and executive leadership. Most recently, he served as Chief Executive Officer of Tagore Technology, a provider of Gallium Nitride (GaN) semiconductor solutions for Radio Frequency (RF) and Power applications. Prior to Tagore, Lee held senior leadership positions at semiconductor companies including Insyte Systems, NXP Semiconductors, and Maxim Integrated Products where he was responsible for strong high-margin revenue growth through innovative product development in its mobility group. 공고 • Jun 23
Magnachip Semiconductor Corporation Launches New 6th-Generation 600V SJ MOSFETs For AI Servers And EV Charging Applications Magnachip Semiconductor Corporation announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI servers, EV charging systems and industrial power applications. The new products feature low RDS(ON) values of 36mO and 37mO, helping reduce conduction losses and improve overall power conversion efficiency. In addition, both devices integrate a Zener diode between the gate and source terminals to provide enhanced protection against electrostatic discharge (ESD), thereby improving device reliability. The chip size has also been significantly reduced compared with the previous generation, contributing to improved integration and design flexibility. The MMTB60R037G6FZVRH incorporates a Fast Recovery Body Diode, which helps reduce reverse recovery losses and improve switching performance in high-frequency power conversion systems. These characteristics make it well suited for AI server power supplies, where efficiency, thermal management and power density are critical design considerations. Both devices are offered in a TOLL package and are designed for high-power, high-current applications. They also feature a Kelvin Source configuration, which reduces parasitic inductance and improves switching stability. The growing demand for energy-efficient power conversion solutions across AI servers, EV charging systems and industrial power supplies is driving the adoption of advanced power semiconductors. Higher efficiency, improved thermal performance and increased power density have become critical requirements for next-generation power systems. According to Omdia, the discrete semiconductor market within computing & data storage applications is projected to grow from approximately $3,700 million in 2025 to approximately $5,900 million by 2030, representing a compound annual growth rate (CAGR) of approximately 9%. The growing adoption of high-density, high-efficiency server power architectures is expected to further drive demand for power discrete devices, including SJ MOSFETs. The new SJ MOSFETs are suitable for a wide range of power applications requiring high efficiency and reliability, including AI server power supplies, industrial power supplies, telecom infrastructure and EV charging systems. 공고 • Jun 18
Magnachip Semiconductor Corporation has filed a Follow-on Equity Offering in the amount of $50 million. Magnachip Semiconductor Corporation has filed a Follow-on Equity Offering in the amount of $50 million.
Security Name: Common Stock
Security Type: Common Stock
Transaction Features: At the Market Offering 
