공고 • Jul 24
Stmicroelectronics N.V. Provides Earnings Guidance for the Third Quarter Ending September 26, 2026 and Fourth Quarter of 2026 STMicroelectronics N.V. provided earnings guidance for the third quarter ending September 26, 2026 and fourth quarter of 2026. For the third quarter, business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year.
For the fourth quarter, the company expects revenues to be above $4 billion, this translates into a H2 vs H1 growth above normal 15% seasonality. 공고 • Jun 24
STMicroelectronics Unveils ST54M Secure Mobile Chip with Post-Quantum Cryptography for Next-Generation Connected Services STMicroelectronics introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026. 공고 • Jun 22
STMicroelectronics Unveils VL53L9 Direct Time-Of-Flight 3D LiDAR Module STMicroelectronics unveiled the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module. VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,268 zones (54x42), wide 54°x42° field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. VL53L9 combines features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across robotics, industrial automation, smart buildings, AR/VR, and healthcare. VL53L9 is designed for multiple industry use cases: Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. Healthcare: fall detection and monitoring solutions for eldercare and patient safety. The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. ST FlightSense VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally. 
