お知らせ • Apr 22
SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026 SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time. お知らせ • Mar 31
SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026 SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026. お知らせ • Jun 05
Annual General Meeting Approves Dividend for the 2024 Financial Year SUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million. お知らせ • May 27
Suss MicroTec SE Introduces the XBC300 Gen2 D2W Platform SUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing. お知らせ • Apr 19
SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025 SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time. お知らせ • Mar 28
SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025 SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025. お知らせ • Jan 03
SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025 SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025 お知らせ • Jan 16
Focuslight (HK) Investment Management Co. Ltd. completed the acquisition of Suss Microoptics S.A. from SÜSS MicroTec SE (XTRA:SMHN). Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million on November 8, 2023. The transaction volume includes the acquisition of all shares of SUSS MicroOptics and the redemption of financial debt. Upon completion, SUSS MicroTec group is expected to gain extraordinary income before taxes in a range of around €40 to 45 million. SUSS MicroOptics has a contributed sales in the amount of €39.2 million. The transaction is subject to pending approvals and it is expected to be completed in the first quarter of 2024.
Focuslight (HK) Investment Management Co. Ltd. completed the acquisition of Suss Microoptics S.A. from SÜSS MicroTec SE (XTRA:SMHN) on January 16, 2024. お知らせ • Jan 06
SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024 SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024. お知らせ • Nov 09
Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million. Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million on October 8, 2023. The transaction volume includes the acquisition of all shares of SUSS MicroOptics and the redemption of financial debt. Upon completion, SUSS MicroTec group is expected to gain extraordinary income before taxes in a range of around €40 to 45 million. SUSS MicroOptics has a contributed sales in the amount of €39.2 million. The transaction is subject to pending approvals and it is expected to be completed in the first quarter of 2024. お知らせ • Aug 04
SÜSS MicroTec SE Revises Earnings Guidance for the Full Year 2023 SÜSS MicroTec SE revised earnings guidance for the full year 2023. For the year, the company is now assuming that it will achieve Group sales within a range of EUR 320 million to EUR 340 million. Previously, EUR 320 million to EUR 360 million had been anticipated.