View ValuationResonac Holdings 将来の成長Future 基準チェック /36Resonac Holdingsの収益は年間0.7%で減少すると予測されていますが、年間利益は年間28.2%で増加すると予測されています。EPS は年間 増加すると予測されています。自己資本利益率は 3 年後に15% 28%なると予測されています。主要情報28.2%収益成長率28.03%EPS成長率Chemicals 収益成長17.1%収益成長率-0.7%将来の株主資本利益率14.97%アナリストカバレッジGood最終更新日24 Apr 2026今後の成長に関する最新情報お知らせ • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.すべての更新を表示Recent updatesお知らせ • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026お知らせ • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026お知らせ • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.お知らせ • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026お知らせ • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.お知らせ • Mar 17Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025お知らせ • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.お知らせ • Feb 14Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025お知らせ • Feb 13Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025.お知らせ • Nov 13Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025お知らせ • Sep 20Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor PackagesResonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages.お知らせ • Aug 09Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025お知らせ • May 17+ 1 more updateResonac Holdings Corporation to Report Q2, 2024 Results on Aug 08, 2024Resonac Holdings Corporation announced that they will report Q2, 2024 results at 3:00 PM, Tokyo Standard Time on Aug 08, 2024お知らせ • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024.お知らせ • Feb 15Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024お知らせ • Dec 05Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024お知らせ • Nov 21Resonac Holdings Corporation Announces Board ResignationsResonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024.お知らせ • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.お知らせ • Aug 27Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023お知らせ • Jun 01Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023お知らせ • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023.お知らせ • Dec 09Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023業績と収益の成長予測OTCPK:SHWD.F - アナリストの将来予測と過去の財務データ ( )JPY Millions日付収益収益フリー・キャッシュフロー営業活動によるキャッシュ平均アナリスト数12/31/20281,358,966135,960120,831249,6861012/31/20271,316,508111,488109,950221,4571312/31/20261,363,60584,77765,073184,3691212/31/20251,347,12529,03123,560130,286N/A9/30/20251,346,233-3,388N/AN/AN/A6/30/20251,364,98754,71234,540144,986N/A3/31/20251,388,16535,605N/AN/AN/A12/31/20241,391,48073,50375,341163,653N/A9/30/20241,374,11138,182N/AN/AN/A6/30/20241,341,29039,30740,472123,903N/A3/31/20241,311,32420,371N/AN/AN/A12/31/20231,288,869-18,95531,581118,686N/A9/30/20231,300,776-11,025N/AN/AN/A6/30/20231,352,714-20,75143,971126,555N/A3/31/20231,383,54810,096N/AN/AN/A12/31/20221,392,62130,79312,492100,349N/A9/30/20221,402,09133,687N/AN/AN/A6/30/20221,382,31033,045-1,40681,856N/A3/31/20221,387,948-8,851N/AN/AN/A12/31/20211,419,635-12,09447,542115,283N/A9/30/20211,389,419-28,980N/AN/AN/A6/30/20211,340,437-35,14187,346159,418N/A3/31/20211,141,645-73,812N/AN/AN/A12/31/2020973,700-76,30444,786109,286N/A9/30/2020846,856-65,529N/AN/AN/A6/30/2020757,581-47,300-4,27143,229N/A3/31/2020843,46142,713N/AN/AN/A12/31/2019906,45473,08837,84678,554N/A9/30/2019962,77393,194N/AN/AN/A6/30/20191,011,785119,184N/A138,103N/A3/31/20191,012,169119,826N/AN/AN/A12/31/2018992,136111,503N/A149,785N/A9/30/2018941,512109,305N/AN/AN/A6/30/2018864,03983,765N/A76,495N/A3/31/2018811,88843,668N/AN/AN/A12/31/2017780,38733,470N/A67,284N/A9/30/2017750,56224,204N/AN/AN/A6/30/2017724,68817,811N/A90,948N/A3/31/2017698,35625,946N/AN/AN/A12/31/2016671,15912,305N/A68,949N/A9/30/2016670,2668,912N/AN/AN/A6/30/2016700,1601,697N/A61,236N/A3/31/2016739,8729,385N/AN/AN/A12/31/2015775,732921N/A61,170N/A9/30/2015819,0414,840N/AN/AN/A6/30/2015855,3948,457N/A76,598N/Aもっと見るアナリストによる今後の成長予測収入対貯蓄率: SHWD.Fの予測収益成長率 (年間28.2% ) は 貯蓄率 ( 3.5% ) を上回っています。収益対市場: SHWD.Fの収益 ( 28.2% ) はUS市場 ( 16.6% ) よりも速いペースで成長すると予測されています。高成長収益: SHWD.Fの収益は今後 3 年間で 大幅に 増加すると予想されています。収益対市場: SHWD.Fの収益は今後 3 年間で減少すると予想されています (年間-0.7% )。高い収益成長: SHWD.Fの収益は今後 3 年間で減少すると予測されています (年間-0.7% )。一株当たり利益成長率予想将来の株主資本利益率将来のROE: SHWD.Fの 自己資本利益率 は、3年後には低くなると予測されています ( 15 %)。成長企業の発掘7D1Y7D1Y7D1YMaterials 業界の高成長企業。View Past Performance企業分析と財務データの現状データ最終更新日(UTC時間)企業分析2026/05/06 22:11終値2026/04/17 00:00収益2025/12/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM(Trailing Twelve Month)またはLTM(Last Twelve Month)データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Resonac Holdings Corporation 13 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。25 アナリスト機関Mikiya YamadaBarclaysTakashi EnomotoBofA Global ResearchAtsushi IkedaCitigroup Inc22 その他のアナリストを表示
お知らせ • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.
お知らせ • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026
お知らせ • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026
お知らせ • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.
お知らせ • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026
お知らせ • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.
お知らせ • Mar 17Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025
お知らせ • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.
お知らせ • Feb 14Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025
お知らせ • Feb 13Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025.
お知らせ • Nov 13Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025
お知らせ • Sep 20Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor PackagesResonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages.
お知らせ • Aug 09Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025
お知らせ • May 17+ 1 more updateResonac Holdings Corporation to Report Q2, 2024 Results on Aug 08, 2024Resonac Holdings Corporation announced that they will report Q2, 2024 results at 3:00 PM, Tokyo Standard Time on Aug 08, 2024
お知らせ • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.
お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024.
お知らせ • Feb 15Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024
お知らせ • Dec 05Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024
お知らせ • Nov 21Resonac Holdings Corporation Announces Board ResignationsResonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024.
お知らせ • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
お知らせ • Aug 27Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023
お知らせ • Jun 01Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023
お知らせ • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023.
お知らせ • Dec 09Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023