Resonac Holdings(SHWD.F)株式概要レゾナック・ホールディングス・コーポレーションは、日本、中国、その他のアジア諸国、および国際的な化学会社として事業を展開している。 詳細SHWD.F ファンダメンタル分析スノーフレーク・スコア評価0/6将来の成長3/6過去の実績3/6財務の健全性3/6配当金0/6報酬収益は年間27.56%増加すると予測されています リスク分析負債は営業キャッシュフローで十分にカバーされていない 株式の流動性は非常に低い すべてのリスクチェックを見るSHWD.F Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.Your Fair ValueUS$Current PriceUS$111.8459.8% 割高 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture-74b1t2016201920222025202620282031Revenue JP¥1.3tEarnings JP¥34.3bAdvancedSet Fair ValueView all narrativesResonac Holdings Corporation 競合他社LSB IndustriesSymbol: NYSE:LXUMarket cap: US$1.0bInternational Flavors & FragrancesSymbol: NYSE:IFFMarket cap: US$18.7bCF Industries HoldingsSymbol: NYSE:CFMarket cap: US$19.2bPPG IndustriesSymbol: NYSE:PPGMarket cap: US$22.9b価格と性能株価の高値、安値、推移の概要Resonac Holdings過去の株価現在の株価JP¥111.8452週高値JP¥111.8452週安値JP¥24.40ベータ1.051ヶ月の変化36.21%3ヶ月変化62.02%1年変化n/a3年間の変化611.45%5年間の変化279.12%IPOからの変化2,922.70%最新ニュースお知らせ • May 14Resonac Holdings Corporation to Report Fiscal Year 2026 Results on Feb 15, 2027Resonac Holdings Corporation announced that they will report fiscal year 2026 results at 6:30 AM, Coordinated Universal Time on Feb 15, 2027お知らせ • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026お知らせ • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026お知らせ • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.お知らせ • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026お知らせ • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.最新情報をもっと見るRecent updatesお知らせ • May 14Resonac Holdings Corporation to Report Fiscal Year 2026 Results on Feb 15, 2027Resonac Holdings Corporation announced that they will report fiscal year 2026 results at 6:30 AM, Coordinated Universal Time on Feb 15, 2027お知らせ • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026お知らせ • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026お知らせ • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.お知らせ • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026お知らせ • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.お知らせ • Mar 17Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025お知らせ • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.お知らせ • Feb 14Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025お知らせ • Feb 13Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025.お知らせ • Nov 13Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025お知らせ • Sep 20Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor PackagesResonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages.お知らせ • Aug 09Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025お知らせ • May 17+ 1 more updateResonac Holdings Corporation to Report Q2, 2024 Results on Aug 08, 2024Resonac Holdings Corporation announced that they will report Q2, 2024 results at 3:00 PM, Tokyo Standard Time on Aug 08, 2024お知らせ • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024.お知らせ • Feb 15Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024お知らせ • Dec 05Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024お知らせ • Nov 21Resonac Holdings Corporation Announces Board ResignationsResonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024.お知らせ • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.お知らせ • Aug 27Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023お知らせ • Jun 01Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023お知らせ • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023.お知らせ • Dec 09Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023株主還元SHWD.FUS ChemicalsUS 市場7D36.2%-0.7%-0.3%1Yn/a6.7%24.0%株主還元を見る業界別リターン: SHWD.FがUS Chemicals業界に対してどのようなパフォーマンスを示したかを判断するにはデータが不十分です。リターン対市場: SHWD.F US市場に対してどのようなパフォーマンスを示したかを判断するにはデータが不十分です。価格変動Is SHWD.F's price volatile compared to industry and market?SHWD.F volatilitySHWD.F Average Weekly Movementn/aChemicals Industry Average Movement7.4%Market Average Movement7.2%10% most volatile stocks in US Market16.2%10% least volatile stocks in US Market3.1%安定した株価: SHWD.Fの株価は、 US市場と比較して過去 3 か月間で変動しています。時間の経過による変動: 過去 1 年間のSHWD.Fのボラティリティの変化を判断するには データが不十分です。会社概要設立従業員CEO(最高経営責任者ウェブサイト193921,525Hidehito Takahashiwww.resonac.comレゾナック・ホールディングス・コーポレーションは、日本、中国、その他のアジア、および国際的な化学会社として事業を展開している。半導体・電子材料、モビリティ、イノベーション・イネーブリング・マテリアルズ、化学品の各セグメントで事業を展開している。ガス・溶剤、除害システム・表面処理、CMPスラリー、帯電防止材料、半導体関連材料、ディスプレイ・センサ関連材料、フィルム、プリント配線板用基材・感光材料、電子機器部品用ハードディスク、SiC、光半導体、自動車用樹脂・板成形品、粉末冶金、アルミ製品などを提供。リチウムイオン電池やメカニカルカーボン、セラミックス、樹脂、化粧品原料・医薬品添加剤、モノマー、接着剤、テープ、クロマトグラフィー製品、エラストマーなどを提供している。また、ポリイミド、HDメディア、摩擦材、アルミ重力鋳造製品、食品・医薬品・電子機器用包装・容器、電気絶縁エポキシ樹脂成形品、ジッパーバッグ・テープ、酸化チタン・アルミナ、弾性研磨砥石を提供している。また、ポリプロピレン・ポリエチレン、液化炭酸ガス・ドライアイス・ガス関連機器、液化酸素・窒素・アルゴン、モレキュラーシーブ、黒鉛電極、プラスター・耐火管・壁用サイディング、セメント・湿気取りシート、産業資材、FRP・コーテッドサンド・分離材なども提供している。また、再生医療等医薬品の受託開発・製造、パソコン等業務用機器のリース、給与・福利厚生・金融関連業務のアウトソーシング、合成・分析・SDS作成サービス等も手掛けている。旧社名は昭和電工株式会社で、2023年1月にレゾナックホールディングス株式会社に商号変更した。同社は1939年に設立され、東京に本社を置いている。もっと見るResonac Holdings Corporation 基礎のまとめResonac Holdings の収益と売上を時価総額と比較するとどうか。SHWD.F 基礎統計学時価総額US$19.65b収益(TTM)US$223.96m売上高(TTM)US$8.40b87.7xPER(株価収益率2.3xP/SレシオSHWD.F は割高か?公正価値と評価分析を参照収益と収入最新の決算報告書(TTM)に基づく主な収益性統計SHWD.F 損益計算書(TTM)収益JP¥1.33t売上原価JP¥992.02b売上総利益JP¥341.88bその他の費用JP¥306.32b収益JP¥35.56b直近の収益報告Mar 31, 2026次回決算日Aug 06, 2026一株当たり利益(EPS)196.03グロス・マージン25.63%純利益率2.67%有利子負債/自己資本比率127.5%SHWD.F の長期的なパフォーマンスは?過去の実績と比較を見る配当金0.4%現在の配当利回り33%配当性向View Valuation企業分析と財務データの現状データ最終更新日(UTC時間)企業分析2026/05/17 11:28終値2026/05/12 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM(Trailing Twelve Month)またはLTM(Last Twelve Month)データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Resonac Holdings Corporation 13 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。25 アナリスト機関Mikiya YamadaBarclaysTakashi EnomotoBofA Global ResearchAtsushi IkedaCitigroup Inc22 その他のアナリストを表示
お知らせ • May 14Resonac Holdings Corporation to Report Fiscal Year 2026 Results on Feb 15, 2027Resonac Holdings Corporation announced that they will report fiscal year 2026 results at 6:30 AM, Coordinated Universal Time on Feb 15, 2027
お知らせ • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026
お知らせ • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026
お知らせ • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.
お知らせ • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026
お知らせ • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.
お知らせ • May 14Resonac Holdings Corporation to Report Fiscal Year 2026 Results on Feb 15, 2027Resonac Holdings Corporation announced that they will report fiscal year 2026 results at 6:30 AM, Coordinated Universal Time on Feb 15, 2027
お知らせ • Apr 07+ 1 more updateResonac Holdings Corporation to Report Q3, 2026 Results on Nov 11, 2026Resonac Holdings Corporation announced that they will report Q3, 2026 results at 3:30 PM, Tokyo Standard Time on Nov 11, 2026
お知らせ • Feb 18Resonac Holdings Corporation to Report Q1, 2026 Results on May 13, 2026Resonac Holdings Corporation announced that they will report Q1, 2026 results at 3:30 PM, Tokyo Standard Time on May 13, 2026
お知らせ • Feb 13+ 2 more updatesResonac Holdings Corporation, Annual General Meeting, Mar 26, 2026Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2026.
お知らせ • Nov 15Resonac Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026Resonac Holdings Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Feb 13, 2026
お知らせ • Jul 02RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004).RCapital Partners LLP acquired F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025. RCapital Partners LLP completed the acquisition of F2 Chemicals Ltd from Resonac Holdings Corporation (TSE:4004) on June 30, 2025.
お知らせ • Mar 17Resonac Holdings Corporation to Report Q3, 2025 Results on Nov 13, 2025Resonac Holdings Corporation announced that they will report Q3, 2025 results on Nov 13, 2025
お知らせ • Feb 18+ 1 more updateResonac Holdings Corporation Announces Dividend for the Year Ended December 31, 2024; Provides Dividend Guidance for the Year Ending December 31, 2025Resonac Holdings Corporation announced dividend for the year ended December 31, 2024. For the year, company announced dividend of JPY 65.00 per share against JPY 65.00 per share a year ago. For the year ending December 31, 2025, the company expects to pay a dividend of JPY 65.00 per share compared to JPY 65.00 per share a year ago.
お知らせ • Feb 14Resonac Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025Resonac Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025
お知らせ • Feb 13Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2025.
お知らせ • Nov 13Resonac Holdings Corporation to Report Q1, 2025 Results on May 15, 2025Resonac Holdings Corporation announced that they will report Q1, 2025 results on May 15, 2025
お知らせ • Sep 20Resonac Corporation Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor PackagesResonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region. Easy removal of temporary bonding film by peeling off. Therefore, the performance of the temporary bonding material must be compatible with all fabrication processes, and the residual temporary bonding material must be easily removed. Additionally, debonding process must be completed in a short time without damaging them to achieve high yield and productivity. Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not been preferable. Resonac's temporary debonding film with high heat resistance and chemical resistance exhibits sufficient adhesion performance when wafers and packages are temporarily supported on the carrier. Once they are debonded from the carrier, the film can be removed easily by peeling at room temperature without any residues. The process for debonded the wafer from the carrier adopts Xe flash light irradiation, which allows for large-area batch irradiation and instantaneous high energy output. Instant deformation induced by locally heating a metal layer on the glass carrier with Xe flash light irradiation enables quick debonded of wafers and packages without applying heat or mechanical stress. In addition, as the debonding mechanism is not related to resin decision, this method has the advantage of being a clean process that does not generate any foreign substances, such as soot generated during laser ablation. Resonac believes that this temporary bonding film and new debonding method are suitable for the fabrication process for memory, logic, and power semiconductors as well as advanced semiconductor packages.
お知らせ • Aug 09Resonac Holdings Corporation to Report Fiscal Year 2024 Results on Feb 13, 2025Resonac Holdings Corporation announced that they will report fiscal year 2024 results on Feb 13, 2025
お知らせ • May 17+ 1 more updateResonac Holdings Corporation to Report Q2, 2024 Results on Aug 08, 2024Resonac Holdings Corporation announced that they will report Q2, 2024 results at 3:00 PM, Tokyo Standard Time on Aug 08, 2024
お知らせ • May 16Resonac Holdings Corporation Provides Earnings Guidance for the First Half and Fiscal Year Ending December 31, 2024Resonac Holdings Corporation provided earnings guidance for the first half and fiscal year ending December 31, 2024. For the first half, the company expected net sales to be JPY 670,000 million, Operating income to be JPY 14,000 million.For the year, the company expected net sales to be JPY 1,360,000 million, Operating income to be JPY 47,000 million, Net income attributable to owners of the parent of JPY 25,000 million, and Net income attributable to owners of the parent per share: Basic of JPY 138.34.
お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024Resonac Holdings Corporation, Annual General Meeting, Mar 26, 2024.
お知らせ • Feb 15Resonac Holdings Corporation to Report Q1, 2024 Results on May 15, 2024Resonac Holdings Corporation announced that they will report Q1, 2024 results at 3:00 PM, Tokyo Standard Time on May 15, 2024
お知らせ • Dec 05Resonac Holdings Corporation to Report Fiscal Year 2023 Results on Feb 14, 2024Resonac Holdings Corporation announced that they will report fiscal year 2023 results on Feb 14, 2024
お知らせ • Nov 21Resonac Holdings Corporation Announces Board ResignationsResonac Holdings Corporation decided at its board of directors meeting November 21, 2023 on changes in corporate management (directors and audit & supervisory board members): Kohei Morikawa (Representative Director; Chairman of the Board) will resign as Representative Director. Keiichi Kamiguchi (Board Director; Managing Corporate Officer; Chief Risk Management Officer (CRO)) will resign as Board Director at the General Meeting of Shareholders in late March 2024. Kiyoshi Nishioka (Outside Board Director) will resign as Outside Board Director at the General Meeting of Shareholders in late March 2024. Jun Tanaka (Audit & Supervisory Board Member) will resign as Audit & Supervisory Board Member at the General Meeting of Shareholders in late March 2024. Kiyomi Saito (Outside Member of Audit & Supervisory Board) will resign as Outside Member of Audit & Supervisory Board at the General Meeting of Shareholders in late March 2024.
お知らせ • Nov 11Resonac Holdings Corporation Provides Dividend Guidance for the Year-End 2023Resonac Holdings Corporation provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
お知らせ • Aug 27Resonac Holdings Corporation to Report Q3, 2023 Results on Nov 09, 2023Resonac Holdings Corporation announced that they will report Q3, 2023 results on Nov 09, 2023
お知らせ • Jun 01Resonac Holdings Corporation to Report Q2, 2023 Results on Aug 08, 2023Resonac Holdings Corporation announced that they will report Q2, 2023 results on Aug 08, 2023
お知らせ • May 17+ 1 more updateShowa Denko K.K. Provides Dividend Guidance for the Year-End 2023Showa Denko K.K. provided dividend guidance for the year-end 2023. For the period, company expects dividend of JPY 65.00 per share.
お知らせ • Feb 16Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023Resonac Holdings Corporation, Annual General Meeting, Mar 30, 2023.
お知らせ • Dec 09Showa Denko K.K. to Report Fiscal Year 2022 Results on Feb 14, 2023Showa Denko K.K. announced that they will report fiscal year 2022 results on Feb 14, 2023