View Past PerformanceQnity Electronics バランスシートの健全性財務の健全性 基準チェック /36Qnity Electronicsの総株主資本は$7.5B 、総負債は$4.0Bで、負債比率は53.9%となります。総資産と総負債はそれぞれ$14.1Bと$6.6Bです。 Qnity Electronicsの EBIT は$1.1Bで、利息カバレッジ比率8.8です。現金および短期投資は$857.0Mです。主要情報53.92%負債資本比率US$4.02b負債インタレスト・カバレッジ・レシオ8.8x現金US$857.00mエクイティUS$7.46b負債合計US$6.60b総資産US$14.06b財務の健全性に関する最新情報お知らせ • Nov 15Qnity Electronics, Inc. announced delayed 10-Q filingOn 11/14/2025, Qnity Electronics, Inc. announced that they will be unable to file their next 10-Q by the deadline required by the SEC.すべての更新を表示Recent updatesライブニュース • Jul 14Qnity Electronics Launches Advanced Packaging Materials for Next-Gen AI and HPC SystemsQnity Electronics has launched two new advanced packaging materials for organic interposers, Intervia 8540HSP copper and Cyclotene DF6800M dry film dielectric, and plans to showcase them at the JPCA Show 2026 in Tokyo from June 10 to 12. The materials are designed to support emerging glass-based substrate structures and advanced interconnect formation as chip designs move further toward stacking for AI and high-performance computing applications. Qnity Electronics shares trade at $140.98, with the stock up 65.9% year to date, while the latest 1-day move shows a 2.0% decline. This update ties Qnity Electronics more closely to AI and HPC packaging trends, which could matter for how durable demand is for its materials and how dependent growth becomes on advanced semiconductor capital spending cycles.お知らせ • Jul 07Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026Valuation Update With 7 Day Price Move • Jul 02Investor sentiment deteriorates as stock falls 15%After last week's 15% share price decline to US$142, the stock trades at a forward P/E ratio of 38x. Average forward P/E is 33x in the Semiconductor industry in the US. Simply Wall St's valuation model estimates the intrinsic value at US$63.91 per share.ライブニュース • Jun 30Qnity Electronics Launches Advanced Packaging Hub and Optivision Max CMP Pads for AI SystemsQnity Electronics launched an Advanced Packaging Innovation Hub, an online platform showcasing material and technology solutions for next generation AI, high performance computing, cloud, networking and edge systems, and introduced Optivision Max CMP polishing pads on June 10, 2026. The new CMP pads and materials for organic interposer applications are aimed at handling shrinking semiconductor geometries and supporting emerging glass based substrates, tying Qnity more closely to AI infrastructure and advanced packaging supply chains. Qnity Electronics shares trade at $158.23, with the stock up 86.2% year to date, indicating strong recent momentum around the company despite a weaker 7 day stretch. This update signals that a growing slice of Qnity’s business is tied to advanced packaging and AI linked demand, which can increase exposure to semiconductor capital spending cycles as a key risk for shareholders.お知らせ • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.お知らせ • Jun 23Qnity Electronics Launches Advanced Packaging Innovation HubQnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.ライブニュース • Jun 22Qnity Electronics Unveils Expanded Partnerships and Manufacturing Growth at AI ConferenceQnity Electronics CEO Jon Kemp told investors at Wolfe Research’s Materials of the Future Conference on 16 June 2026, and later on CNBC’s “Mad Money,” that Qnity is providing end-to-end materials solutions across the semiconductor chain, backed by partnerships with SK Hynix, Nvidia, Semikron-Danfoss and DuPont, and is expanding manufacturing to address AI-related demand. Kemp framed the spread of AI into more sectors as an important demand driver for Qnity’s materials portfolio and highlighted the company’s role as a “hidden hero” supplying critical components rather than finished chips or systems. Qnity Electronics shares trade at US$168.98, with the stock up 98.8% year to date, and the article notes a rise in after-hours trading following Kemp’s appearances. These comments point to a business model tied closely to AI hardware spending, so the key risk is that any slowdown in AI-related capital investment could quickly affect order volumes and capacity plans.分析記事 • Jun 22Qnity Electronics (Q) Stock Could Be 2.4% Undervalued After AI Materials PushQnity Electronics (Q) has moved into focus after CEO Jon Kemp highlighted the company’s materials role in AI applications on national television, together with fresh product launches for advanced packaging and CMP pads in semiconductor manufacturing. See our latest analysis for Qnity Electronics. The recent product announcements and CEO Jon Kemp’s AI-focused media appearances have coincided with strong momentum in Qnity Electronics’ shares, with a 90-day share price return of 47.04% and a...Recent Insider Transactions • Jun 14Independent Director recently sold US$59k worth of stockOn the 5th of June, Steven Sterin sold around 400 shares on-market at roughly US$148 per share. This transaction amounted to 3.2% of their direct individual holding at the time of the trade. In the last 3 months, they made an even bigger sale worth US$83k. Despite this recent sale, insiders have collectively bought US$187k more than they sold in the last 12 months.お知らせ • Jun 12Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor ManufacturingQnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.お知らせ • Jun 09Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer ApplicationsQnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications.Upcoming Dividend • May 22Upcoming dividend of US$0.08 per shareEligible shareholders must have bought the stock before 29 May 2026. Payment date: 15 June 2026. Payout ratio is a comfortable 4.5% and this is well supported by cash flows. Trailing yield: 0.2%. Lower than top quartile of American dividend payers (4.3%). In line with average of industry peers (0.3%).Seeking Alpha • May 20Qnity Electronics, Inc.: A Great Business That Still Needs Some TimeSummary Qnity Electronics is rated Hold due to a stretched ~$145 share price and limited public track record despite strong fundamentals. Qnity’s CMP products drive high switching costs and revenue acceleration, with FY2026 guidance of $5.225–$5.375B and Adj. EBITDA midpoint at $1.58B. Competitive moat stems from proprietary chemistries and deep client integration, but $4B in debt and rising rates present refinancing risk. I see Q as an attractive opportunity only if shares pull back to $100–$105, given current overvaluation and unproven cycle resilience. Read the full article on Seeking Alpha新しいナラティブ • May 15AI And Advanced Packaging Tailwinds Will Support A Constructive Long Term ViewCatalysts About Qnity Electronics Qnity Electronics supplies advanced materials and interconnect solutions used across leading-edge semiconductor manufacturing and electronic systems. What are the underlying business or industry changes driving this perspective?Reported Earnings • May 13First quarter 2026 earnings releasedFirst quarter 2026 results: EPS: US$0.72. Revenue: US$1.32b (up 18% from 1Q 2025). Net income: US$151.0m (down 22% from 1Q 2025). Profit margin: 12% (down from 17% in 1Q 2025). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 8.0% p.a. on average during the next 3 years, compared to a 22% growth forecast for the Semiconductor industry in the US.ライブニュース • May 13Qnity Unveils New Packaging Materials for Next-Gen AI and High-Performance ComputingQnity Electronics introduced new advanced packaging material solutions tailored for organic interposer applications. The product set includes Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. These materials are designed to support advanced interconnects, redistribution layer designs and emerging glass-based substrate structures for next-generation AI and high-performance computing uses. This launch points to Qnity leaning into materials that sit at the core of advanced chip packaging, which is a key piece of AI and high-performance computing hardware supply chains. If you are tracking Qnity, it is worth watching how quickly these new materials gain adoption with semiconductor and substrate manufacturers that are building out organic and glass-based platforms.お知らせ • May 12Qnity Electronics, Inc. Raises Earnings Guidance for the Full Year 2026Qnity Electronics, Inc. raised earnings guidance for the full year 2026. For the year, the company expects its Net Sales to be in range of $5.225 Billion - $5.375 Billion.お知らせ • Apr 16Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Second Quarter 2026, Payable on June 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a second quarterly dividend for 2026 of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on June 15, 2026 to stockholders of record on May 29, 2026.お知らせ • Apr 07Qnity Electronics, Inc. to Report Q1, 2026 Results on May 12, 2026Qnity Electronics, Inc. announced that they will report Q1, 2026 results at 9:30 AM, US Eastern Standard Time on May 12, 2026お知らせ • Feb 27Qnity Electronics, Inc. (NYSE:Q) announces an Equity Buyback for $500 million worth of its shares.Qnity Electronics, Inc. (NYSE:Q) announces a share repurchase program. Under the program, the company will repurchase up to $500 million of outstanding common stock. The share repurchase program has no expiration date.New Risk • Feb 27New minor risk - Financial positionThe company has a high level of debt. Net debt to equity ratio: 42% This is considered a minor risk. Having a high level of debt increases the company's balance sheet risk. The company has a higher interest repayment burden, leading to the need to allocate a greater amount of its earnings towards servicing the debt, potentially limiting growth options or shareholder distributions. It can also increase the risk of bankruptcy if business conditions deteriorate enough that the company can no longer meet its debt obligations. This is currently the only risk that has been identified for the company.Upcoming Dividend • Feb 20Upcoming dividend of US$0.08 per shareEligible shareholders must have bought the stock before 27 February 2026. Payment date: 16 March 2026. Trailing yield: 0.3%. Lower than top quartile of American dividend payers (4.2%). In line with average of industry peers (0.4%).お知らせ • Feb 06Qnity Electronics, Inc. to Report Q4, 2025 Results on Feb 26, 2026Qnity Electronics, Inc. announced that they will report Q4, 2025 results Pre-Market on Feb 26, 2026お知らせ • Jan 16+ 1 more updateQnity Electronics, Inc. Reaffirms Earnings Guidance for the Full Year 2025Qnity Electronics, Inc. reaffirmed earnings guidance for the full year 2025. For the year, the company reaffirms its financial guidance for Net Sales of ~$4.7 Billion.お知らせ • Dec 10+ 2 more updatesQnity Electronics, Inc., Annual General Meeting, May 21, 2026Qnity Electronics, Inc., Annual General Meeting, May 21, 2026.お知らせ • Nov 15Qnity Electronics, Inc. announced delayed 10-Q filingOn 11/14/2025, Qnity Electronics, Inc. announced that they will be unable to file their next 10-Q by the deadline required by the SEC.お知らせ • Nov 13Qnity Electronics, Inc. Announces Quarterly Dividend on Common Stock, Payable on December 15, 2025Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of six cents ($0.06) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on December 15, 2025, to stockholders of record on November 28, 2025.お知らせ • Nov 07Qnity Electronics, Inc. Provides Earnings Guidance for the Year 2025Qnity Electronics, Inc. provided earnings guidance for the year 2025. For the year, the company expects Net Sales to be $4.7 billion. GAAP Net Income to be $800 million.お知らせ • Nov 04Qnity Electronics, Inc. Appoints Jon Kemp as Chief Executive OfficerQnity Electronics, Inc. (Qnity) announced the completion of its separation from DuPont de Nemours, Inc. on November 1, 2025. Jon Kemp has assumed the role of Chief Executive Officer of Qnity as planned. Prior to this appointment, Kemp served as president of DuPont’s Electronics & Industrial business, where he led major portfolio transformation and business growth.Board Change • Oct 28No independent directorsFollowing the recent departure of a director, there are no independent directors on the board. The company's board is composed of: No independent directors. 9 non-independent directors. was the last director to join the board, commencing their role in . The company's lack of independent directors is a risk according to the Simply Wall St Risk Model.財務状況分析短期負債: Qの 短期資産 ( $2.7B ) が 短期負債 ( $1.3B ) を超えています。長期負債: Qの短期資産 ( $2.7B ) は 長期負債 ( $5.3B ) をカバーしていません。デット・ツー・エクイティの歴史と分析負債レベル: Qの 純負債対資本比率 ( 42.4% ) は 高い と見なされます。負債の削減: Qの負債対資本比率が過去 5 年間で減少したかどうかを判断するにはデータが不十分です。債務返済能力: Qの負債は 営業キャッシュフロー によって 十分にカバー されています ( 29.9% )。インタレストカバレッジ: Qの負債に対する 利息支払い は EBIT ( 8.8 x coverage) によって 十分にカバーされています。貸借対照表健全な企業の発掘7D1Y7D1Y7D1YSemiconductors 業界の健全な企業。View Dividend企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/07/22 07:22終値2026/07/22 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社のGitHubページでご覧いただけます。また、レポートの活用方法に関するガイドやYouTubeのチュートリアルも用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Qnity Electronics, Inc. 8 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。9 アナリスト機関John McNultyBMO Capital Markets Equity ResearchBhavesh LodayaBMO Capital Markets Equity ResearchMelissa WeathersDeutsche Bank6 その他のアナリストを表示
お知らせ • Nov 15Qnity Electronics, Inc. announced delayed 10-Q filingOn 11/14/2025, Qnity Electronics, Inc. announced that they will be unable to file their next 10-Q by the deadline required by the SEC.
ライブニュース • Jul 14Qnity Electronics Launches Advanced Packaging Materials for Next-Gen AI and HPC SystemsQnity Electronics has launched two new advanced packaging materials for organic interposers, Intervia 8540HSP copper and Cyclotene DF6800M dry film dielectric, and plans to showcase them at the JPCA Show 2026 in Tokyo from June 10 to 12. The materials are designed to support emerging glass-based substrate structures and advanced interconnect formation as chip designs move further toward stacking for AI and high-performance computing applications. Qnity Electronics shares trade at $140.98, with the stock up 65.9% year to date, while the latest 1-day move shows a 2.0% decline. This update ties Qnity Electronics more closely to AI and HPC packaging trends, which could matter for how durable demand is for its materials and how dependent growth becomes on advanced semiconductor capital spending cycles.
お知らせ • Jul 07Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026
Valuation Update With 7 Day Price Move • Jul 02Investor sentiment deteriorates as stock falls 15%After last week's 15% share price decline to US$142, the stock trades at a forward P/E ratio of 38x. Average forward P/E is 33x in the Semiconductor industry in the US. Simply Wall St's valuation model estimates the intrinsic value at US$63.91 per share.
ライブニュース • Jun 30Qnity Electronics Launches Advanced Packaging Hub and Optivision Max CMP Pads for AI SystemsQnity Electronics launched an Advanced Packaging Innovation Hub, an online platform showcasing material and technology solutions for next generation AI, high performance computing, cloud, networking and edge systems, and introduced Optivision Max CMP polishing pads on June 10, 2026. The new CMP pads and materials for organic interposer applications are aimed at handling shrinking semiconductor geometries and supporting emerging glass based substrates, tying Qnity more closely to AI infrastructure and advanced packaging supply chains. Qnity Electronics shares trade at $158.23, with the stock up 86.2% year to date, indicating strong recent momentum around the company despite a weaker 7 day stretch. This update signals that a growing slice of Qnity’s business is tied to advanced packaging and AI linked demand, which can increase exposure to semiconductor capital spending cycles as a key risk for shareholders.
お知らせ • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.
お知らせ • Jun 23Qnity Electronics Launches Advanced Packaging Innovation HubQnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.
ライブニュース • Jun 22Qnity Electronics Unveils Expanded Partnerships and Manufacturing Growth at AI ConferenceQnity Electronics CEO Jon Kemp told investors at Wolfe Research’s Materials of the Future Conference on 16 June 2026, and later on CNBC’s “Mad Money,” that Qnity is providing end-to-end materials solutions across the semiconductor chain, backed by partnerships with SK Hynix, Nvidia, Semikron-Danfoss and DuPont, and is expanding manufacturing to address AI-related demand. Kemp framed the spread of AI into more sectors as an important demand driver for Qnity’s materials portfolio and highlighted the company’s role as a “hidden hero” supplying critical components rather than finished chips or systems. Qnity Electronics shares trade at US$168.98, with the stock up 98.8% year to date, and the article notes a rise in after-hours trading following Kemp’s appearances. These comments point to a business model tied closely to AI hardware spending, so the key risk is that any slowdown in AI-related capital investment could quickly affect order volumes and capacity plans.
分析記事 • Jun 22Qnity Electronics (Q) Stock Could Be 2.4% Undervalued After AI Materials PushQnity Electronics (Q) has moved into focus after CEO Jon Kemp highlighted the company’s materials role in AI applications on national television, together with fresh product launches for advanced packaging and CMP pads in semiconductor manufacturing. See our latest analysis for Qnity Electronics. The recent product announcements and CEO Jon Kemp’s AI-focused media appearances have coincided with strong momentum in Qnity Electronics’ shares, with a 90-day share price return of 47.04% and a...
Recent Insider Transactions • Jun 14Independent Director recently sold US$59k worth of stockOn the 5th of June, Steven Sterin sold around 400 shares on-market at roughly US$148 per share. This transaction amounted to 3.2% of their direct individual holding at the time of the trade. In the last 3 months, they made an even bigger sale worth US$83k. Despite this recent sale, insiders have collectively bought US$187k more than they sold in the last 12 months.
お知らせ • Jun 12Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor ManufacturingQnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.
お知らせ • Jun 09Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer ApplicationsQnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications.
Upcoming Dividend • May 22Upcoming dividend of US$0.08 per shareEligible shareholders must have bought the stock before 29 May 2026. Payment date: 15 June 2026. Payout ratio is a comfortable 4.5% and this is well supported by cash flows. Trailing yield: 0.2%. Lower than top quartile of American dividend payers (4.3%). In line with average of industry peers (0.3%).
Seeking Alpha • May 20Qnity Electronics, Inc.: A Great Business That Still Needs Some TimeSummary Qnity Electronics is rated Hold due to a stretched ~$145 share price and limited public track record despite strong fundamentals. Qnity’s CMP products drive high switching costs and revenue acceleration, with FY2026 guidance of $5.225–$5.375B and Adj. EBITDA midpoint at $1.58B. Competitive moat stems from proprietary chemistries and deep client integration, but $4B in debt and rising rates present refinancing risk. I see Q as an attractive opportunity only if shares pull back to $100–$105, given current overvaluation and unproven cycle resilience. Read the full article on Seeking Alpha
新しいナラティブ • May 15AI And Advanced Packaging Tailwinds Will Support A Constructive Long Term ViewCatalysts About Qnity Electronics Qnity Electronics supplies advanced materials and interconnect solutions used across leading-edge semiconductor manufacturing and electronic systems. What are the underlying business or industry changes driving this perspective?
Reported Earnings • May 13First quarter 2026 earnings releasedFirst quarter 2026 results: EPS: US$0.72. Revenue: US$1.32b (up 18% from 1Q 2025). Net income: US$151.0m (down 22% from 1Q 2025). Profit margin: 12% (down from 17% in 1Q 2025). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 8.0% p.a. on average during the next 3 years, compared to a 22% growth forecast for the Semiconductor industry in the US.
ライブニュース • May 13Qnity Unveils New Packaging Materials for Next-Gen AI and High-Performance ComputingQnity Electronics introduced new advanced packaging material solutions tailored for organic interposer applications. The product set includes Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. These materials are designed to support advanced interconnects, redistribution layer designs and emerging glass-based substrate structures for next-generation AI and high-performance computing uses. This launch points to Qnity leaning into materials that sit at the core of advanced chip packaging, which is a key piece of AI and high-performance computing hardware supply chains. If you are tracking Qnity, it is worth watching how quickly these new materials gain adoption with semiconductor and substrate manufacturers that are building out organic and glass-based platforms.
お知らせ • May 12Qnity Electronics, Inc. Raises Earnings Guidance for the Full Year 2026Qnity Electronics, Inc. raised earnings guidance for the full year 2026. For the year, the company expects its Net Sales to be in range of $5.225 Billion - $5.375 Billion.
お知らせ • Apr 16Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Second Quarter 2026, Payable on June 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a second quarterly dividend for 2026 of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on June 15, 2026 to stockholders of record on May 29, 2026.
お知らせ • Apr 07Qnity Electronics, Inc. to Report Q1, 2026 Results on May 12, 2026Qnity Electronics, Inc. announced that they will report Q1, 2026 results at 9:30 AM, US Eastern Standard Time on May 12, 2026
お知らせ • Feb 27Qnity Electronics, Inc. (NYSE:Q) announces an Equity Buyback for $500 million worth of its shares.Qnity Electronics, Inc. (NYSE:Q) announces a share repurchase program. Under the program, the company will repurchase up to $500 million of outstanding common stock. The share repurchase program has no expiration date.
New Risk • Feb 27New minor risk - Financial positionThe company has a high level of debt. Net debt to equity ratio: 42% This is considered a minor risk. Having a high level of debt increases the company's balance sheet risk. The company has a higher interest repayment burden, leading to the need to allocate a greater amount of its earnings towards servicing the debt, potentially limiting growth options or shareholder distributions. It can also increase the risk of bankruptcy if business conditions deteriorate enough that the company can no longer meet its debt obligations. This is currently the only risk that has been identified for the company.
Upcoming Dividend • Feb 20Upcoming dividend of US$0.08 per shareEligible shareholders must have bought the stock before 27 February 2026. Payment date: 16 March 2026. Trailing yield: 0.3%. Lower than top quartile of American dividend payers (4.2%). In line with average of industry peers (0.4%).
お知らせ • Feb 06Qnity Electronics, Inc. to Report Q4, 2025 Results on Feb 26, 2026Qnity Electronics, Inc. announced that they will report Q4, 2025 results Pre-Market on Feb 26, 2026
お知らせ • Jan 16+ 1 more updateQnity Electronics, Inc. Reaffirms Earnings Guidance for the Full Year 2025Qnity Electronics, Inc. reaffirmed earnings guidance for the full year 2025. For the year, the company reaffirms its financial guidance for Net Sales of ~$4.7 Billion.
お知らせ • Dec 10+ 2 more updatesQnity Electronics, Inc., Annual General Meeting, May 21, 2026Qnity Electronics, Inc., Annual General Meeting, May 21, 2026.
お知らせ • Nov 15Qnity Electronics, Inc. announced delayed 10-Q filingOn 11/14/2025, Qnity Electronics, Inc. announced that they will be unable to file their next 10-Q by the deadline required by the SEC.
お知らせ • Nov 13Qnity Electronics, Inc. Announces Quarterly Dividend on Common Stock, Payable on December 15, 2025Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of six cents ($0.06) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on December 15, 2025, to stockholders of record on November 28, 2025.
お知らせ • Nov 07Qnity Electronics, Inc. Provides Earnings Guidance for the Year 2025Qnity Electronics, Inc. provided earnings guidance for the year 2025. For the year, the company expects Net Sales to be $4.7 billion. GAAP Net Income to be $800 million.
お知らせ • Nov 04Qnity Electronics, Inc. Appoints Jon Kemp as Chief Executive OfficerQnity Electronics, Inc. (Qnity) announced the completion of its separation from DuPont de Nemours, Inc. on November 1, 2025. Jon Kemp has assumed the role of Chief Executive Officer of Qnity as planned. Prior to this appointment, Kemp served as president of DuPont’s Electronics & Industrial business, where he led major portfolio transformation and business growth.
Board Change • Oct 28No independent directorsFollowing the recent departure of a director, there are no independent directors on the board. The company's board is composed of: No independent directors. 9 non-independent directors. was the last director to join the board, commencing their role in . The company's lack of independent directors is a risk according to the Simply Wall St Risk Model.
