Realtek Semiconductor（RTKSM）株式概要Realtek Semiconductor Corp.は、その子会社とともに、台湾、アジア、および国際的な各種集積回路および関連アプリケーションソフトウェアの研究、開発、製造、販売を行っています。 詳細RTKSM ファンダメンタル分析スノーフレーク・スコア評価2/6将来の成長4/6過去の実績2/6財務の健全性6/6配当金4/6報酬株価収益率（ 20.7 x）は、 Semiconductor業界平均（ 56.6 x）を下回っています。収益は年間14.49%増加すると予測されています リスク分析不安定な配当実績 すべてのリスクチェックを見るRTKSM Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.Your Fair ValueUS$Current PriceUS$73.00319.8% 割高 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture0214b2016201920222025202620282031Revenue NT$214.3bEarnings NT$24.7bAdvancedSet Fair ValueView all narrativesRealtek Semiconductor Corp. 競合他社Silicon Motion TechnologySymbol: NasdaqGS:SIMOMarket cap: US$8.7beMemory TechnologySymbol: TPEX:3529Market cap: NT$265.5bQorvoSymbol: NasdaqGS:QRVOMarket cap: US$8.7bSG MicroSymbol: SZSE:300661Market cap: CN¥68.0b価格と性能株価の高値、安値、推移の概要Realtek Semiconductor過去の株価現在の株価NT$73.0052週高値NT$052週安値NT$0ベータ0.701ヶ月の変化4.29%3ヶ月変化20.66%1年変化3.55%3年間の変化52.08%5年間の変化3.55%IPOからの変化280.00%最新ニュースお知らせ • Mar 02Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwanお知らせ • Apr 23Realtek Semiconductor Corp. to Report Q1, 2025 Results on Apr 30, 2025Realtek Semiconductor Corp. announced that they will report Q1, 2025 results on Apr 30, 2025お知らせ • Mar 21E Ink Partners with Realtek to Introduce Second-Generation System-on-Panel Electronic Shelf LabelE Ink Holdings Inc. announced its collaboration with Realtek Semiconductor to unveil the second-generation System-on-Panel (SoP) electronic shelf label (ESL) reference design. This innovative solution simplifies ESL development, significantly reducing the barrier to entry. Under identical display areas, the new-generation design achieves approximately a 30% reduction in thin-filmistor (TFT) size and a 50% decrease in flexible printed circuit (FPC) dimensions. This enables streamlined ESLs with slimmer borders perfectly suited for diverse retail environments. The SoP technology integrates components directly onto ePaper, glass, or flexible substrates, combining integrated circuits, panels, and system design into a unified ePaper display solution. The second-generation SoP incorporates Realtek's Bluetooth chipset using Chip-on-Glass (CoG) technology, creating the world's first device embedding a Radio Frequency Integrated Circuit (RFIC) directly onto glass. This advancement minimizes material usage, reduces product size, simplifies manufacturing processes, and delivers a more efficient, environmentally sustainable display solution. The second- generation SoP design increases efficiency through an optimized circuit layout and transmission line architecture, allowing signal transmission distances to approach those of traditional shelf labels. Additionally, the FPC is integrated onto the back of the panel, further reducing the device size and material usage, resulting in a more energy-efficient and eco-friendly ESL solution that aligns with ESG principles for sustainable development. The SoP design integrates an RF chip onto a 2.66-inch e-paper display glass substrate using Realtek Semiconductor's next-generation Redistribution Layer (RDL) technology, replacing traditional wire bonding packaging. These advancements make it commercially viable, and the deep integration of semiconductors and display panels provides a foundation for the next generation of retail products. As a pioneer in ePaper technology, E Ink is dedicated to achieving net-zero carbon emissions by 2040. Beyond the inherent sustainability benefits of ePaper products, E Ink proactively optimizes product designs to enhance environmental friendliness. Furthermore, ESLs significantly reduce carbon emissions. For example, over the past seven years, approximately 600 million 3-inch ePaper labels have been installed globally. Changing pricing information four times daily, traditional paper labels produce 32,000 times more carbon dioxide than ePaper labels. Similarly, 30 million 10-inch electronic advertising displays globally, used continuously for five years, produce 12,000 times more CO2 emissions if utilizing LCD technology compared to ePaper. Compared to disposable printed paper, dynamic ePaper displays emit 60,000 times less CO2. The second-generation Sop ESL will be showcased at E Ink's booth (#L717) during Touch Taiwan 2025 from, April 16 to 18. Visitors are welcome to experience the latest innovation firsthand.お知らせ • Mar 03Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwanお知らせ • Feb 20Realtek Semiconductor Corp. to Report Fiscal Year 2024 Results on Feb 27, 2025Realtek Semiconductor Corp. announced that they will report fiscal year 2024 results on Feb 27, 2025お知らせ • Oct 17Realtek Semiconductor Corp. to Report Q3, 2024 Results on Oct 30, 2024Realtek Semiconductor Corp. announced that they will report Q3, 2024 results on Oct 30, 2024最新情報をもっと見るRecent updatesお知らせ • Mar 02Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwanお知らせ • Apr 23Realtek Semiconductor Corp. to Report Q1, 2025 Results on Apr 30, 2025Realtek Semiconductor Corp. announced that they will report Q1, 2025 results on Apr 30, 2025お知らせ • Mar 21E Ink Partners with Realtek to Introduce Second-Generation System-on-Panel Electronic Shelf LabelE Ink Holdings Inc. announced its collaboration with Realtek Semiconductor to unveil the second-generation System-on-Panel (SoP) electronic shelf label (ESL) reference design. This innovative solution simplifies ESL development, significantly reducing the barrier to entry. Under identical display areas, the new-generation design achieves approximately a 30% reduction in thin-filmistor (TFT) size and a 50% decrease in flexible printed circuit (FPC) dimensions. This enables streamlined ESLs with slimmer borders perfectly suited for diverse retail environments. The SoP technology integrates components directly onto ePaper, glass, or flexible substrates, combining integrated circuits, panels, and system design into a unified ePaper display solution. The second-generation SoP incorporates Realtek's Bluetooth chipset using Chip-on-Glass (CoG) technology, creating the world's first device embedding a Radio Frequency Integrated Circuit (RFIC) directly onto glass. This advancement minimizes material usage, reduces product size, simplifies manufacturing processes, and delivers a more efficient, environmentally sustainable display solution. The second- generation SoP design increases efficiency through an optimized circuit layout and transmission line architecture, allowing signal transmission distances to approach those of traditional shelf labels. Additionally, the FPC is integrated onto the back of the panel, further reducing the device size and material usage, resulting in a more energy-efficient and eco-friendly ESL solution that aligns with ESG principles for sustainable development. The SoP design integrates an RF chip onto a 2.66-inch e-paper display glass substrate using Realtek Semiconductor's next-generation Redistribution Layer (RDL) technology, replacing traditional wire bonding packaging. These advancements make it commercially viable, and the deep integration of semiconductors and display panels provides a foundation for the next generation of retail products. As a pioneer in ePaper technology, E Ink is dedicated to achieving net-zero carbon emissions by 2040. Beyond the inherent sustainability benefits of ePaper products, E Ink proactively optimizes product designs to enhance environmental friendliness. Furthermore, ESLs significantly reduce carbon emissions. For example, over the past seven years, approximately 600 million 3-inch ePaper labels have been installed globally. Changing pricing information four times daily, traditional paper labels produce 32,000 times more carbon dioxide than ePaper labels. Similarly, 30 million 10-inch electronic advertising displays globally, used continuously for five years, produce 12,000 times more CO2 emissions if utilizing LCD technology compared to ePaper. Compared to disposable printed paper, dynamic ePaper displays emit 60,000 times less CO2. The second-generation Sop ESL will be showcased at E Ink's booth (#L717) during Touch Taiwan 2025 from, April 16 to 18. Visitors are welcome to experience the latest innovation firsthand.お知らせ • Mar 03Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwanお知らせ • Feb 20Realtek Semiconductor Corp. to Report Fiscal Year 2024 Results on Feb 27, 2025Realtek Semiconductor Corp. announced that they will report fiscal year 2024 results on Feb 27, 2025お知らせ • Oct 17Realtek Semiconductor Corp. to Report Q3, 2024 Results on Oct 30, 2024Realtek Semiconductor Corp. announced that they will report Q3, 2024 results on Oct 30, 2024お知らせ • Jul 17Realtek Semiconductor Corp. to Report Q2, 2024 Results on Jul 30, 2024Realtek Semiconductor Corp. announced that they will report Q2, 2024 results on Jul 30, 2024お知らせ • Jun 01+ 1 more updateRealtek Semiconductor Corp. Announces Change to Nominating Committee MembersRealtek Semiconductor Corp. announced change to nominating committee members. Name and resume of the previous position holder: Tsai, Tyau-Chang; Independent Director of Realtek, Chen, Fu-Yen; Independent Director of Realtek, Lo, Chun-Pa; Independent Director of Realtek. Name and resume of the new position holder: Yang, Pan-Chyr; Independent Director of Realtek, Ko, Fu-Hwa; Independent Director of Realtek, Hsieh, Yin-Ching; Independent Director of Realtek. Effective date of the new appointment: May 30, 2024.お知らせ • May 31Realtek Semiconductor Corp. Announces Board ChangesRealtek Semiconductor Corp. announced board changes. Title and name of the previous position holder: Directors: United Glory Co. Ltd. Representative: Chern, Kuo-Jong, Cotek Pharmaceutical Industry Co. Ltd. Representative: Yeh, Nan-Horng. Independent directors: Tsai, Tyau-Chang, Chen, Fu-Yen, and Lo, Chun-Pa. Resume of the previous position holder: Directors: United Glory Co. Ltd. Representative: Chern, Kuo-Jong; Chief Financial Officer of Realtek, otek Pharmaceutical Industry Co. Ltd. Representative: Yeh, Nan-Horng; Director of Realtek. Independent directors: Tsai, Tyau-Chang; Johnson Law office Lawyer, Chen, Fu-Yen; Chairman of ezTravel Co. Ltd., Lo, Chun-Pa; Investment Vice President of De Jie Investment Co. Ltd. Title and name of the new position holder: Directors: Taotech Co. Ltd. Representative: Yeh, Po-Len, Dejia Investment Co. Ltd. Representative: Yeh, Ming-Han. Independent directors: Yang, Pan-Chyr, Ko, Fu-Hwa, Hsieh, Yin-Ching. Resume of the new position holder: Directors: Dejia Investment Co. Ltd. Representative: Yeh, Ming-Han; Chairman of Dejia Investment Co. Ltd. Independent directors: ang, Pan-Chyr; Professor, Department of Internal Medicine, College of Medicine, National Taiwan University, Ko, Fu-Hwa; Managing Owner of SEMI DA Advisory LLC, Hsieh, Yin-Ching; Founder of Shay & Partners and leader of the TMT team. Effective date of the new appointment: May 30, 2024.お知らせ • Apr 13Realtek Semiconductor Corp. to Report Q1, 2024 Results on Apr 19, 2024Realtek Semiconductor Corp. announced that they will report Q1, 2024 results on Apr 19, 2024お知らせ • Feb 28Realtek Semiconductor Corp., Annual General Meeting, May 30, 2024Realtek Semiconductor Corp., Annual General Meeting, May 30, 2024. Location: No.1, Industry East 2nd Road, Hsinchu Science Park Hsinchu Taiwan Agenda: To consider Business report of 2023; to consider Audit Committee's review report; to consider report 2023 employees compensation and directors remuneration; to consider report 2023 cash dividends distribution from retained earnings; to consider report 2023 related party transactions; to consider 2023 business report and financial statements; to consider distribution of 2023 retained earnings; and to consider other matters.お知らせ • Jan 29ParkerVision Inc Receives Favorable Markman Rulings in Infringement Actions Against MediaTek Inc., MediaTek USA Inc. and Realtek Semiconductor CorpParkerVision Inc. announced that the United States District Court for the Western District of Texas issued its Markman, or claim construction, rulings in ParkerVision's patent infringement actions against MediaTek Inc. and MediaTek USA Inc. and Realtek Semiconductor Corp. The Court's claim constructions are largely favorable to ParkerVision. The Court held back-to-back Markman hearings on Friday, January 26, 2024, for the MediaTek and Realtek actions. Consistent with its standard practice, the Court issued preliminary rulings on the disputed claim constructions in advance of the Markman hearings. The Markman hearings were then held to allow the parties to present arguments with regard to any of the Court's preliminary rulings that they wished the Court to reconsider and/or fine-tune. In ParkerVision v. MediaTek, the Court adopted ParkerVision's proposed claim constructions for 13 of 16 disputed terms while adopting two proposed terms for MediaTek, and one term the Court construed on its own. In ParkerVision v. Realtek, the Court adopted ParkerVision's proposed claim constructions for nine of 10 disputed terms, with the one remaining term being a combination of the proposals from both parties. These MediaTek and Realtek infringement actions were initially filed in November 2022 and allege infringement against both parties of the same four ParkerVision patents. Both cases are scheduled for jury trial in December 2024. The Company has inter partes review actions pending against one of the patents. In 2023, ParkerVision filed two additional infringement cases against MediaTek and one new infringement case against Realtek alleging infringement of different ParkerVision patents.お知らせ • Aug 25Realtek Semiconductor Corp. Announces Total Cash Dividend, Payable on October 6, 2023Realtek Semiconductor Corp. announced Cash dividends from retained earnings: TWD 13,334,454,666 (TWD 26 per share). The dividend is payable on October 6, 2023 with ex-rights (ex-dividend) trading date of September 11, 2023 and ex-rights (ex-dividend) record date of September 17, 2023.お知らせ • Feb 01Ubiik and Realtek Announce Nimbus 220, a Dedicated NB-IoT Module for Upper 700 MHz A Block (3GPP band 103) - Perfect for Utilities and IoT ApplicationsUbiik has joined forces with Realtek Semiconductor Corporation, to deliver Nimbus 220, an NB-IoT module based on Realtek RTL9518 chipset, and optimized for operation in Upper 700 MHz A Block band. This is an important development for the utility and IoT markets in the US, as the joint development will allow license holders of Band 103 to fully utilize this prime 1 MHz paired spectrum by leveraging advanced features such as non-anchor carriers and Non-IP Data Delivery (NIDD). After Select Spectrum and Access Spectrum have announced that the Upper 700 MHz A Block is officially designated in 3GPP Release 16 as "NB-IoT Band 103" for 4G and 5G services, Ubiik and Realtek are now partnering on the development of this NB-IoT module allowing Ubiik's cellular base station goRAN™ to address current gaps in the North American market for band 103 (787-788 MHz uplink and 757-758 MHz downlink). With NB-IoT using as little as 180 kHz of spectrum, and being able to scale up by utilizing multiple carriers simultaneously, companies who are currently utilizing this band now have the possibility to add standard-compliant NB-IoT to deliver affordable, long-range connectivity to low-power or low-throughput devices. With this partnership, Ubiik aims to expand its reach in the North American market and provide customers with reliable private LTE connectivity. The module, whose embedded processing unit can support ANSI meters and other applications/protocols, will be launched together with goRAN™ base stations and showcased at Distributech 2023 booth #1637 in San Diego from February 7th to 9th, 2023.お知らせ • Nov 12Parkervision, Inc. Files Against Mediatek Incorporated and Realtek Semiconductor Corp. for Patent InfringementParkerVision Inc. announced that it has filed new complaints in the Western District of Texas against Taiwanese global fabless semiconductor companies, MediaTek Incorporated ("MediaTek") and Realtek Semiconductor Corp. ("Realtek"), for the infringement of four of its U.S. patents. The complaints request jury trials to determine, among other items, the financial damages for the unauthorized use of ParkerVision's wireless patented technologies in semiconductor chips used in Smartphones, WiFi and Bluetooth devices. ParkerVision has ongoing actions in the Western District of Texas against Intel Corporation, TCL Electronics Holdings Co. Ltd. and affiliated companies ("TCL") and LG Electronics Inc. ("LGE"), including a second action filed against TCL on November 7, 2022 for the infringement of two additional patents. To date, ParkerVision has settled actions against Japanese wireless networking company Buffalo Inc., Taiwanese wireless networking company Zyxel Communications Corporation, and, most recently, Chinese SmartTV company Hisense Co. Ltd. and affiliates ("Hisense") through patent license and settlement agreements. ParkerVision has invested hundreds of millions in R&D and marketing in its patented RF receiver, transmitter, and RF power transmitter technologies to enable ultra-small semiconductor chips to deliver high performance RF wireless communications for mobile telephone standards such as 3G, 4G, and 5G standards, WiFi communications, Bluetooth, Satellite communications and other wireless applications.お知らせ • Oct 29Realtek Semiconductor Corp. Appoints Weng, Chi-Shun as Chief Information Security OfficerRealtek Semiconductor Corp. appointed Weng, Chi-Shun, Senior Director as Chief Information Security Officer. Date of occurrence of the change: October 28, 2022. Name, title, and resume of the new position holder: Weng, Chi-Shun, Senior Director. Type of the change: New replacement.お知らせ • Apr 19Realtek Semiconductor Corp Shares to Be Deleted from Other OTCRealtek Semiconductor Corp.'s Shares will be deleted from other OTC effective from April 19, 2022 due to Inactive Security.お知らせ • Apr 16Realtek Semiconductor Corp. to Report Q1, 2022 Results on Apr 22, 2022Realtek Semiconductor Corp. announced that they will report Q1, 2022 results on Apr 22, 2022お知らせ • Mar 23Realtek Semiconductor Corp., Annual General Meeting, Jun 08, 2022Realtek Semiconductor Corp., Annual General Meeting, Jun 08, 2022.お知らせ • Jan 28Celeno and Realtek Debut a Joint Solution for Wi-Fi 6/6E Enabled Fiber GatewaysCeleno Communications announced a collaboration with Realtek for a high performance reference design for 2.5Gbps gateways. The joint solution brings together Celeno's latest Wi-Fi 6 and Wi-Fi 6E (6GHz band) silicon, and Realtek's RTL9607DA PON ONU Gateway Processor to provide a reference platform for next generation fiber access products. The platform delivers improved Wi-Fi performance, range and reliability essential in today's highly dense environments. The Celeno CL8000 family features high-performance, highly integrated Wi-Fi 6/6E (802.11ax R2) PCIe chip solutions based on advanced 14nm geometry to offer a low power and cost-effective architecture. The CL8000 architecture packs two Wi-Fi 6/6E access point radios into a single 11x11 BGA package and utilizes only one PCIe gen 3.0 interface. The CL8080 chip can deliver up to 6Gbps of speed and 8 radio chains, 4x4 2.4GHz and 4x4 5GHz, over a dual lane PCIe interface. The unique single chip architecture with dual transceivers provides a cost-effective Tri-Band solution with an advanced feature set. With the Celeno Wi-Fi solution, combining the CL8080 and CL8066 chips utilizes only two PCIe interfaces and can support a total of 14 radio chains with flexible MIMO assignments, enabling for example a Tri-Band solution supporting 4x4 MIMO on each band (2.4, 5, 6 GHz) plus a dedicated 4th listening radio utilizing up to two receive radio chains to enable parallel spectrum analysis, Zero-Wait-DFS, Zero-Wait-CAC, beacon analysis and packet sniffing for fast and efficient spectrum scanning and channel characterization. Service providers can improve their overall network performance and management capabilities to respond better to their customer needs with this unique quad band solution. Realtek's RTL9607DA 2.5G PON Gateway Processor provides a high performance and flexible enterprise-class gateway solution for operators and carriers worldwide to deploy the next generation of fiber access service to businesses and consumers. The solution integrates a 12.5Gbps routing and switching platform with advanced features, including a multiprotocol xPON ONU MAC and SW that supports the PON modes as defined in IEEE802.3ah (EPON) and ITU-T G.984.3 (GPON). The RTL9607DA features a highly programmable data forwarding and networking engine with a rich set of integrated peripherals powered by Dual SMP ARM CortextTM-A55 CPU cores. The platform provides the stability and features of multiple generations of PON ONU and HGW designs proven in deployments across the world.お知らせ • Oct 04Realtek Semiconductor Launches the Second Generation of Its 2.5GbE ChipRealtek Semiconductor has launched the second generation of its 2.5GbE chip. While most companies continue to upgrade their wireless routers to Wi-Fi 6 with 2.5GbE ports, this solution falls short of truly increasing connection speed. The entire environment, including bridges such as internet cards and switches, needs to be equipped with Ethernet connections faster than 1Gbps to reach 2.5GbE speeds. Realtek’s second generation 2.5GbE, part of its RTL8125B series for business applications, provides original equipment manufacturers and enterprises with rapid development, while offering home entertainment enthusiasts, gamers, streamers, and audiovisual specialists quicker, more stable, and diversified interface solutions. Key features of the Realtek second generation Ethernet solutions include: Eco-friendly, smaller design: The surface area has been reduced by 64% and power consumption by 50% compared to the first-generation models. Thinner and more energy-efficient, the 2.5GbE lowers the amount of power lost for long-term and large-scale transmissions, making it even more environmentally friendly. High compatibility and stable transmission: The Realtek RTL8125B series is compatible with existing network cables, and it does not require switches for connections under 110 meters. It is also capable of providing stable uni- and bi-directional transmissions (uploading and downloading) even when combined with multiple brands of switches. It provides enterprises and users with an high-speed network environment out of the box, giving them a stable and fast network for teleconferences, data recovery, file transmission, gaming and video streaming. Unique bandwidth-regulating software: The included ‘Dragon’ network bandwidth management software developed by Realtek can be used to assign packet priority. Smart distribution of bandwidth ensures that users most essential applications will not lag. Ethernet is still the most stable method of network transmission. With demand for high-speed network environments on the rise, Realtek’s Second Generation 2.5GbE solution can be widely applied to motherboards, external PCIe cards, and USB network extenders. In addition, other network-related products including web cameras, online hard drives, servers, routers, cable boxes, printers, and base stations can all make use of Realtek’s network solutions, satisfying the need for stable, high-speed network environments from enterprise and network users.株主還元RTKSMLU SemiconductorLU 市場7D0%0%0%1Y3.5%0%0%株主還元を見る業界別リターン: RTKSM過去 1 年間で109.3 % の収益を上げたLuxembourg Semiconductor業界を下回りました。リターン対市場: RTKSMは、過去 1 年間で17.2 % のリターンを上げたLuxembourg市場を下回りました。価格変動Is RTKSM's price volatile compared to industry and market?RTKSM volatilityRTKSM Average Weekly Movement6.3%Semiconductor Industry Average Movement0%Market Average Movement0%10% most volatile stocks in LU Market0%10% least volatile stocks in LU Market0%安定した株価: RTKSM 、 Luxembourg市場と比較して、過去 3 か月間で大きな価格変動はありませんでした。時間の経過による変動: RTKSMの 週次ボラティリティ ( 6% ) は過去 1 年間安定しています。会社概要設立従業員CEO（最高経営責任者ウェブサイト1987n/aYung-Fang Huangwww.realtek.comRealtek Semiconductor Corp.は、その子会社とともに、台湾、アジア、および国際的な各種集積回路および関連アプリケーションソフトウェアの研究、開発、製造、販売を行っている。ブロードバンドアクセスコントローラ、ゲートウェイコントローラ、デジタルホームセンター、ギガビットイーサネット、スイッチコントローラ、無線LAN IC、DTV復調器などの通信ネットワークICや、Bluetooth、GNSS、モノのインターネット製品を提供している。また、PCオーディオ・コーデック、コンシューマー・オーディオ・コーデック、カード・リーダー・ソリューション、クラスDオーディオ・アンプ、PCカメラ・コントローラー、Type-C PDコントローラー、USBハブなどのコンピューター周辺ICや、マルチメディアICも提供している。また、コンピュータ機器の製造・設置、電子材料や情報・ソフトウェアの卸売・小売・関連サービス、情報・技術サポートサービスの提供も行っている。同社は1987年に設立され、台湾の新竹市に本社を置いている。もっと見るRealtek Semiconductor Corp. 基礎のまとめRealtek Semiconductor の収益と売上を時価総額と比較するとどうか。RTKSM 基礎統計学時価総額US$9.40b収益（TTM）US$454.31m売上高(TTM)US$3.94b20.7xPER（株価収益率2.4xP/SレシオRTKSM は割高か？公正価値と評価分析を参照収益と収入最新の決算報告書（TTM）に基づく主な収益性統計RTKSM 損益計算書（TTM）収益NT$124.11b売上原価NT$62.70b売上総利益NT$61.40bその他の費用NT$47.08b収益NT$14.32b直近の収益報告Mar 31, 2026次回決算日該当なし一株当たり利益（EPS）27.78グロス・マージン49.48%純利益率11.54%有利子負債／自己資本比率21.6%RTKSM の長期的なパフォーマンスは？過去の実績と比較を見る配当金4.3%現在の配当利回り90%配当性向View Valuation企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/21 15:38終値2026/05/21 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Realtek Semiconductor Corp. 16 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。25 アナリスト機関Mike YangBofA Global ResearchLicheng ZhuangCapital Securities CorporationJack LuCGS International22 その他のアナリストを表示
お知らせ • Mar 02Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwan
お知らせ • Apr 23Realtek Semiconductor Corp. to Report Q1, 2025 Results on Apr 30, 2025Realtek Semiconductor Corp. announced that they will report Q1, 2025 results on Apr 30, 2025
お知らせ • Mar 21E Ink Partners with Realtek to Introduce Second-Generation System-on-Panel Electronic Shelf LabelE Ink Holdings Inc. announced its collaboration with Realtek Semiconductor to unveil the second-generation System-on-Panel (SoP) electronic shelf label (ESL) reference design. This innovative solution simplifies ESL development, significantly reducing the barrier to entry. Under identical display areas, the new-generation design achieves approximately a 30% reduction in thin-filmistor (TFT) size and a 50% decrease in flexible printed circuit (FPC) dimensions. This enables streamlined ESLs with slimmer borders perfectly suited for diverse retail environments. The SoP technology integrates components directly onto ePaper, glass, or flexible substrates, combining integrated circuits, panels, and system design into a unified ePaper display solution. The second-generation SoP incorporates Realtek's Bluetooth chipset using Chip-on-Glass (CoG) technology, creating the world's first device embedding a Radio Frequency Integrated Circuit (RFIC) directly onto glass. This advancement minimizes material usage, reduces product size, simplifies manufacturing processes, and delivers a more efficient, environmentally sustainable display solution. The second- generation SoP design increases efficiency through an optimized circuit layout and transmission line architecture, allowing signal transmission distances to approach those of traditional shelf labels. Additionally, the FPC is integrated onto the back of the panel, further reducing the device size and material usage, resulting in a more energy-efficient and eco-friendly ESL solution that aligns with ESG principles for sustainable development. The SoP design integrates an RF chip onto a 2.66-inch e-paper display glass substrate using Realtek Semiconductor's next-generation Redistribution Layer (RDL) technology, replacing traditional wire bonding packaging. These advancements make it commercially viable, and the deep integration of semiconductors and display panels provides a foundation for the next generation of retail products. As a pioneer in ePaper technology, E Ink is dedicated to achieving net-zero carbon emissions by 2040. Beyond the inherent sustainability benefits of ePaper products, E Ink proactively optimizes product designs to enhance environmental friendliness. Furthermore, ESLs significantly reduce carbon emissions. For example, over the past seven years, approximately 600 million 3-inch ePaper labels have been installed globally. Changing pricing information four times daily, traditional paper labels produce 32,000 times more carbon dioxide than ePaper labels. Similarly, 30 million 10-inch electronic advertising displays globally, used continuously for five years, produce 12,000 times more CO2 emissions if utilizing LCD technology compared to ePaper. Compared to disposable printed paper, dynamic ePaper displays emit 60,000 times less CO2. The second-generation Sop ESL will be showcased at E Ink's booth (#L717) during Touch Taiwan 2025 from, April 16 to 18. Visitors are welcome to experience the latest innovation firsthand.
お知らせ • Mar 03Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwan
お知らせ • Feb 20Realtek Semiconductor Corp. to Report Fiscal Year 2024 Results on Feb 27, 2025Realtek Semiconductor Corp. announced that they will report fiscal year 2024 results on Feb 27, 2025
お知らせ • Oct 17Realtek Semiconductor Corp. to Report Q3, 2024 Results on Oct 30, 2024Realtek Semiconductor Corp. announced that they will report Q3, 2024 results on Oct 30, 2024
お知らせ • Mar 02Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026Realtek Semiconductor Corp., Annual General Meeting, May 27, 2026, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwan
お知らせ • Apr 23Realtek Semiconductor Corp. to Report Q1, 2025 Results on Apr 30, 2025Realtek Semiconductor Corp. announced that they will report Q1, 2025 results on Apr 30, 2025
お知らせ • Mar 21E Ink Partners with Realtek to Introduce Second-Generation System-on-Panel Electronic Shelf LabelE Ink Holdings Inc. announced its collaboration with Realtek Semiconductor to unveil the second-generation System-on-Panel (SoP) electronic shelf label (ESL) reference design. This innovative solution simplifies ESL development, significantly reducing the barrier to entry. Under identical display areas, the new-generation design achieves approximately a 30% reduction in thin-filmistor (TFT) size and a 50% decrease in flexible printed circuit (FPC) dimensions. This enables streamlined ESLs with slimmer borders perfectly suited for diverse retail environments. The SoP technology integrates components directly onto ePaper, glass, or flexible substrates, combining integrated circuits, panels, and system design into a unified ePaper display solution. The second-generation SoP incorporates Realtek's Bluetooth chipset using Chip-on-Glass (CoG) technology, creating the world's first device embedding a Radio Frequency Integrated Circuit (RFIC) directly onto glass. This advancement minimizes material usage, reduces product size, simplifies manufacturing processes, and delivers a more efficient, environmentally sustainable display solution. The second- generation SoP design increases efficiency through an optimized circuit layout and transmission line architecture, allowing signal transmission distances to approach those of traditional shelf labels. Additionally, the FPC is integrated onto the back of the panel, further reducing the device size and material usage, resulting in a more energy-efficient and eco-friendly ESL solution that aligns with ESG principles for sustainable development. The SoP design integrates an RF chip onto a 2.66-inch e-paper display glass substrate using Realtek Semiconductor's next-generation Redistribution Layer (RDL) technology, replacing traditional wire bonding packaging. These advancements make it commercially viable, and the deep integration of semiconductors and display panels provides a foundation for the next generation of retail products. As a pioneer in ePaper technology, E Ink is dedicated to achieving net-zero carbon emissions by 2040. Beyond the inherent sustainability benefits of ePaper products, E Ink proactively optimizes product designs to enhance environmental friendliness. Furthermore, ESLs significantly reduce carbon emissions. For example, over the past seven years, approximately 600 million 3-inch ePaper labels have been installed globally. Changing pricing information four times daily, traditional paper labels produce 32,000 times more carbon dioxide than ePaper labels. Similarly, 30 million 10-inch electronic advertising displays globally, used continuously for five years, produce 12,000 times more CO2 emissions if utilizing LCD technology compared to ePaper. Compared to disposable printed paper, dynamic ePaper displays emit 60,000 times less CO2. The second-generation Sop ESL will be showcased at E Ink's booth (#L717) during Touch Taiwan 2025 from, April 16 to 18. Visitors are welcome to experience the latest innovation firsthand.
お知らせ • Mar 03Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025Realtek Semiconductor Corp., Annual General Meeting, May 28, 2025, at 09:00 Taipei Standard Time. Location: no,1, kung yeh tung 2nd rd., hsinchu science park, hsinchu city Taiwan
お知らせ • Feb 20Realtek Semiconductor Corp. to Report Fiscal Year 2024 Results on Feb 27, 2025Realtek Semiconductor Corp. announced that they will report fiscal year 2024 results on Feb 27, 2025
お知らせ • Oct 17Realtek Semiconductor Corp. to Report Q3, 2024 Results on Oct 30, 2024Realtek Semiconductor Corp. announced that they will report Q3, 2024 results on Oct 30, 2024
お知らせ • Jul 17Realtek Semiconductor Corp. to Report Q2, 2024 Results on Jul 30, 2024Realtek Semiconductor Corp. announced that they will report Q2, 2024 results on Jul 30, 2024
お知らせ • Jun 01+ 1 more updateRealtek Semiconductor Corp. Announces Change to Nominating Committee MembersRealtek Semiconductor Corp. announced change to nominating committee members. Name and resume of the previous position holder: Tsai, Tyau-Chang; Independent Director of Realtek, Chen, Fu-Yen; Independent Director of Realtek, Lo, Chun-Pa; Independent Director of Realtek. Name and resume of the new position holder: Yang, Pan-Chyr; Independent Director of Realtek, Ko, Fu-Hwa; Independent Director of Realtek, Hsieh, Yin-Ching; Independent Director of Realtek. Effective date of the new appointment: May 30, 2024.
お知らせ • May 31Realtek Semiconductor Corp. Announces Board ChangesRealtek Semiconductor Corp. announced board changes. Title and name of the previous position holder: Directors: United Glory Co. Ltd. Representative: Chern, Kuo-Jong, Cotek Pharmaceutical Industry Co. Ltd. Representative: Yeh, Nan-Horng. Independent directors: Tsai, Tyau-Chang, Chen, Fu-Yen, and Lo, Chun-Pa. Resume of the previous position holder: Directors: United Glory Co. Ltd. Representative: Chern, Kuo-Jong; Chief Financial Officer of Realtek, otek Pharmaceutical Industry Co. Ltd. Representative: Yeh, Nan-Horng; Director of Realtek. Independent directors: Tsai, Tyau-Chang; Johnson Law office Lawyer, Chen, Fu-Yen; Chairman of ezTravel Co. Ltd., Lo, Chun-Pa; Investment Vice President of De Jie Investment Co. Ltd. Title and name of the new position holder: Directors: Taotech Co. Ltd. Representative: Yeh, Po-Len, Dejia Investment Co. Ltd. Representative: Yeh, Ming-Han. Independent directors: Yang, Pan-Chyr, Ko, Fu-Hwa, Hsieh, Yin-Ching. Resume of the new position holder: Directors: Dejia Investment Co. Ltd. Representative: Yeh, Ming-Han; Chairman of Dejia Investment Co. Ltd. Independent directors: ang, Pan-Chyr; Professor, Department of Internal Medicine, College of Medicine, National Taiwan University, Ko, Fu-Hwa; Managing Owner of SEMI DA Advisory LLC, Hsieh, Yin-Ching; Founder of Shay & Partners and leader of the TMT team. Effective date of the new appointment: May 30, 2024.
お知らせ • Apr 13Realtek Semiconductor Corp. to Report Q1, 2024 Results on Apr 19, 2024Realtek Semiconductor Corp. announced that they will report Q1, 2024 results on Apr 19, 2024
お知らせ • Feb 28Realtek Semiconductor Corp., Annual General Meeting, May 30, 2024Realtek Semiconductor Corp., Annual General Meeting, May 30, 2024. Location: No.1, Industry East 2nd Road, Hsinchu Science Park Hsinchu Taiwan Agenda: To consider Business report of 2023; to consider Audit Committee's review report; to consider report 2023 employees compensation and directors remuneration; to consider report 2023 cash dividends distribution from retained earnings; to consider report 2023 related party transactions; to consider 2023 business report and financial statements; to consider distribution of 2023 retained earnings; and to consider other matters.
お知らせ • Jan 29ParkerVision Inc Receives Favorable Markman Rulings in Infringement Actions Against MediaTek Inc., MediaTek USA Inc. and Realtek Semiconductor CorpParkerVision Inc. announced that the United States District Court for the Western District of Texas issued its Markman, or claim construction, rulings in ParkerVision's patent infringement actions against MediaTek Inc. and MediaTek USA Inc. and Realtek Semiconductor Corp. The Court's claim constructions are largely favorable to ParkerVision. The Court held back-to-back Markman hearings on Friday, January 26, 2024, for the MediaTek and Realtek actions. Consistent with its standard practice, the Court issued preliminary rulings on the disputed claim constructions in advance of the Markman hearings. The Markman hearings were then held to allow the parties to present arguments with regard to any of the Court's preliminary rulings that they wished the Court to reconsider and/or fine-tune. In ParkerVision v. MediaTek, the Court adopted ParkerVision's proposed claim constructions for 13 of 16 disputed terms while adopting two proposed terms for MediaTek, and one term the Court construed on its own. In ParkerVision v. Realtek, the Court adopted ParkerVision's proposed claim constructions for nine of 10 disputed terms, with the one remaining term being a combination of the proposals from both parties. These MediaTek and Realtek infringement actions were initially filed in November 2022 and allege infringement against both parties of the same four ParkerVision patents. Both cases are scheduled for jury trial in December 2024. The Company has inter partes review actions pending against one of the patents. In 2023, ParkerVision filed two additional infringement cases against MediaTek and one new infringement case against Realtek alleging infringement of different ParkerVision patents.
お知らせ • Aug 25Realtek Semiconductor Corp. Announces Total Cash Dividend, Payable on October 6, 2023Realtek Semiconductor Corp. announced Cash dividends from retained earnings: TWD 13,334,454,666 (TWD 26 per share). The dividend is payable on October 6, 2023 with ex-rights (ex-dividend) trading date of September 11, 2023 and ex-rights (ex-dividend) record date of September 17, 2023.
お知らせ • Feb 01Ubiik and Realtek Announce Nimbus 220, a Dedicated NB-IoT Module for Upper 700 MHz A Block (3GPP band 103) - Perfect for Utilities and IoT ApplicationsUbiik has joined forces with Realtek Semiconductor Corporation, to deliver Nimbus 220, an NB-IoT module based on Realtek RTL9518 chipset, and optimized for operation in Upper 700 MHz A Block band. This is an important development for the utility and IoT markets in the US, as the joint development will allow license holders of Band 103 to fully utilize this prime 1 MHz paired spectrum by leveraging advanced features such as non-anchor carriers and Non-IP Data Delivery (NIDD). After Select Spectrum and Access Spectrum have announced that the Upper 700 MHz A Block is officially designated in 3GPP Release 16 as "NB-IoT Band 103" for 4G and 5G services, Ubiik and Realtek are now partnering on the development of this NB-IoT module allowing Ubiik's cellular base station goRAN™ to address current gaps in the North American market for band 103 (787-788 MHz uplink and 757-758 MHz downlink). With NB-IoT using as little as 180 kHz of spectrum, and being able to scale up by utilizing multiple carriers simultaneously, companies who are currently utilizing this band now have the possibility to add standard-compliant NB-IoT to deliver affordable, long-range connectivity to low-power or low-throughput devices. With this partnership, Ubiik aims to expand its reach in the North American market and provide customers with reliable private LTE connectivity. The module, whose embedded processing unit can support ANSI meters and other applications/protocols, will be launched together with goRAN™ base stations and showcased at Distributech 2023 booth #1637 in San Diego from February 7th to 9th, 2023.
お知らせ • Nov 12Parkervision, Inc. Files Against Mediatek Incorporated and Realtek Semiconductor Corp. for Patent InfringementParkerVision Inc. announced that it has filed new complaints in the Western District of Texas against Taiwanese global fabless semiconductor companies, MediaTek Incorporated ("MediaTek") and Realtek Semiconductor Corp. ("Realtek"), for the infringement of four of its U.S. patents. The complaints request jury trials to determine, among other items, the financial damages for the unauthorized use of ParkerVision's wireless patented technologies in semiconductor chips used in Smartphones, WiFi and Bluetooth devices. ParkerVision has ongoing actions in the Western District of Texas against Intel Corporation, TCL Electronics Holdings Co. Ltd. and affiliated companies ("TCL") and LG Electronics Inc. ("LGE"), including a second action filed against TCL on November 7, 2022 for the infringement of two additional patents. To date, ParkerVision has settled actions against Japanese wireless networking company Buffalo Inc., Taiwanese wireless networking company Zyxel Communications Corporation, and, most recently, Chinese SmartTV company Hisense Co. Ltd. and affiliates ("Hisense") through patent license and settlement agreements. ParkerVision has invested hundreds of millions in R&D and marketing in its patented RF receiver, transmitter, and RF power transmitter technologies to enable ultra-small semiconductor chips to deliver high performance RF wireless communications for mobile telephone standards such as 3G, 4G, and 5G standards, WiFi communications, Bluetooth, Satellite communications and other wireless applications.
お知らせ • Oct 29Realtek Semiconductor Corp. Appoints Weng, Chi-Shun as Chief Information Security OfficerRealtek Semiconductor Corp. appointed Weng, Chi-Shun, Senior Director as Chief Information Security Officer. Date of occurrence of the change: October 28, 2022. Name, title, and resume of the new position holder: Weng, Chi-Shun, Senior Director. Type of the change: New replacement.
お知らせ • Apr 19Realtek Semiconductor Corp Shares to Be Deleted from Other OTCRealtek Semiconductor Corp.'s Shares will be deleted from other OTC effective from April 19, 2022 due to Inactive Security.
お知らせ • Apr 16Realtek Semiconductor Corp. to Report Q1, 2022 Results on Apr 22, 2022Realtek Semiconductor Corp. announced that they will report Q1, 2022 results on Apr 22, 2022
お知らせ • Mar 23Realtek Semiconductor Corp., Annual General Meeting, Jun 08, 2022Realtek Semiconductor Corp., Annual General Meeting, Jun 08, 2022.
お知らせ • Jan 28Celeno and Realtek Debut a Joint Solution for Wi-Fi 6/6E Enabled Fiber GatewaysCeleno Communications announced a collaboration with Realtek for a high performance reference design for 2.5Gbps gateways. The joint solution brings together Celeno's latest Wi-Fi 6 and Wi-Fi 6E (6GHz band) silicon, and Realtek's RTL9607DA PON ONU Gateway Processor to provide a reference platform for next generation fiber access products. The platform delivers improved Wi-Fi performance, range and reliability essential in today's highly dense environments. The Celeno CL8000 family features high-performance, highly integrated Wi-Fi 6/6E (802.11ax R2) PCIe chip solutions based on advanced 14nm geometry to offer a low power and cost-effective architecture. The CL8000 architecture packs two Wi-Fi 6/6E access point radios into a single 11x11 BGA package and utilizes only one PCIe gen 3.0 interface. The CL8080 chip can deliver up to 6Gbps of speed and 8 radio chains, 4x4 2.4GHz and 4x4 5GHz, over a dual lane PCIe interface. The unique single chip architecture with dual transceivers provides a cost-effective Tri-Band solution with an advanced feature set. With the Celeno Wi-Fi solution, combining the CL8080 and CL8066 chips utilizes only two PCIe interfaces and can support a total of 14 radio chains with flexible MIMO assignments, enabling for example a Tri-Band solution supporting 4x4 MIMO on each band (2.4, 5, 6 GHz) plus a dedicated 4th listening radio utilizing up to two receive radio chains to enable parallel spectrum analysis, Zero-Wait-DFS, Zero-Wait-CAC, beacon analysis and packet sniffing for fast and efficient spectrum scanning and channel characterization. Service providers can improve their overall network performance and management capabilities to respond better to their customer needs with this unique quad band solution. Realtek's RTL9607DA 2.5G PON Gateway Processor provides a high performance and flexible enterprise-class gateway solution for operators and carriers worldwide to deploy the next generation of fiber access service to businesses and consumers. The solution integrates a 12.5Gbps routing and switching platform with advanced features, including a multiprotocol xPON ONU MAC and SW that supports the PON modes as defined in IEEE802.3ah (EPON) and ITU-T G.984.3 (GPON). The RTL9607DA features a highly programmable data forwarding and networking engine with a rich set of integrated peripherals powered by Dual SMP ARM CortextTM-A55 CPU cores. The platform provides the stability and features of multiple generations of PON ONU and HGW designs proven in deployments across the world.
お知らせ • Oct 04Realtek Semiconductor Launches the Second Generation of Its 2.5GbE ChipRealtek Semiconductor has launched the second generation of its 2.5GbE chip. While most companies continue to upgrade their wireless routers to Wi-Fi 6 with 2.5GbE ports, this solution falls short of truly increasing connection speed. The entire environment, including bridges such as internet cards and switches, needs to be equipped with Ethernet connections faster than 1Gbps to reach 2.5GbE speeds. Realtek’s second generation 2.5GbE, part of its RTL8125B series for business applications, provides original equipment manufacturers and enterprises with rapid development, while offering home entertainment enthusiasts, gamers, streamers, and audiovisual specialists quicker, more stable, and diversified interface solutions. Key features of the Realtek second generation Ethernet solutions include: Eco-friendly, smaller design: The surface area has been reduced by 64% and power consumption by 50% compared to the first-generation models. Thinner and more energy-efficient, the 2.5GbE lowers the amount of power lost for long-term and large-scale transmissions, making it even more environmentally friendly. High compatibility and stable transmission: The Realtek RTL8125B series is compatible with existing network cables, and it does not require switches for connections under 110 meters. It is also capable of providing stable uni- and bi-directional transmissions (uploading and downloading) even when combined with multiple brands of switches. It provides enterprises and users with an high-speed network environment out of the box, giving them a stable and fast network for teleconferences, data recovery, file transmission, gaming and video streaming. Unique bandwidth-regulating software: The included ‘Dragon’ network bandwidth management software developed by Realtek can be used to assign packet priority. Smart distribution of bandwidth ensures that users most essential applications will not lag. Ethernet is still the most stable method of network transmission. With demand for high-speed network environments on the rise, Realtek’s Second Generation 2.5GbE solution can be widely applied to motherboards, external PCIe cards, and USB network extenders. In addition, other network-related products including web cameras, online hard drives, servers, routers, cable boxes, printers, and base stations can all make use of Realtek’s network solutions, satisfying the need for stable, high-speed network environments from enterprise and network users.
