View Past PerformanceSUSS MicroTec バランスシートの健全性財務の健全性 基準チェック /66SUSS MicroTecの総株主資本は€318.7M 、総負債は€3.7Mで、負債比率は1.2%となります。総資産と総負債はそれぞれ€524.7Mと€206.0Mです。 SUSS MicroTecの EBIT は€41.6Mで、利息カバレッジ比率48.8です。現金および短期投資は€121.6Mです。主要情報1.17%負債資本比率€3.73m負債インタレスト・カバレッジ・レシオ48.8x現金€121.61mエクイティ€318.71m負債合計€206.02m総資産€524.73m財務の健全性に関する最新情報更新なしすべての更新を表示Recent updatesお知らせ • Apr 22SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time.お知らせ • Apr 01+ 1 more updateSUSS MicroTec SE to Report Q3, 2026 Results on Nov 05, 2026SUSS MicroTec SE announced that they will report Q3, 2026 results on Nov 05, 2026お知らせ • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.お知らせ • Jan 05+ 1 more updateSUSS MicroTec SE to Report Fiscal Year 2025 Results on Mar 30, 2026SUSS MicroTec SE announced that they will report fiscal year 2025 results on Mar 30, 2026お知らせ • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.お知らせ • May 27Suss MicroTec SE Introduces the XBC300 Gen2 D2W PlatformSUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.お知らせ • Apr 19SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time.お知らせ • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.お知らせ • Jan 19+ 2 more updatesSÜSS MicroTec SE to Report First Half, 2025 Results on Aug 07, 2025SÜSS MicroTec SE announced that they will report first half, 2025 results on Aug 07, 2025お知らせ • Jan 03SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025お知らせ • Jan 16Focuslight (HK) Investment Management Co. Ltd. completed the acquisition of Suss Microoptics S.A. from SÜSS MicroTec SE (XTRA:SMHN).Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million on November 8, 2023. The transaction volume includes the acquisition of all shares of SUSS MicroOptics and the redemption of financial debt. Upon completion, SUSS MicroTec group is expected to gain extraordinary income before taxes in a range of around €40 to 45 million. SUSS MicroOptics has a contributed sales in the amount of €39.2 million. The transaction is subject to pending approvals and it is expected to be completed in the first quarter of 2024. Focuslight (HK) Investment Management Co. Ltd. completed the acquisition of Suss Microoptics S.A. from SÜSS MicroTec SE (XTRA:SMHN) on January 16, 2024.お知らせ • Jan 06SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024.お知らせ • Nov 09Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million. Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million on October 8, 2023. The transaction volume includes the acquisition of all shares of SUSS MicroOptics and the redemption of financial debt. Upon completion, SUSS MicroTec group is expected to gain extraordinary income before taxes in a range of around €40 to 45 million. SUSS MicroOptics has a contributed sales in the amount of €39.2 million. The transaction is subject to pending approvals and it is expected to be completed in the first quarter of 2024.お知らせ • Aug 04SÜSS MicroTec SE Revises Earnings Guidance for the Full Year 2023SÜSS MicroTec SE revised earnings guidance for the full year 2023. For the year, the company is now assuming that it will achieve Group sales within a range of EUR 320 million to EUR 340 million. Previously, EUR 320 million to EUR 360 million had been anticipated.お知らせ • Jun 14+ 2 more updatesSÜSS MicroTec SE Announces Executive ChangesThe Supervisory Board of SÜSS MicroTec SE has appointed Burkhardt Frick (58) as a member of the Management Board of the Company as of September 11, 2023. The experienced manager succeeds Dr. Bernd Schulte, who will return as planned to the Company's Supervisory Board on the same date. The Management Board contract of Dr. Thomas Rohe, Chief Operating Officer, has been extended by three more years until April 30, 2027.Burkhardt Frick has more than 30 years' experience in the high-tech industry. Since 2014, Frick has worked for the leading global semiconductor equipment manufacturer ASML; as the Vice President of Strategic Sourcing & Supply Chain, he was initially responsible for purchasing and strategic partnerships with some of the company's most important suppliers. Since 2021, in his role as the Vice President of Corporate Marketing, he has supported the Management Board with the long-term product and market strategy. Between 1994 and 2014, Burkhardt Frick served in various management positions in Philips' mobile display and semiconductor business, with stations of several years each in the USA and Hong Kong. Specifically, he led strategic marketing and sales organizations and most recently served as a member of the Management Board of Assembléon, a former Philips subsidiary. The company also announced the appointment of Dr. Cornelia Ballwießer as a new member of the Management Board.お知らせ • Sep 09+ 3 more updatesSÜSS MicroTec SE to Report First Half, 2023 Results on Aug 03, 2023SÜSS MicroTec SE announced that they will report first half, 2023 results on Aug 03, 2023財務状況分析短期負債: SESM.Fの 短期資産 ( €405.9M ) が 短期負債 ( €133.7M ) を超えています。長期負債: SESM.Fの短期資産 ( €405.9M ) が 長期負債 ( €72.4M ) を上回っています。デット・ツー・エクイティの歴史と分析負債レベル: SESM.F総負債よりも多くの現金を保有しています。負債の削減: SESM.Fの負債対資本比率は、過去 5 年間で7.4%から1.2%に減少しました。債務返済能力: SESM.Fの負債は 営業キャッシュフロー によって 十分にカバー されています ( 376.7% )。インタレストカバレッジ: SESM.Fの負債に対する 利息支払い は EBIT ( 48.8 x coverage) によって 十分にカバーされています。貸借対照表健全な企業の発掘7D1Y7D1Y7D1YSemiconductors 業界の健全な企業。View Dividend企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/06/07 21:14終値2026/06/05 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋SUSS MicroTec SE 8 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。17 アナリスト機関Guenther HollfelderBaader Helvea Equity ResearchNicole WinklerBerenbergTammy QiuBerenberg14 その他のアナリストを表示
お知らせ • Apr 22SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time.
お知らせ • Apr 01+ 1 more updateSUSS MicroTec SE to Report Q3, 2026 Results on Nov 05, 2026SUSS MicroTec SE announced that they will report Q3, 2026 results on Nov 05, 2026
お知らせ • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.
お知らせ • Jan 05+ 1 more updateSUSS MicroTec SE to Report Fiscal Year 2025 Results on Mar 30, 2026SUSS MicroTec SE announced that they will report fiscal year 2025 results on Mar 30, 2026
お知らせ • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.
お知らせ • May 27Suss MicroTec SE Introduces the XBC300 Gen2 D2W PlatformSUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.
お知らせ • Apr 19SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time.
お知らせ • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.
お知らせ • Jan 19+ 2 more updatesSÜSS MicroTec SE to Report First Half, 2025 Results on Aug 07, 2025SÜSS MicroTec SE announced that they will report first half, 2025 results on Aug 07, 2025
お知らせ • Jan 03SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025
お知らせ • Jan 16Focuslight (HK) Investment Management Co. Ltd. completed the acquisition of Suss Microoptics S.A. from SÜSS MicroTec SE (XTRA:SMHN).Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million on November 8, 2023. The transaction volume includes the acquisition of all shares of SUSS MicroOptics and the redemption of financial debt. Upon completion, SUSS MicroTec group is expected to gain extraordinary income before taxes in a range of around €40 to 45 million. SUSS MicroOptics has a contributed sales in the amount of €39.2 million. The transaction is subject to pending approvals and it is expected to be completed in the first quarter of 2024. Focuslight (HK) Investment Management Co. Ltd. completed the acquisition of Suss Microoptics S.A. from SÜSS MicroTec SE (XTRA:SMHN) on January 16, 2024.
お知らせ • Jan 06SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024.
お知らせ • Nov 09Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million. Focuslight (HK) Investment Management Co. Ltd signed an agreement to acquire SUSS MicroOptics SA from SÜSS MicroTec SE (XTRA:SMHN) for €75.5 million on October 8, 2023. The transaction volume includes the acquisition of all shares of SUSS MicroOptics and the redemption of financial debt. Upon completion, SUSS MicroTec group is expected to gain extraordinary income before taxes in a range of around €40 to 45 million. SUSS MicroOptics has a contributed sales in the amount of €39.2 million. The transaction is subject to pending approvals and it is expected to be completed in the first quarter of 2024.
お知らせ • Aug 04SÜSS MicroTec SE Revises Earnings Guidance for the Full Year 2023SÜSS MicroTec SE revised earnings guidance for the full year 2023. For the year, the company is now assuming that it will achieve Group sales within a range of EUR 320 million to EUR 340 million. Previously, EUR 320 million to EUR 360 million had been anticipated.
お知らせ • Jun 14+ 2 more updatesSÜSS MicroTec SE Announces Executive ChangesThe Supervisory Board of SÜSS MicroTec SE has appointed Burkhardt Frick (58) as a member of the Management Board of the Company as of September 11, 2023. The experienced manager succeeds Dr. Bernd Schulte, who will return as planned to the Company's Supervisory Board on the same date. The Management Board contract of Dr. Thomas Rohe, Chief Operating Officer, has been extended by three more years until April 30, 2027.Burkhardt Frick has more than 30 years' experience in the high-tech industry. Since 2014, Frick has worked for the leading global semiconductor equipment manufacturer ASML; as the Vice President of Strategic Sourcing & Supply Chain, he was initially responsible for purchasing and strategic partnerships with some of the company's most important suppliers. Since 2021, in his role as the Vice President of Corporate Marketing, he has supported the Management Board with the long-term product and market strategy. Between 1994 and 2014, Burkhardt Frick served in various management positions in Philips' mobile display and semiconductor business, with stations of several years each in the USA and Hong Kong. Specifically, he led strategic marketing and sales organizations and most recently served as a member of the Management Board of Assembléon, a former Philips subsidiary. The company also announced the appointment of Dr. Cornelia Ballwießer as a new member of the Management Board.
お知らせ • Sep 09+ 3 more updatesSÜSS MicroTec SE to Report First Half, 2023 Results on Aug 03, 2023SÜSS MicroTec SE announced that they will report first half, 2023 results on Aug 03, 2023