MACOM Technology Solutions Holdings（MTSI *）株式概要MACOM Technology Solutions Holdings, Inc.は、その子会社とともに、無線周波数（RF）、マイクロ波、ミリ波、光波スペクトルにわたる無線および有線アプリケーションで使用されるアナログ半導体ソリューションを提供している。 詳細MTSI * ファンダメンタル分析スノーフレーク・スコア評価0/6将来の成長4/6過去の実績0/6財務の健全性6/6配当金0/6報酬収益は年間114.27%増加すると予測されています リスク分析株式の流動性は非常に低い すべてのリスクチェックを見るMTSI * Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.Your Fair ValueMex$Current PriceMex$2.51k75.6% 割高 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture-349m2b2016201920222025202620282031Revenue US$1.6bEarnings US$246.4mAdvancedSet Fair ValueView all narrativesMACOM Technology Solutions Holdings, Inc. 競合他社Vanguard International SemiconductorSymbol: TPEX:5347Market cap: NT$284.8bQorvoSymbol: NasdaqGS:QRVOMarket cap: US$8.8bSilicon Motion TechnologySymbol: NasdaqGS:SIMOMarket cap: US$8.9bCirrus LogicSymbol: NasdaqGS:CRUSMarket cap: US$8.4b価格と性能株価の高値、安値、推移の概要MACOM Technology Solutions Holdings過去の株価現在の株価US$2,512.2152週高値US$2,512.2152週安値US$2,512.21ベータ1.361ヶ月の変化0%3ヶ月変化n/a1年変化n/a3年間の変化n/a5年間の変化n/aIPOからの変化0%最新ニュースお知らせ • Jun 05MACOM Technology Solutions Inc. Announces New Additions to Its RF and Optical Portfolio for Satellite CommunicationsMACOM Technology Solutions Inc. announced new additions to its RF and optical portfolio, designed to meet the evolving needs of the satellite communications (SATCOM) industry. These solutions will be demonstrated in MACOM’s Booth #17035 at the upcoming International Microwave Symposium (IMS 2026) on June 9 to 11, 2026, in Boston, MA. MACOM will demonstrate a transmit and receive solution tailored for direct-to-device (D2D) SATCOM payloads. The transmit lineup includes a driver amplifier and a power amplifier, designed to deliver up to 1 W average output power, 45 dB gain and over 40% efficiency. On the receive side, low noise amplification and integrated bypass capability help maximize sensitivity while maintaining power efficiency. These solutions leverage MACOM’s GaAs and GaN technologies to enable wide bandwidth operation and optimized signal chain performance. This demonstration features a novel thermal compensation attenuator with K- and Ka-Band amplifiers supporting a K- and Ka-Band signal chain. Designed to minimize gain variation over temperature, this solution can improve performance consistency in dynamic environments while simplifying overall system design. This demonstration showcases a 24 dBm power amplifier operating from 80 to 100 GHz and a low noise amplifier operating across 75 to 100 GHz delivering 2.8 dB noise figure with 23 dB gain. MACOM will demonstrate a linearized Q-Band GaN MMIC power amplifier that can significantly improve linear output power and efficiency using advanced analog linearization techniques. This approach supports higher data rates while helping reduce overall power dissipation, addressing the demands of next generation SATCOM. MACOM will also showcase a range of components supporting both FSO and fiber-based links. Highlights include optical SATCOM transport architectures for ground-to-ground, ground-to-satellite and satellite-to-satellite communications, presented through hardware, components and system diagrams.お知らせ • Apr 23MACOM Technology Solutions Holdings, Inc. to Report Q2, 2026 Results on May 07, 2026MACOM Technology Solutions Holdings, Inc. announced that they will report Q2, 2026 results Pre-Market on May 07, 2026お知らせ • Mar 17MACOM Technology Solutions Inc Announces Two New 448G Per Lane Drivers For Data Center ConnectivityMACOM Technology Solutions Inc. had announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market for next generation 1.6T and 3.2T optical transceivers. Exceeding 400G per lane transmission enables the development of dense, high performance optical transceivers with industry-leading energy efficiency to support high capacity data networking solutions in artificial intelligence (AI), machine learning (ML) and high performance computing (HPC) data center architectures. MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver are among the first in the industry to support 400G per lane transmission. These drivers use a proven high volume silicon process technology and support multiple optical platforms including silicon photonics, EML (Electro-absorption Modulated Laser) and TFLN (Thin-Film Lithium Niobate) modulators, enabling customers to scale next generation connectivity systems with confidence and reduced integration risk. The MAOM-025408 Mach-Zehnder Driver can deliver over 120 GHz of RF bandwidth, high gain, output voltage and excellent linearity. It is well-suited for silicon photonics modulators targeting 300G and 400G PAM4 transmission. The MAOM-022404 EML Driver can deliver over 120 GHz of RF bandwidth, well beyond the minimum required for 400G PAM4 transmission, along with high gain and low power consumption. It is ideal for differential EML and TFLN modulators. Both the MAOM-025408 and MAOM-022404 are available as wire-bondable die or bumped die used in compact flip-chip packaging, supporting high volume manufacturing with options for side-by-side and 3D assemblies. No external components are required for biasing the drivers, which leads to simpler integration and bill of materials savings for module vendors. The drivers are on display in MACOM’s Booth 1227 at OFC 2026 from March 17 to 19, 2026 in Los Angeles, CA.お知らせ • Mar 11Macom Technology Solutions Inc. Showcases Innovative Connectivity Solutions At Ofc 2026MACOM Technology Solutions Inc. participated in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM exhibited at Booth 1227, showcasing a broad portfolio of advanced photonics, optoelectronic and copper interconnect solutions supporting AI scale-up and scale-out architectures, cloud infrastructure and access networks. Demonstrations at Booth 1227 included: 3.2 Terabit Optical Transmit Solutions: Preview MACOM’s capabilities to support next generation 400G per lane Pulse Amplitude Modulation (PAM) transmission over single mode fiber (SMF). 1.6 Terabit Solutions: Experience MACOM’s comprehensive 200G per lane ecosystem in a live demo consisting of retimed optics, low power Active Copper Cable (ACC) and Linear Pluggable Optics (LPO) solutions supporting 1.6T links, featuring module and cable manufacturers, in a 102.4T switch ecosystem. PCIe 6.0 and 7.0 Solutions: Learn how MACOM’s portfolio of copper and optical PCIe solutions can help to support higher data throughput and lower latency in longer reach applications. 800G LR2 Module: Showing MACOM’s latest generation, ultra-low power Coherent Lite solutions for campus and scale across applications. This demonstration featured module to module data transmission using high performance transceivers from vendors supporting data rate of 800 Gbps. Continuous Wave (CW) Laser for 800 Gigabit and 1.6 Terabit Modules: Learn about MACOM’s advancements in 75 mW and 100 mW CW laser technology in an 800G OSFP 2xFR4 demonstration. Onboard Equalization: Discover how onboard equalizers can help high-speed signals compensate for lossy PCB to improve signal integrity (SI) for 200G per lane and beyond data rates. OBE can help compensate for signal reflections, dielectric loss, and skin effect loss to extend trace reach and density in data center and HPC applications. Optical Components: Explore a wide range of optical components for outside of the data center, including fronthaul, LiDAR for automotive and robotics applications. MACOM technical staff was available throughout OFC 2026 to discuss application requirements, system architectures and roadmap alignment.お知らせ • Feb 06MACOM Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal Second Quarter Ending April 3, 2026MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal second quarter ending April 3, 2026. For the period, the company expects revenue to be in the range of $281 million to $289 million.お知らせ • Jan 26MACOM Technology Solutions Holdings, Inc. Announces Management PromotionsMACOM Technology Solutions Holdings, Inc. announced the promotions of two senior leaders within the organization to the Senior Vice President level. These promotions further strengthen and expand MACOM’s management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies. Mr. Stephen Ferranti promoted to Senior Vice President Corporate Development and Investor Relations. Mr. Ferranti joined MACOM in 2016 and has recently served as MACOM’s Vice President, Corporate Development and Investor Relations. Mr. Ferranti brings broad-based experience in corporate development, marketing and growth strategies, capital structure and risk management and investor relations. Mr. Ferranti has managed and will continue to oversee MACOM’s strategic acquisition initiatives. Mr. Ferranti has previous experience as a Wall Street sell side analyst, and prior to that semiconductor industry technical experience at two leading hardware companies. Mr. Ferranti earned his Bachelor of Science in Mechanical Engineering from the University at Buffalo, his Master of Science in Mechanical Engineering from Binghamton University and his MBA in Finance from Southern Methodist University. Dr. Gregg Jessen promoted to Senior Vice President, Advanced GaN Technology. Dr. Jessen joined MACOM in 2022 and has recently served as a Distinguished Fellow of Technology. Dr. Jessen brings extensive R&D leadership experience in advanced microelectronics, with a demonstrated history of developing RF GaN on SiC technology and emerging electronic materials for device and MMIC applications. Prior to joining MACOM, Dr. Jessen served as Director of the Microelectronics Center Foundry at BAE Systems, where he was also elected as an Engineering Fellow. Prior to that Dr. Jessen was a Fellow at the Air Force Research Laboratory in the Subsystems and Components Division, leading the development of mm-wave GaN transistor and MMIC technology for radar, communications and electronic warfare applications. Dr. Jessen earned his B.S. in engineering physics from Wright State University and his M.S. and Ph.D. in electrical engineering from The Ohio State University. He has authored or co-authored more than 100 journal articles and conference papers, with over 7,000 citations. Dr. Jessen currently serves as Associate Editor-in-Chief for IEEE Electron Device Letters, a leading journal in the field of electronic devices.最新情報をもっと見るRecent updatesお知らせ • Jun 05MACOM Technology Solutions Inc. Announces New Additions to Its RF and Optical Portfolio for Satellite CommunicationsMACOM Technology Solutions Inc. announced new additions to its RF and optical portfolio, designed to meet the evolving needs of the satellite communications (SATCOM) industry. These solutions will be demonstrated in MACOM’s Booth #17035 at the upcoming International Microwave Symposium (IMS 2026) on June 9 to 11, 2026, in Boston, MA. MACOM will demonstrate a transmit and receive solution tailored for direct-to-device (D2D) SATCOM payloads. The transmit lineup includes a driver amplifier and a power amplifier, designed to deliver up to 1 W average output power, 45 dB gain and over 40% efficiency. On the receive side, low noise amplification and integrated bypass capability help maximize sensitivity while maintaining power efficiency. These solutions leverage MACOM’s GaAs and GaN technologies to enable wide bandwidth operation and optimized signal chain performance. This demonstration features a novel thermal compensation attenuator with K- and Ka-Band amplifiers supporting a K- and Ka-Band signal chain. Designed to minimize gain variation over temperature, this solution can improve performance consistency in dynamic environments while simplifying overall system design. This demonstration showcases a 24 dBm power amplifier operating from 80 to 100 GHz and a low noise amplifier operating across 75 to 100 GHz delivering 2.8 dB noise figure with 23 dB gain. MACOM will demonstrate a linearized Q-Band GaN MMIC power amplifier that can significantly improve linear output power and efficiency using advanced analog linearization techniques. This approach supports higher data rates while helping reduce overall power dissipation, addressing the demands of next generation SATCOM. MACOM will also showcase a range of components supporting both FSO and fiber-based links. Highlights include optical SATCOM transport architectures for ground-to-ground, ground-to-satellite and satellite-to-satellite communications, presented through hardware, components and system diagrams.お知らせ • Apr 23MACOM Technology Solutions Holdings, Inc. to Report Q2, 2026 Results on May 07, 2026MACOM Technology Solutions Holdings, Inc. announced that they will report Q2, 2026 results Pre-Market on May 07, 2026お知らせ • Mar 17MACOM Technology Solutions Inc Announces Two New 448G Per Lane Drivers For Data Center ConnectivityMACOM Technology Solutions Inc. had announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market for next generation 1.6T and 3.2T optical transceivers. Exceeding 400G per lane transmission enables the development of dense, high performance optical transceivers with industry-leading energy efficiency to support high capacity data networking solutions in artificial intelligence (AI), machine learning (ML) and high performance computing (HPC) data center architectures. MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver are among the first in the industry to support 400G per lane transmission. These drivers use a proven high volume silicon process technology and support multiple optical platforms including silicon photonics, EML (Electro-absorption Modulated Laser) and TFLN (Thin-Film Lithium Niobate) modulators, enabling customers to scale next generation connectivity systems with confidence and reduced integration risk. The MAOM-025408 Mach-Zehnder Driver can deliver over 120 GHz of RF bandwidth, high gain, output voltage and excellent linearity. It is well-suited for silicon photonics modulators targeting 300G and 400G PAM4 transmission. The MAOM-022404 EML Driver can deliver over 120 GHz of RF bandwidth, well beyond the minimum required for 400G PAM4 transmission, along with high gain and low power consumption. It is ideal for differential EML and TFLN modulators. Both the MAOM-025408 and MAOM-022404 are available as wire-bondable die or bumped die used in compact flip-chip packaging, supporting high volume manufacturing with options for side-by-side and 3D assemblies. No external components are required for biasing the drivers, which leads to simpler integration and bill of materials savings for module vendors. The drivers are on display in MACOM’s Booth 1227 at OFC 2026 from March 17 to 19, 2026 in Los Angeles, CA.お知らせ • Mar 11Macom Technology Solutions Inc. Showcases Innovative Connectivity Solutions At Ofc 2026MACOM Technology Solutions Inc. participated in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM exhibited at Booth 1227, showcasing a broad portfolio of advanced photonics, optoelectronic and copper interconnect solutions supporting AI scale-up and scale-out architectures, cloud infrastructure and access networks. Demonstrations at Booth 1227 included: 3.2 Terabit Optical Transmit Solutions: Preview MACOM’s capabilities to support next generation 400G per lane Pulse Amplitude Modulation (PAM) transmission over single mode fiber (SMF). 1.6 Terabit Solutions: Experience MACOM’s comprehensive 200G per lane ecosystem in a live demo consisting of retimed optics, low power Active Copper Cable (ACC) and Linear Pluggable Optics (LPO) solutions supporting 1.6T links, featuring module and cable manufacturers, in a 102.4T switch ecosystem. PCIe 6.0 and 7.0 Solutions: Learn how MACOM’s portfolio of copper and optical PCIe solutions can help to support higher data throughput and lower latency in longer reach applications. 800G LR2 Module: Showing MACOM’s latest generation, ultra-low power Coherent Lite solutions for campus and scale across applications. This demonstration featured module to module data transmission using high performance transceivers from vendors supporting data rate of 800 Gbps. Continuous Wave (CW) Laser for 800 Gigabit and 1.6 Terabit Modules: Learn about MACOM’s advancements in 75 mW and 100 mW CW laser technology in an 800G OSFP 2xFR4 demonstration. Onboard Equalization: Discover how onboard equalizers can help high-speed signals compensate for lossy PCB to improve signal integrity (SI) for 200G per lane and beyond data rates. OBE can help compensate for signal reflections, dielectric loss, and skin effect loss to extend trace reach and density in data center and HPC applications. Optical Components: Explore a wide range of optical components for outside of the data center, including fronthaul, LiDAR for automotive and robotics applications. MACOM technical staff was available throughout OFC 2026 to discuss application requirements, system architectures and roadmap alignment.お知らせ • Feb 06MACOM Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal Second Quarter Ending April 3, 2026MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal second quarter ending April 3, 2026. For the period, the company expects revenue to be in the range of $281 million to $289 million.お知らせ • Jan 26MACOM Technology Solutions Holdings, Inc. Announces Management PromotionsMACOM Technology Solutions Holdings, Inc. announced the promotions of two senior leaders within the organization to the Senior Vice President level. These promotions further strengthen and expand MACOM’s management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies. Mr. Stephen Ferranti promoted to Senior Vice President Corporate Development and Investor Relations. Mr. Ferranti joined MACOM in 2016 and has recently served as MACOM’s Vice President, Corporate Development and Investor Relations. Mr. Ferranti brings broad-based experience in corporate development, marketing and growth strategies, capital structure and risk management and investor relations. Mr. Ferranti has managed and will continue to oversee MACOM’s strategic acquisition initiatives. Mr. Ferranti has previous experience as a Wall Street sell side analyst, and prior to that semiconductor industry technical experience at two leading hardware companies. Mr. Ferranti earned his Bachelor of Science in Mechanical Engineering from the University at Buffalo, his Master of Science in Mechanical Engineering from Binghamton University and his MBA in Finance from Southern Methodist University. Dr. Gregg Jessen promoted to Senior Vice President, Advanced GaN Technology. Dr. Jessen joined MACOM in 2022 and has recently served as a Distinguished Fellow of Technology. Dr. Jessen brings extensive R&D leadership experience in advanced microelectronics, with a demonstrated history of developing RF GaN on SiC technology and emerging electronic materials for device and MMIC applications. Prior to joining MACOM, Dr. Jessen served as Director of the Microelectronics Center Foundry at BAE Systems, where he was also elected as an Engineering Fellow. Prior to that Dr. Jessen was a Fellow at the Air Force Research Laboratory in the Subsystems and Components Division, leading the development of mm-wave GaN transistor and MMIC technology for radar, communications and electronic warfare applications. Dr. Jessen earned his B.S. in engineering physics from Wright State University and his M.S. and Ph.D. in electrical engineering from The Ohio State University. He has authored or co-authored more than 100 journal articles and conference papers, with over 7,000 citations. Dr. Jessen currently serves as Associate Editor-in-Chief for IEEE Electron Device Letters, a leading journal in the field of electronic devices.お知らせ • Jan 22MACOM Technology Solutions Holdings, Inc. to Report Q1, 2026 Results on Feb 05, 2026MACOM Technology Solutions Holdings, Inc. announced that they will report Q1, 2026 results Pre-Market on Feb 05, 2026お知らせ • Jan 19MACOM Technology Solutions Holdings, Inc., Annual General Meeting, Mar 05, 2026MACOM Technology Solutions Holdings, Inc., Annual General Meeting, Mar 05, 2026. Location: at the holiday inn express, 8 independence drive, massachusetts 01824., chelmsford, United Statesお知らせ • Jan 13Macom Technology Solutions Holdings, Inc. Appoints Bryan Ingram as Independent Director, Effective January 12, 2026MACOM Technology Solutions Holdings, Inc. announced the appointment of Bryan Ingram as an independent director to MACOM’s Board of Directors, effective January 12, 2026. Bryan Ingram has had a distinguished career, spanning engineering, operations, technical management and executive roles and has successfully managed complex semiconductor businesses in excess of $4 billion dollars in revenue. Prior to his retirement in 2019, Bryan served as Senior Vice President and General Manager of the Wireless Semiconductor Division at Broadcom Inc., having previously served as the Chief Operating Officer for Avago Technologies Limited. From 2005 through 2013, Mr. Ingram served as the Senior Vice President and General Manager of Avago’s Wireless Semiconductor Division. Additionally, Mr. Ingram served in various senior executive positions at other technology organizations, including Vice President and General Manager of Agilent Semiconductor Products Group’s Wireless Semiconductor Division. He began his career at Westinghouse Defense Electronics in 1986. Mr. Ingram holds a Bachelor of Science in Electrical Engineering (BSEE) from the University of Illinois and a Master of Science in Electrical Engineering (MSEE) from Johns Hopkins University.お知らせ • Nov 25MACOM Technology Solutions Holdings, Inc. Announces the Appointment of Robert Dennehy as Senior Vice President and Chief Operating Officer, Effective November 25, 2025MACOM Technology Solutions Holdings, Inc. announced the appointment of Robert Dennehy, age 52, as its Senior Vice President and Chief Operating Officer, effective November 25, 2025 . In this role, Mr. Dennehy will continue to oversee MACOM's global operations, manufacturing, supply chain and operational strategies as the company continues to grow and serve its diverse customer base. Mr. Dennehy’s comprehensive knowledge of the company's operations, manufacturing processes and strategic objectives positions him well to lead MACOM's operational functions and support the company's future growth. Mr. Dennehy has served as Senior Vice President, Operations, since October 2013, and prior to that had served as Vice President, Operations, since March 2011. He previously served as Managing Director of MACOM’s Cork, Ireland subsidiary from 2006 to March 2011. Prior to that, Mr. Dennehy held product management as well as other positions within the Company.お知らせ • Nov 06MACOM Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal First Quarter Ending January 2, 2026MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal first quarter ending January 2, 2026. For the quarter, the company expects revenue to be in the range of $265 million to $273 million.お知らせ • Oct 24MACOM Technology Solutions Holdings, Inc. to Report Q4, 2025 Results on Nov 06, 2025MACOM Technology Solutions Holdings, Inc. announced that they will report Q4, 2025 results Pre-Market on Nov 06, 2025お知らせ • Sep 23MACOM Technology Solutions Inc. to Showcase High Speed Connectivity Solutions at ECOC 2025MACOM Technology Solutions Inc. will showcase its latest analog connectivity solutions at Stand C3419 during the European Conference on Optical Communication (ECOC) in Copenhagen, Denmark from September 29 to October 1, 2025. MACOM’s connectivity portfolio spans a broad range of optical and copper-based technologies supporting leading edge data speeds, including lasers, modulator and laser drivers, linear equalizers, optical clock recovery (OCR) modules, post amplifiers, photodiodes, transimpedance amplifiers, high speed receiver modules and advanced clock and data recovery integrated circuits (ICs). These offerings are engineered to support demanding applications across data center, AI/ML, telecom and networking infrastructures.What to Expect at ECOC 2025: MACOM will host live demonstrations and present advanced semiconductor solutions that are helping to shape the future of high-speed connectivity. Highlights include: 3.2T Transmit Capabilities: Next generation solutions enabling 400G per lane data rates over single mode fiber (SMF).1.6T Technologies: Featuring MACOM’s portfolio of 200G per lane solutions including photodetectors, TIAs, laser drivers, chip stack receive side optical assemblies and active copper cable (ACC) equalizer products. PCIe 6.0 Optical: Showcasing fiber-based PCIe for low latency, long reach applications.100G LPO Ecosystem: Demonstrating interoperability of a complete DSP-free 100G per lane solution with leading equipment and module suppliers.SFP112 Fronthaul Solutions: Presenting a full LPO SFP112 solution for fronthaul applications.お知らせ • Sep 19MACOM Technology Solutions Inc. to Highlight Cutting-Edge RF, Microwave and mmWave Solutions at European Microwave Week 2025MACOM Technology Solutions Inc. invites attendees of European Microwave Week (EuMW) 2025 in Utrecht, Netherlands to visit Booth #D068 from September 23 to 25, 2025 and review its broad portfolio of RF, microwave and millimeter wave (mmWave) product solutions, and foundry services. MACOM will exhibit a variety of demonstrations that highlight its expanding product capabilities for space, radar, RF-over-Fiber (RFoF) and high reliability applications. Attendees will have the opportunity to engage with MACOM's technical experts and explore how its technologies support next-generation performance across commercial and aerospace markets. SATCOM Applications: Ka-Band Power Amplifier (PA) and Low Noise Amplifier (LNA): This shared demo, highlighting the MAAP-011410 10 W PA alongside the MAAL-FR1245 0.2 dB Noise Figure LNA, showcases MACOM's advanced packaging capabilities for high frequency GaN and GaAs technologies in SATCOM applications. Linearized Q-Band PA and V-Band LNA: Featuring the MAAP-FR1423 and CGY2272, this demo targets SATCOM applications. The PA offers stable linearity and thermal performance, while the LNA provides low noise characteristics for high-fidelity signal reception. RFoF Solutions: MACOM will showcase its RFoF transceiver portfolio covering the entire L-, S-, C-, X- and Ku-Bands. Space and Hi-Rel Products: MACOM will display a variety of space and high reliability (Hi-Rel) components for free space optics (FSO) systems, including lasers, laser drivers, various photodiodes and transimpedance amplifiers (TIAs), along with RF-over-fiber analog photonic subsystems used in high performance satellite communication applications. Radar Applications: Ultra LNA for E-Band Applications: The MAAL-FR00003-DIE offers low noise performance and is designed on a space-evaluated process. It is designed to support demanding aerospace environments. SP2T High Power Switch: The MASW-011249 surface mount switch can support continuous wave (CW) power up to+53 dBm across 50 MHz to 6 GHz, suitable for high-power RF switching applications. C-Band 700W RF Power Pallet: The MAPC-P1058 is designed for pulsed radar systems and features multi-stage gain, integrated power management IC and a compact footprint. MACOM Foundry Services: MACOM Foundry Services: MacOM Foundry Services: MACom Foundry Services: MACOM foundry Services: MACOM Foundries Services: MACOM Foundry services: MACOM Foundry Services): Recognized globally for its expertise in GaAs and GaN MMIC technologies, custom packaging and testing. These services span from initial concept to full-scale production.お知らせ • Sep 11MACOM Technology Solutions Inc. Supports PCIe and CXL Connectivity over Optical Fiber with High Performance ChipsetMACOM Technology Solutions Inc. announced the availability of a new chipset to overcome the distance limitations of traditional PCI Express (PCIe) and Compute Express Link (CXL) connectivity by enabling high speed, low latency communication over optical fiber. Designed to maintain signal integrity and reduce latency, the chipset consists of the MATA-38794 transimpedance amplifier (TIA) and the MALD-38795 VCSEL driver. By consolidating sideband signaling into a single fiber pair, MACOM's solution reduces the cost and complexity of optical transceivers and cabling. As data centers and high-performance computing environments demand increasing bandwidth and reach, MACOM's chipset enables PCIe extension up to 100 meters over multimode fiber. The chipset supports eight PCIe 6.0 lanes at 64 Gbps PAM4, while also transporting critical sideband signals including clock, reset, wake and communication channels like USB and Ethernet over an additional fiber. This ensures full PCIe bus transparency across extended distances. PCIe is a key enabler for disaggregated computing, providing high bandwidth connections between components like GPU to GPU and CPUs to memory. Unlike traditional server architectures that rely on bundled hardware and layered network protocols, disaggregated computing uses photonic interconnects to link resources directly. This reduces latency, lowers power consumption and allows flexible scaling and can provide a faster, more efficient computing model. MACOM will demonstrate its new PCIe 6.0 solution at CIOE 2025 in Stand 11D31 from September 10 to 12, 2025 in Shenzhen, China as well as at ECOC 2025 in Booth C3419 from September 29 to October 1, 2025, in Copenhagen, Denmark. Samples are available now for the MATA-38794 TIA and MALD-38795 VCSEL Driver.お知らせ • Aug 08+ 1 more updateMacom Technology Solutions Holdings, Inc. Announces Resignation of Susan Ocampo from the Board, Effective from August 31, 2025MACOM Technology Solutions Holdings, Inc. on August 4, 2025, Susan Ocampo notified the Board of Directors (the “Board”) of the company of her decision to retire from the Board, effective August 31, 2025. Mrs. Ocampo’s decision to retire is not due to any disagreement with MACOM on any matter relating to its operations, policies or practices. Mrs. Ocampo has served as a Director on the Board since August 2010, joining after she and her late husband John Ocampo acquired MACOM in 2009. During her fifteen year tenure, Mrs. Ocampo has been an integral part of MACOM's development, providing exceptional guidance throughout that time.お知らせ • Jul 24MACOM Technology Solutions Holdings, Inc. to Report Q3, 2025 Results on Aug 07, 2025MACOM Technology Solutions Holdings, Inc. announced that they will report Q3, 2025 results Pre-Market on Aug 07, 2025お知らせ • Jun 12Macom Technology Solutions Inc. Announces New Suite of High Performance Rf Solutions Designed to Meet the Demanding Requirements of Advanced Radar SystemsMACOM Technology Solutions Inc. announced a new suite of high performance RF solutions designed to meet the demanding requirements of advanced radar systems. Many of these solutions will be demonstrated in MACOM's Booth 943 at the upcoming International Microwave Symposium (IMS) on June 17 to 19, 2025 in San Francisco, CA. S-Band (2 - 4 GHz): high Power GaN-on-SiC Amplifiers: A new family of 65 V, 50-ohm input and output amplifiers designed for radar applications is now available. Operating over the 2.7 - 3.8 GHz range, these amplifiers can deliver output power up to 800 W. The full portfolio of 65 V S-Band radar products includes the MAPC-A4029, MAPC-A4030, MAPC-A4031 and MAPC-A4032. C-Band (4 - 8 GHz): High Power GaN-on- SiC Amplifier: The MAPC-A4003-AB is a 700 W GaN-on-Sic Power Amplifier (PA). Leveraging MACOM's GaN-on-Si C process technology, the 50-ohm PA is designed to be a compact 700 W solution for 5.2 - 5.9 GHz radar applications. The WSA4501S is a high efficiency GaN MMIC and ideal for large radar arrays. The 50 WGaN-on-SiC MMIC PA features 57% power added efficiency (PAE). It supports radar customers' evolving needs for longer pulse conditions, with capabilities of up to 500 usec and 20% duty cycle from 5.2 - 5. 9 GHz. X-Band (8 - 12 GHz): Compact 1 kW Amplifier Pallet: The MAPC-P1060 is a 1 kW Pulsed PA Pallet offering 52 dB of gain and 30% efficiency, making it ideal for high power microwave systems and radar applications in X-Band frequencies. The pallet integrates MACOM's power management ICs (PMICs) for bias sequencing and temperature compensation. Highly Integrated Front End Module: The WSM5000S Front End Module (FEM) features a GaN-on-SiD power amplifier, GaN-on-SiS switch, and a GaAs low noise amplifier (LNA) with an integrated limiter. In transmit mode, it provides up to 5 W of saturated output power with 40% PAE and 32 dB of gain. The receive side can provide 16 dB of gain with a 2.5 dB of noise figure and 21 dBm OIP3. The integrated limiter provides receive side protection. Ku-Band (12 - 18 GHz): High Power GaN - 18 GHz): High PowerGaN-on-Si C MMIC offers high output power and efficiency. It can provide can up to 80 W of saturated output power with 25 dB of large signal gain and 35% power added efficiency (PA E) in pulsed operation. It is available in multiple formats, including bare die, surface mount QFN and flange.お知らせ • May 28MACOM Showcases Advanced Rf and Microwave Solutions At IMS 2025MACOM Technology Solutions Inc. will showcase its broad portfolio of high performance RF, microwave and millimeter wave (mmWave) solutions and foundry services at the International Microwave Symposium (IMS) 2025, taking place June 15 to 20, 2025 at the Moscone Center in San Francisco, California. MACOM's technical experts will be available to highlight its performance advantages, and the company will also have a full lineup of technical presentations throughout the show. At Booth #943, MACOM will feature 16 hands-on technology demonstrations showcasing real-time performance and results, including many of the company's new products for EW, radar and SATCOM applications. Demonstrations will include a high performance wideband low noise amplifier (LNA) and power amplifier (PA); X-Band PA pallet and front end module; C-Band linearizers and PAs; Q-Band linearizer; Ka-Band and Ku-Band PAs; E-Band upconverter and LNA; 2 to 18 GHz solutions including an integrated switched filter bank; transmit/receive module (TRM) and time delay unit (TDU); switches and limiters as well as a display of a wide variety of RF, microwave and mmWave products. Booth #1143 will present MACOM's Foundry Services, highlighting its deep expertise in Gallium Nitride (GaN) and Gallium Arsenide (GaAs) process technologies. The company's foundry capabilities support the entire product development lifecycle - from design assistance and scalable device models to production-ready processes and quality testing. MACOM's foundry team will be available to discuss how its services can help customers move from initial development through high volume manufacturing with proven high first-pass design success and process reliability. MACOM has been selected by IEEE MTT-S to present several technical sessions during IMS 2025, covering topics such as GaN power amplifier (PA) waveform engineering, high efficiency PAs for 6G and MIMO applications, X-Band MMIC designs and Ka-Band LNA innovations.お知らせ • May 08Macom Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal Third Quarter Ending July 4, 2025MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal third quarter ending July 4, 2025. For the quarter company expected revenue to be in the range of $246 million to $254 million.お知らせ • Apr 24MACOM Technology Solutions Holdings, Inc. to Report Q2, 2025 Results on May 08, 2025MACOM Technology Solutions Holdings, Inc. announced that they will report Q2, 2025 results Pre-Market on May 08, 2025お知らせ • Nov 07MACOM Technology Solutions Holdings, Inc. (NasdaqGS:MTSI) acquired Engin-Ic, Inc.MACOM Technology Solutions Holdings, Inc. (NasdaqGS:MTSI) acquired Engin-Ic, Inc. on November 6, 2024. A cash consideration will be paid by MACOM Technology Solutions Holdings, Inc. As part of consideration, an undisclosed value is paid towards common equity of Engin-Ic, Inc. MACOM Technology Solutions Holdings, Inc. (NasdaqGS:MTSI) completed the acquisition of Engin-Ic, Inc. on November 6, 2024株主還元MTSI *MX SemiconductorMX 市場7D0%0%0%1Yn/a0%0%株主還元を見る業界別リターン: MTSI *がMX Semiconductor業界に対してどのようなパフォーマンスを示したかを判断するにはデータが不十分です。リターン対市場: MTSI * MX市場に対してどのようなパフォーマンスを示したかを判断するにはデータが不十分です。価格変動Is MTSI *'s price volatile compared to industry and market?MTSI * volatilityMTSI * Average Weekly Movementn/aSemiconductor Industry Average Movement0%Market Average Movement0%10% most volatile stocks in MX Market0%10% least volatile stocks in MX Market0%安定した株価: MTSI *の株価は、 MX市場と比較して過去 3 か月間で変動しています。時間の経過による変動: 過去 1 年間のMTSI *のボラティリティの変化を判断するには データが不十分です。会社概要設立従業員CEO（最高経営責任者ウェブサイト19501,700Steve Dalywww.macom.comMACOM Technology Solutions Holdings, Inc.は、その子会社とともに、無線周波数（RF）、マイクロ波、ミリ波、光波スペクトルにわたる無線および有線アプリケーションで使用されるアナログ半導体ソリューションを提供しています。同社は、集積回路、マルチチップモジュール、ダイオード、アンプ、スイッチおよびスイッチリミッタ、受動および能動部品、サブシステムなどの標準およびカスタムデバイスのポートフォリオを提供している。同社の半導体製品は、無線基地局、大容量光ネットワーク、レーダー、医療システム、衛星ネットワーク、テスト・計測アプリケーションなどの電子システムに組み込まれる電子部品である。同社は、長距離/メトロ、5Gおよび6Gインフラ、衛星通信、ファイバー・ツー・ザ・エックス/パッシブ光ネットワークを含む通信インフラ、軍用および商用レーダー、RFジャマー、電子対策、通信データリンクを含む産業および防衛、産業、医療、テストおよび測定、科学アプリケーションなどのマルチマーケットアプリケーション、データセンターなど、さまざまな市場にサービスを提供している。直販部隊、アプリケーションエンジニアリングスタッフ、独立系販売代理店、再販業者、ディストリビューターを通じて製品を販売している。同社は、米国、中国、日本、シンガポール、韓国、台湾、および海外で事業を展開している。MACOM Technology Solutions Holdings, Inc.の前身はM/A-Com Technology Solutions Holdings, Inc.で、2016年6月に社名をMACOM Technology Solutions Holdings, Inc.に変更した。同社は1950年に設立され、マサチューセッツ州ローウェルに本社を置いている。もっと見るMACOM Technology Solutions Holdings, Inc. 基礎のまとめMACOM Technology Solutions Holdings の収益と売上を時価総額と比較するとどうか。MTSI * 基礎統計学時価総額Mex$178.86b収益（TTM）-Mex$1.68b売上高(TTM)Mex$16.46b10.9xP/Sレシオ-106.2xPER（株価収益率MTSI * は割高か？公正価値と評価分析を参照収益と収入最新の決算報告書（TTM）に基づく主な収益性統計MTSI * 損益計算書（TTM）収益US$845.21m売上原価US$386.69m売上総利益US$458.52mその他の費用US$545.03m収益-US$86.51m直近の収益報告Apr 04, 2025次回決算日該当なし一株当たり利益（EPS）-1.16グロス・マージン54.25%純利益率-10.24%有利子負債／自己資本比率42.3%MTSI * の長期的なパフォーマンスは？過去の実績と比較を見るView Valuation企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2025/05/18 18:03終値2025/02/18 00:00収益2025/04/04年間収益2024/09/27データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋MACOM Technology Solutions Holdings, Inc. 15 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。20 アナリスト機関Thomas O'MalleyBarclaysBlayne CurtisBarclaysKarl AckermanBNP Paribas17 その他のアナリストを表示
お知らせ • Jun 05MACOM Technology Solutions Inc. Announces New Additions to Its RF and Optical Portfolio for Satellite CommunicationsMACOM Technology Solutions Inc. announced new additions to its RF and optical portfolio, designed to meet the evolving needs of the satellite communications (SATCOM) industry. These solutions will be demonstrated in MACOM’s Booth #17035 at the upcoming International Microwave Symposium (IMS 2026) on June 9 to 11, 2026, in Boston, MA. MACOM will demonstrate a transmit and receive solution tailored for direct-to-device (D2D) SATCOM payloads. The transmit lineup includes a driver amplifier and a power amplifier, designed to deliver up to 1 W average output power, 45 dB gain and over 40% efficiency. On the receive side, low noise amplification and integrated bypass capability help maximize sensitivity while maintaining power efficiency. These solutions leverage MACOM’s GaAs and GaN technologies to enable wide bandwidth operation and optimized signal chain performance. This demonstration features a novel thermal compensation attenuator with K- and Ka-Band amplifiers supporting a K- and Ka-Band signal chain. Designed to minimize gain variation over temperature, this solution can improve performance consistency in dynamic environments while simplifying overall system design. This demonstration showcases a 24 dBm power amplifier operating from 80 to 100 GHz and a low noise amplifier operating across 75 to 100 GHz delivering 2.8 dB noise figure with 23 dB gain. MACOM will demonstrate a linearized Q-Band GaN MMIC power amplifier that can significantly improve linear output power and efficiency using advanced analog linearization techniques. This approach supports higher data rates while helping reduce overall power dissipation, addressing the demands of next generation SATCOM. MACOM will also showcase a range of components supporting both FSO and fiber-based links. Highlights include optical SATCOM transport architectures for ground-to-ground, ground-to-satellite and satellite-to-satellite communications, presented through hardware, components and system diagrams.
お知らせ • Apr 23MACOM Technology Solutions Holdings, Inc. to Report Q2, 2026 Results on May 07, 2026MACOM Technology Solutions Holdings, Inc. announced that they will report Q2, 2026 results Pre-Market on May 07, 2026
お知らせ • Mar 17MACOM Technology Solutions Inc Announces Two New 448G Per Lane Drivers For Data Center ConnectivityMACOM Technology Solutions Inc. had announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market for next generation 1.6T and 3.2T optical transceivers. Exceeding 400G per lane transmission enables the development of dense, high performance optical transceivers with industry-leading energy efficiency to support high capacity data networking solutions in artificial intelligence (AI), machine learning (ML) and high performance computing (HPC) data center architectures. MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver are among the first in the industry to support 400G per lane transmission. These drivers use a proven high volume silicon process technology and support multiple optical platforms including silicon photonics, EML (Electro-absorption Modulated Laser) and TFLN (Thin-Film Lithium Niobate) modulators, enabling customers to scale next generation connectivity systems with confidence and reduced integration risk. The MAOM-025408 Mach-Zehnder Driver can deliver over 120 GHz of RF bandwidth, high gain, output voltage and excellent linearity. It is well-suited for silicon photonics modulators targeting 300G and 400G PAM4 transmission. The MAOM-022404 EML Driver can deliver over 120 GHz of RF bandwidth, well beyond the minimum required for 400G PAM4 transmission, along with high gain and low power consumption. It is ideal for differential EML and TFLN modulators. Both the MAOM-025408 and MAOM-022404 are available as wire-bondable die or bumped die used in compact flip-chip packaging, supporting high volume manufacturing with options for side-by-side and 3D assemblies. No external components are required for biasing the drivers, which leads to simpler integration and bill of materials savings for module vendors. The drivers are on display in MACOM’s Booth 1227 at OFC 2026 from March 17 to 19, 2026 in Los Angeles, CA.
お知らせ • Mar 11Macom Technology Solutions Inc. Showcases Innovative Connectivity Solutions At Ofc 2026MACOM Technology Solutions Inc. participated in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM exhibited at Booth 1227, showcasing a broad portfolio of advanced photonics, optoelectronic and copper interconnect solutions supporting AI scale-up and scale-out architectures, cloud infrastructure and access networks. Demonstrations at Booth 1227 included: 3.2 Terabit Optical Transmit Solutions: Preview MACOM’s capabilities to support next generation 400G per lane Pulse Amplitude Modulation (PAM) transmission over single mode fiber (SMF). 1.6 Terabit Solutions: Experience MACOM’s comprehensive 200G per lane ecosystem in a live demo consisting of retimed optics, low power Active Copper Cable (ACC) and Linear Pluggable Optics (LPO) solutions supporting 1.6T links, featuring module and cable manufacturers, in a 102.4T switch ecosystem. PCIe 6.0 and 7.0 Solutions: Learn how MACOM’s portfolio of copper and optical PCIe solutions can help to support higher data throughput and lower latency in longer reach applications. 800G LR2 Module: Showing MACOM’s latest generation, ultra-low power Coherent Lite solutions for campus and scale across applications. This demonstration featured module to module data transmission using high performance transceivers from vendors supporting data rate of 800 Gbps. Continuous Wave (CW) Laser for 800 Gigabit and 1.6 Terabit Modules: Learn about MACOM’s advancements in 75 mW and 100 mW CW laser technology in an 800G OSFP 2xFR4 demonstration. Onboard Equalization: Discover how onboard equalizers can help high-speed signals compensate for lossy PCB to improve signal integrity (SI) for 200G per lane and beyond data rates. OBE can help compensate for signal reflections, dielectric loss, and skin effect loss to extend trace reach and density in data center and HPC applications. Optical Components: Explore a wide range of optical components for outside of the data center, including fronthaul, LiDAR for automotive and robotics applications. MACOM technical staff was available throughout OFC 2026 to discuss application requirements, system architectures and roadmap alignment.
お知らせ • Feb 06MACOM Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal Second Quarter Ending April 3, 2026MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal second quarter ending April 3, 2026. For the period, the company expects revenue to be in the range of $281 million to $289 million.
お知らせ • Jan 26MACOM Technology Solutions Holdings, Inc. Announces Management PromotionsMACOM Technology Solutions Holdings, Inc. announced the promotions of two senior leaders within the organization to the Senior Vice President level. These promotions further strengthen and expand MACOM’s management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies. Mr. Stephen Ferranti promoted to Senior Vice President Corporate Development and Investor Relations. Mr. Ferranti joined MACOM in 2016 and has recently served as MACOM’s Vice President, Corporate Development and Investor Relations. Mr. Ferranti brings broad-based experience in corporate development, marketing and growth strategies, capital structure and risk management and investor relations. Mr. Ferranti has managed and will continue to oversee MACOM’s strategic acquisition initiatives. Mr. Ferranti has previous experience as a Wall Street sell side analyst, and prior to that semiconductor industry technical experience at two leading hardware companies. Mr. Ferranti earned his Bachelor of Science in Mechanical Engineering from the University at Buffalo, his Master of Science in Mechanical Engineering from Binghamton University and his MBA in Finance from Southern Methodist University. Dr. Gregg Jessen promoted to Senior Vice President, Advanced GaN Technology. Dr. Jessen joined MACOM in 2022 and has recently served as a Distinguished Fellow of Technology. Dr. Jessen brings extensive R&D leadership experience in advanced microelectronics, with a demonstrated history of developing RF GaN on SiC technology and emerging electronic materials for device and MMIC applications. Prior to joining MACOM, Dr. Jessen served as Director of the Microelectronics Center Foundry at BAE Systems, where he was also elected as an Engineering Fellow. Prior to that Dr. Jessen was a Fellow at the Air Force Research Laboratory in the Subsystems and Components Division, leading the development of mm-wave GaN transistor and MMIC technology for radar, communications and electronic warfare applications. Dr. Jessen earned his B.S. in engineering physics from Wright State University and his M.S. and Ph.D. in electrical engineering from The Ohio State University. He has authored or co-authored more than 100 journal articles and conference papers, with over 7,000 citations. Dr. Jessen currently serves as Associate Editor-in-Chief for IEEE Electron Device Letters, a leading journal in the field of electronic devices.
お知らせ • Jun 05MACOM Technology Solutions Inc. Announces New Additions to Its RF and Optical Portfolio for Satellite CommunicationsMACOM Technology Solutions Inc. announced new additions to its RF and optical portfolio, designed to meet the evolving needs of the satellite communications (SATCOM) industry. These solutions will be demonstrated in MACOM’s Booth #17035 at the upcoming International Microwave Symposium (IMS 2026) on June 9 to 11, 2026, in Boston, MA. MACOM will demonstrate a transmit and receive solution tailored for direct-to-device (D2D) SATCOM payloads. The transmit lineup includes a driver amplifier and a power amplifier, designed to deliver up to 1 W average output power, 45 dB gain and over 40% efficiency. On the receive side, low noise amplification and integrated bypass capability help maximize sensitivity while maintaining power efficiency. These solutions leverage MACOM’s GaAs and GaN technologies to enable wide bandwidth operation and optimized signal chain performance. This demonstration features a novel thermal compensation attenuator with K- and Ka-Band amplifiers supporting a K- and Ka-Band signal chain. Designed to minimize gain variation over temperature, this solution can improve performance consistency in dynamic environments while simplifying overall system design. This demonstration showcases a 24 dBm power amplifier operating from 80 to 100 GHz and a low noise amplifier operating across 75 to 100 GHz delivering 2.8 dB noise figure with 23 dB gain. MACOM will demonstrate a linearized Q-Band GaN MMIC power amplifier that can significantly improve linear output power and efficiency using advanced analog linearization techniques. This approach supports higher data rates while helping reduce overall power dissipation, addressing the demands of next generation SATCOM. MACOM will also showcase a range of components supporting both FSO and fiber-based links. Highlights include optical SATCOM transport architectures for ground-to-ground, ground-to-satellite and satellite-to-satellite communications, presented through hardware, components and system diagrams.
お知らせ • Apr 23MACOM Technology Solutions Holdings, Inc. to Report Q2, 2026 Results on May 07, 2026MACOM Technology Solutions Holdings, Inc. announced that they will report Q2, 2026 results Pre-Market on May 07, 2026
お知らせ • Mar 17MACOM Technology Solutions Inc Announces Two New 448G Per Lane Drivers For Data Center ConnectivityMACOM Technology Solutions Inc. had announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market for next generation 1.6T and 3.2T optical transceivers. Exceeding 400G per lane transmission enables the development of dense, high performance optical transceivers with industry-leading energy efficiency to support high capacity data networking solutions in artificial intelligence (AI), machine learning (ML) and high performance computing (HPC) data center architectures. MACOM’s new MAOM-025408 Mach-Zehnder Driver and MAOM-022404 EML Driver are among the first in the industry to support 400G per lane transmission. These drivers use a proven high volume silicon process technology and support multiple optical platforms including silicon photonics, EML (Electro-absorption Modulated Laser) and TFLN (Thin-Film Lithium Niobate) modulators, enabling customers to scale next generation connectivity systems with confidence and reduced integration risk. The MAOM-025408 Mach-Zehnder Driver can deliver over 120 GHz of RF bandwidth, high gain, output voltage and excellent linearity. It is well-suited for silicon photonics modulators targeting 300G and 400G PAM4 transmission. The MAOM-022404 EML Driver can deliver over 120 GHz of RF bandwidth, well beyond the minimum required for 400G PAM4 transmission, along with high gain and low power consumption. It is ideal for differential EML and TFLN modulators. Both the MAOM-025408 and MAOM-022404 are available as wire-bondable die or bumped die used in compact flip-chip packaging, supporting high volume manufacturing with options for side-by-side and 3D assemblies. No external components are required for biasing the drivers, which leads to simpler integration and bill of materials savings for module vendors. The drivers are on display in MACOM’s Booth 1227 at OFC 2026 from March 17 to 19, 2026 in Los Angeles, CA.
お知らせ • Mar 11Macom Technology Solutions Inc. Showcases Innovative Connectivity Solutions At Ofc 2026MACOM Technology Solutions Inc. participated in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM exhibited at Booth 1227, showcasing a broad portfolio of advanced photonics, optoelectronic and copper interconnect solutions supporting AI scale-up and scale-out architectures, cloud infrastructure and access networks. Demonstrations at Booth 1227 included: 3.2 Terabit Optical Transmit Solutions: Preview MACOM’s capabilities to support next generation 400G per lane Pulse Amplitude Modulation (PAM) transmission over single mode fiber (SMF). 1.6 Terabit Solutions: Experience MACOM’s comprehensive 200G per lane ecosystem in a live demo consisting of retimed optics, low power Active Copper Cable (ACC) and Linear Pluggable Optics (LPO) solutions supporting 1.6T links, featuring module and cable manufacturers, in a 102.4T switch ecosystem. PCIe 6.0 and 7.0 Solutions: Learn how MACOM’s portfolio of copper and optical PCIe solutions can help to support higher data throughput and lower latency in longer reach applications. 800G LR2 Module: Showing MACOM’s latest generation, ultra-low power Coherent Lite solutions for campus and scale across applications. This demonstration featured module to module data transmission using high performance transceivers from vendors supporting data rate of 800 Gbps. Continuous Wave (CW) Laser for 800 Gigabit and 1.6 Terabit Modules: Learn about MACOM’s advancements in 75 mW and 100 mW CW laser technology in an 800G OSFP 2xFR4 demonstration. Onboard Equalization: Discover how onboard equalizers can help high-speed signals compensate for lossy PCB to improve signal integrity (SI) for 200G per lane and beyond data rates. OBE can help compensate for signal reflections, dielectric loss, and skin effect loss to extend trace reach and density in data center and HPC applications. Optical Components: Explore a wide range of optical components for outside of the data center, including fronthaul, LiDAR for automotive and robotics applications. MACOM technical staff was available throughout OFC 2026 to discuss application requirements, system architectures and roadmap alignment.
お知らせ • Feb 06MACOM Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal Second Quarter Ending April 3, 2026MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal second quarter ending April 3, 2026. For the period, the company expects revenue to be in the range of $281 million to $289 million.
お知らせ • Jan 26MACOM Technology Solutions Holdings, Inc. Announces Management PromotionsMACOM Technology Solutions Holdings, Inc. announced the promotions of two senior leaders within the organization to the Senior Vice President level. These promotions further strengthen and expand MACOM’s management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies. Mr. Stephen Ferranti promoted to Senior Vice President Corporate Development and Investor Relations. Mr. Ferranti joined MACOM in 2016 and has recently served as MACOM’s Vice President, Corporate Development and Investor Relations. Mr. Ferranti brings broad-based experience in corporate development, marketing and growth strategies, capital structure and risk management and investor relations. Mr. Ferranti has managed and will continue to oversee MACOM’s strategic acquisition initiatives. Mr. Ferranti has previous experience as a Wall Street sell side analyst, and prior to that semiconductor industry technical experience at two leading hardware companies. Mr. Ferranti earned his Bachelor of Science in Mechanical Engineering from the University at Buffalo, his Master of Science in Mechanical Engineering from Binghamton University and his MBA in Finance from Southern Methodist University. Dr. Gregg Jessen promoted to Senior Vice President, Advanced GaN Technology. Dr. Jessen joined MACOM in 2022 and has recently served as a Distinguished Fellow of Technology. Dr. Jessen brings extensive R&D leadership experience in advanced microelectronics, with a demonstrated history of developing RF GaN on SiC technology and emerging electronic materials for device and MMIC applications. Prior to joining MACOM, Dr. Jessen served as Director of the Microelectronics Center Foundry at BAE Systems, where he was also elected as an Engineering Fellow. Prior to that Dr. Jessen was a Fellow at the Air Force Research Laboratory in the Subsystems and Components Division, leading the development of mm-wave GaN transistor and MMIC technology for radar, communications and electronic warfare applications. Dr. Jessen earned his B.S. in engineering physics from Wright State University and his M.S. and Ph.D. in electrical engineering from The Ohio State University. He has authored or co-authored more than 100 journal articles and conference papers, with over 7,000 citations. Dr. Jessen currently serves as Associate Editor-in-Chief for IEEE Electron Device Letters, a leading journal in the field of electronic devices.
お知らせ • Jan 22MACOM Technology Solutions Holdings, Inc. to Report Q1, 2026 Results on Feb 05, 2026MACOM Technology Solutions Holdings, Inc. announced that they will report Q1, 2026 results Pre-Market on Feb 05, 2026
お知らせ • Jan 19MACOM Technology Solutions Holdings, Inc., Annual General Meeting, Mar 05, 2026MACOM Technology Solutions Holdings, Inc., Annual General Meeting, Mar 05, 2026. Location: at the holiday inn express, 8 independence drive, massachusetts 01824., chelmsford, United States
お知らせ • Jan 13Macom Technology Solutions Holdings, Inc. Appoints Bryan Ingram as Independent Director, Effective January 12, 2026MACOM Technology Solutions Holdings, Inc. announced the appointment of Bryan Ingram as an independent director to MACOM’s Board of Directors, effective January 12, 2026. Bryan Ingram has had a distinguished career, spanning engineering, operations, technical management and executive roles and has successfully managed complex semiconductor businesses in excess of $4 billion dollars in revenue. Prior to his retirement in 2019, Bryan served as Senior Vice President and General Manager of the Wireless Semiconductor Division at Broadcom Inc., having previously served as the Chief Operating Officer for Avago Technologies Limited. From 2005 through 2013, Mr. Ingram served as the Senior Vice President and General Manager of Avago’s Wireless Semiconductor Division. Additionally, Mr. Ingram served in various senior executive positions at other technology organizations, including Vice President and General Manager of Agilent Semiconductor Products Group’s Wireless Semiconductor Division. He began his career at Westinghouse Defense Electronics in 1986. Mr. Ingram holds a Bachelor of Science in Electrical Engineering (BSEE) from the University of Illinois and a Master of Science in Electrical Engineering (MSEE) from Johns Hopkins University.
お知らせ • Nov 25MACOM Technology Solutions Holdings, Inc. Announces the Appointment of Robert Dennehy as Senior Vice President and Chief Operating Officer, Effective November 25, 2025MACOM Technology Solutions Holdings, Inc. announced the appointment of Robert Dennehy, age 52, as its Senior Vice President and Chief Operating Officer, effective November 25, 2025 . In this role, Mr. Dennehy will continue to oversee MACOM's global operations, manufacturing, supply chain and operational strategies as the company continues to grow and serve its diverse customer base. Mr. Dennehy’s comprehensive knowledge of the company's operations, manufacturing processes and strategic objectives positions him well to lead MACOM's operational functions and support the company's future growth. Mr. Dennehy has served as Senior Vice President, Operations, since October 2013, and prior to that had served as Vice President, Operations, since March 2011. He previously served as Managing Director of MACOM’s Cork, Ireland subsidiary from 2006 to March 2011. Prior to that, Mr. Dennehy held product management as well as other positions within the Company.
お知らせ • Nov 06MACOM Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal First Quarter Ending January 2, 2026MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal first quarter ending January 2, 2026. For the quarter, the company expects revenue to be in the range of $265 million to $273 million.
お知らせ • Oct 24MACOM Technology Solutions Holdings, Inc. to Report Q4, 2025 Results on Nov 06, 2025MACOM Technology Solutions Holdings, Inc. announced that they will report Q4, 2025 results Pre-Market on Nov 06, 2025
お知らせ • Sep 23MACOM Technology Solutions Inc. to Showcase High Speed Connectivity Solutions at ECOC 2025MACOM Technology Solutions Inc. will showcase its latest analog connectivity solutions at Stand C3419 during the European Conference on Optical Communication (ECOC) in Copenhagen, Denmark from September 29 to October 1, 2025. MACOM’s connectivity portfolio spans a broad range of optical and copper-based technologies supporting leading edge data speeds, including lasers, modulator and laser drivers, linear equalizers, optical clock recovery (OCR) modules, post amplifiers, photodiodes, transimpedance amplifiers, high speed receiver modules and advanced clock and data recovery integrated circuits (ICs). These offerings are engineered to support demanding applications across data center, AI/ML, telecom and networking infrastructures.What to Expect at ECOC 2025: MACOM will host live demonstrations and present advanced semiconductor solutions that are helping to shape the future of high-speed connectivity. Highlights include: 3.2T Transmit Capabilities: Next generation solutions enabling 400G per lane data rates over single mode fiber (SMF).1.6T Technologies: Featuring MACOM’s portfolio of 200G per lane solutions including photodetectors, TIAs, laser drivers, chip stack receive side optical assemblies and active copper cable (ACC) equalizer products. PCIe 6.0 Optical: Showcasing fiber-based PCIe for low latency, long reach applications.100G LPO Ecosystem: Demonstrating interoperability of a complete DSP-free 100G per lane solution with leading equipment and module suppliers.SFP112 Fronthaul Solutions: Presenting a full LPO SFP112 solution for fronthaul applications.
お知らせ • Sep 19MACOM Technology Solutions Inc. to Highlight Cutting-Edge RF, Microwave and mmWave Solutions at European Microwave Week 2025MACOM Technology Solutions Inc. invites attendees of European Microwave Week (EuMW) 2025 in Utrecht, Netherlands to visit Booth #D068 from September 23 to 25, 2025 and review its broad portfolio of RF, microwave and millimeter wave (mmWave) product solutions, and foundry services. MACOM will exhibit a variety of demonstrations that highlight its expanding product capabilities for space, radar, RF-over-Fiber (RFoF) and high reliability applications. Attendees will have the opportunity to engage with MACOM's technical experts and explore how its technologies support next-generation performance across commercial and aerospace markets. SATCOM Applications: Ka-Band Power Amplifier (PA) and Low Noise Amplifier (LNA): This shared demo, highlighting the MAAP-011410 10 W PA alongside the MAAL-FR1245 0.2 dB Noise Figure LNA, showcases MACOM's advanced packaging capabilities for high frequency GaN and GaAs technologies in SATCOM applications. Linearized Q-Band PA and V-Band LNA: Featuring the MAAP-FR1423 and CGY2272, this demo targets SATCOM applications. The PA offers stable linearity and thermal performance, while the LNA provides low noise characteristics for high-fidelity signal reception. RFoF Solutions: MACOM will showcase its RFoF transceiver portfolio covering the entire L-, S-, C-, X- and Ku-Bands. Space and Hi-Rel Products: MACOM will display a variety of space and high reliability (Hi-Rel) components for free space optics (FSO) systems, including lasers, laser drivers, various photodiodes and transimpedance amplifiers (TIAs), along with RF-over-fiber analog photonic subsystems used in high performance satellite communication applications. Radar Applications: Ultra LNA for E-Band Applications: The MAAL-FR00003-DIE offers low noise performance and is designed on a space-evaluated process. It is designed to support demanding aerospace environments. SP2T High Power Switch: The MASW-011249 surface mount switch can support continuous wave (CW) power up to+53 dBm across 50 MHz to 6 GHz, suitable for high-power RF switching applications. C-Band 700W RF Power Pallet: The MAPC-P1058 is designed for pulsed radar systems and features multi-stage gain, integrated power management IC and a compact footprint. MACOM Foundry Services: MACOM Foundry Services: MacOM Foundry Services: MACom Foundry Services: MACOM foundry Services: MACOM Foundries Services: MACOM Foundry services: MACOM Foundry Services): Recognized globally for its expertise in GaAs and GaN MMIC technologies, custom packaging and testing. These services span from initial concept to full-scale production.
お知らせ • Sep 11MACOM Technology Solutions Inc. Supports PCIe and CXL Connectivity over Optical Fiber with High Performance ChipsetMACOM Technology Solutions Inc. announced the availability of a new chipset to overcome the distance limitations of traditional PCI Express (PCIe) and Compute Express Link (CXL) connectivity by enabling high speed, low latency communication over optical fiber. Designed to maintain signal integrity and reduce latency, the chipset consists of the MATA-38794 transimpedance amplifier (TIA) and the MALD-38795 VCSEL driver. By consolidating sideband signaling into a single fiber pair, MACOM's solution reduces the cost and complexity of optical transceivers and cabling. As data centers and high-performance computing environments demand increasing bandwidth and reach, MACOM's chipset enables PCIe extension up to 100 meters over multimode fiber. The chipset supports eight PCIe 6.0 lanes at 64 Gbps PAM4, while also transporting critical sideband signals including clock, reset, wake and communication channels like USB and Ethernet over an additional fiber. This ensures full PCIe bus transparency across extended distances. PCIe is a key enabler for disaggregated computing, providing high bandwidth connections between components like GPU to GPU and CPUs to memory. Unlike traditional server architectures that rely on bundled hardware and layered network protocols, disaggregated computing uses photonic interconnects to link resources directly. This reduces latency, lowers power consumption and allows flexible scaling and can provide a faster, more efficient computing model. MACOM will demonstrate its new PCIe 6.0 solution at CIOE 2025 in Stand 11D31 from September 10 to 12, 2025 in Shenzhen, China as well as at ECOC 2025 in Booth C3419 from September 29 to October 1, 2025, in Copenhagen, Denmark. Samples are available now for the MATA-38794 TIA and MALD-38795 VCSEL Driver.
お知らせ • Aug 08+ 1 more updateMacom Technology Solutions Holdings, Inc. Announces Resignation of Susan Ocampo from the Board, Effective from August 31, 2025MACOM Technology Solutions Holdings, Inc. on August 4, 2025, Susan Ocampo notified the Board of Directors (the “Board”) of the company of her decision to retire from the Board, effective August 31, 2025. Mrs. Ocampo’s decision to retire is not due to any disagreement with MACOM on any matter relating to its operations, policies or practices. Mrs. Ocampo has served as a Director on the Board since August 2010, joining after she and her late husband John Ocampo acquired MACOM in 2009. During her fifteen year tenure, Mrs. Ocampo has been an integral part of MACOM's development, providing exceptional guidance throughout that time.
お知らせ • Jul 24MACOM Technology Solutions Holdings, Inc. to Report Q3, 2025 Results on Aug 07, 2025MACOM Technology Solutions Holdings, Inc. announced that they will report Q3, 2025 results Pre-Market on Aug 07, 2025
お知らせ • Jun 12Macom Technology Solutions Inc. Announces New Suite of High Performance Rf Solutions Designed to Meet the Demanding Requirements of Advanced Radar SystemsMACOM Technology Solutions Inc. announced a new suite of high performance RF solutions designed to meet the demanding requirements of advanced radar systems. Many of these solutions will be demonstrated in MACOM's Booth 943 at the upcoming International Microwave Symposium (IMS) on June 17 to 19, 2025 in San Francisco, CA. S-Band (2 - 4 GHz): high Power GaN-on-SiC Amplifiers: A new family of 65 V, 50-ohm input and output amplifiers designed for radar applications is now available. Operating over the 2.7 - 3.8 GHz range, these amplifiers can deliver output power up to 800 W. The full portfolio of 65 V S-Band radar products includes the MAPC-A4029, MAPC-A4030, MAPC-A4031 and MAPC-A4032. C-Band (4 - 8 GHz): High Power GaN-on- SiC Amplifier: The MAPC-A4003-AB is a 700 W GaN-on-Sic Power Amplifier (PA). Leveraging MACOM's GaN-on-Si C process technology, the 50-ohm PA is designed to be a compact 700 W solution for 5.2 - 5.9 GHz radar applications. The WSA4501S is a high efficiency GaN MMIC and ideal for large radar arrays. The 50 WGaN-on-SiC MMIC PA features 57% power added efficiency (PAE). It supports radar customers' evolving needs for longer pulse conditions, with capabilities of up to 500 usec and 20% duty cycle from 5.2 - 5. 9 GHz. X-Band (8 - 12 GHz): Compact 1 kW Amplifier Pallet: The MAPC-P1060 is a 1 kW Pulsed PA Pallet offering 52 dB of gain and 30% efficiency, making it ideal for high power microwave systems and radar applications in X-Band frequencies. The pallet integrates MACOM's power management ICs (PMICs) for bias sequencing and temperature compensation. Highly Integrated Front End Module: The WSM5000S Front End Module (FEM) features a GaN-on-SiD power amplifier, GaN-on-SiS switch, and a GaAs low noise amplifier (LNA) with an integrated limiter. In transmit mode, it provides up to 5 W of saturated output power with 40% PAE and 32 dB of gain. The receive side can provide 16 dB of gain with a 2.5 dB of noise figure and 21 dBm OIP3. The integrated limiter provides receive side protection. Ku-Band (12 - 18 GHz): High Power GaN - 18 GHz): High PowerGaN-on-Si C MMIC offers high output power and efficiency. It can provide can up to 80 W of saturated output power with 25 dB of large signal gain and 35% power added efficiency (PA E) in pulsed operation. It is available in multiple formats, including bare die, surface mount QFN and flange.
お知らせ • May 28MACOM Showcases Advanced Rf and Microwave Solutions At IMS 2025MACOM Technology Solutions Inc. will showcase its broad portfolio of high performance RF, microwave and millimeter wave (mmWave) solutions and foundry services at the International Microwave Symposium (IMS) 2025, taking place June 15 to 20, 2025 at the Moscone Center in San Francisco, California. MACOM's technical experts will be available to highlight its performance advantages, and the company will also have a full lineup of technical presentations throughout the show. At Booth #943, MACOM will feature 16 hands-on technology demonstrations showcasing real-time performance and results, including many of the company's new products for EW, radar and SATCOM applications. Demonstrations will include a high performance wideband low noise amplifier (LNA) and power amplifier (PA); X-Band PA pallet and front end module; C-Band linearizers and PAs; Q-Band linearizer; Ka-Band and Ku-Band PAs; E-Band upconverter and LNA; 2 to 18 GHz solutions including an integrated switched filter bank; transmit/receive module (TRM) and time delay unit (TDU); switches and limiters as well as a display of a wide variety of RF, microwave and mmWave products. Booth #1143 will present MACOM's Foundry Services, highlighting its deep expertise in Gallium Nitride (GaN) and Gallium Arsenide (GaAs) process technologies. The company's foundry capabilities support the entire product development lifecycle - from design assistance and scalable device models to production-ready processes and quality testing. MACOM's foundry team will be available to discuss how its services can help customers move from initial development through high volume manufacturing with proven high first-pass design success and process reliability. MACOM has been selected by IEEE MTT-S to present several technical sessions during IMS 2025, covering topics such as GaN power amplifier (PA) waveform engineering, high efficiency PAs for 6G and MIMO applications, X-Band MMIC designs and Ka-Band LNA innovations.
お知らせ • May 08Macom Technology Solutions Holdings, Inc. Provides Earnings Guidance for the Fiscal Third Quarter Ending July 4, 2025MACOM Technology Solutions Holdings, Inc. provided earnings guidance for the fiscal third quarter ending July 4, 2025. For the quarter company expected revenue to be in the range of $246 million to $254 million.
お知らせ • Apr 24MACOM Technology Solutions Holdings, Inc. to Report Q2, 2025 Results on May 08, 2025MACOM Technology Solutions Holdings, Inc. announced that they will report Q2, 2025 results Pre-Market on May 08, 2025
お知らせ • Nov 07MACOM Technology Solutions Holdings, Inc. (NasdaqGS:MTSI) acquired Engin-Ic, Inc.MACOM Technology Solutions Holdings, Inc. (NasdaqGS:MTSI) acquired Engin-Ic, Inc. on November 6, 2024. A cash consideration will be paid by MACOM Technology Solutions Holdings, Inc. As part of consideration, an undisclosed value is paid towards common equity of Engin-Ic, Inc. MACOM Technology Solutions Holdings, Inc. (NasdaqGS:MTSI) completed the acquisition of Engin-Ic, Inc. on November 6, 2024
