View Financial HealthSemiFive 配当と自社株買い配当金 基準チェック /06SemiFive配当金を支払った記録がありません。主要情報n/a配当利回り-14.8%バイバック利回り総株主利回り-14.8%将来の配当利回り2.3%配当成長n/a次回配当支払日n/a配当落ち日n/a一株当たり配当金n/a配当性向n/a最近の配当と自社株買いの更新更新なしすべての更新を表示Recent updates分析記事 • Jun 01Companies Like SemiFive (KOSDAQ:490470) Can Afford To Invest In GrowthEven when a business is losing money, it's possible for shareholders to make money if they buy a good business at the...お知らせ • May 29SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE Forum 2026SEMIFIVE announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE Forum 2026) in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE, will deliver a presentation titled 'Leading 3D-IC/Big Die Solution for AI Innovation.' SEMIFIVE presents its 3-dimensional integrated circuit (3D-IC) ASIC design solution as a core strategy to resolve the 'Memory Wall,' the bottleneck between computing devices and memory, which has emerged as a major challenge in the AI industry. SEMIFIVE's 3D-IC solution vertically integrates logic and memory into a single system architecture, significantly shortening data transmission distances. Compared to conventional High Bandwidth Memory (HBM) configurations, this architecture achieves higher memory bandwidth, lower latency, higher power efficiency, and lower cost. Specifically, the reduced chip footprint enables compact packaging and greater design flexibility for a wide range of AI chip development, spanning from edge devices with space and power constraints to high-performance data centers. SEMIFIVE is currently accelerating the commercialization of AI chips that vertically stack a 4-layer memory on top of a large logic chip, in collaboration with global customers. Furthermore, leveraging its proprietary design platform and robust global supply chain, the company is proactively responding to the surging demand for next-generation AI chips while expanding its market influence. SEMIFIVE delivers its optimized Big Die Solution for reliable large-scale AI semiconductor design and will showcase its latest achievements in Big Die design at this forum. The company highlights its collaboration with AI semiconductor startup HyperAccel on 'Bertha,' the LLM Processing Unit (LPU)-based AI inference accelerator. SEMIFIVE successfully executed the comprehensive design and verification process for the Big Die exceeding 500mm² based on Samsung Foundry's 4nm (SF4X) process technology. At the event, SEMIFIVE will host a dedicated exhibition booth to solidify business collaboration and strengthen networking with global customers and partners.Breakeven Date Change • May 26Forecast breakeven date moved forward to 2026The analyst covering SemiFive previously expected the company to break even in 2027. New forecast suggests the company will make a profit of ₩5.59b in 2026. Earnings growth of 99% is required to achieve expected profit on schedule.New Risk • Apr 10New major risk - Share price stabilityThe company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of South Korean stocks, typically moving 17% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. This is currently the only risk that has been identified for the company.お知らせ • Feb 14SemiFive Inc., Annual General Meeting, Mar 31, 2026SemiFive Inc., Annual General Meeting, Mar 31, 2026, at 10:00 Tokyo Standard Time. Location: conference room, 8, seongnam-daero 331beon-gil, bundang-gu, gyeonggi-do, seongnam South KoreaBoard Change • Jan 02No independent directorsNo new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 4 experienced directors. No highly experienced directors. No independent directors (4 non-independent directors). President & Director Steve H. Park was the last director to join the board, commencing their role in 2019. The following issues are considered to be risks according to the Simply Wall St Risk Model: Lack of independent directors. Insufficient board refreshment.決済の安定と成長配当データの取得安定した配当: A490470の 1 株当たり配当が過去に安定していたかどうかを判断するにはデータが不十分です。増加する配当: A490470の配当金が増加しているかどうかを判断するにはデータが不十分です。配当利回り対市場SemiFive 配当利回り対市場A490470 配当利回りは市場と比べてどうか？セグメント配当利回り会社 (A490470)n/a市場下位25% (KR)1.2%市場トップ25% (KR)4.2%業界平均 (Semiconductor)0.2%アナリスト予想 (A490470) (最長3年)2.3%注目すべき配当: A490470は最近配当金を報告していないため、配当金支払者の下位 25% に対して同社の配当利回りを評価することはできません。高配当: A490470は最近配当金を報告していないため、配当金支払者の上位 25% に対して同社の配当利回りを評価することはできません。株主への利益配当収益カバレッジ: A490470の 配当性向 を計算して配当金の支払いが利益で賄われているかどうかを判断するにはデータが不十分です。株主配当金キャッシュフローカバレッジ: A490470が配当金を報告していないため、配当金の持続可能性を計算できません。高配当企業の発掘7D1Y7D1Y7D1YKR 市場の強力な配当支払い企業。View Management企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/06/11 08:24終値2026/06/11 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋SemiFive Inc. 1 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。1 アナリスト機関Nicolas GaudoisUBS Investment Bank
分析記事 • Jun 01Companies Like SemiFive (KOSDAQ:490470) Can Afford To Invest In GrowthEven when a business is losing money, it's possible for shareholders to make money if they buy a good business at the...
お知らせ • May 29SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE Forum 2026SEMIFIVE announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE Forum 2026) in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE, will deliver a presentation titled 'Leading 3D-IC/Big Die Solution for AI Innovation.' SEMIFIVE presents its 3-dimensional integrated circuit (3D-IC) ASIC design solution as a core strategy to resolve the 'Memory Wall,' the bottleneck between computing devices and memory, which has emerged as a major challenge in the AI industry. SEMIFIVE's 3D-IC solution vertically integrates logic and memory into a single system architecture, significantly shortening data transmission distances. Compared to conventional High Bandwidth Memory (HBM) configurations, this architecture achieves higher memory bandwidth, lower latency, higher power efficiency, and lower cost. Specifically, the reduced chip footprint enables compact packaging and greater design flexibility for a wide range of AI chip development, spanning from edge devices with space and power constraints to high-performance data centers. SEMIFIVE is currently accelerating the commercialization of AI chips that vertically stack a 4-layer memory on top of a large logic chip, in collaboration with global customers. Furthermore, leveraging its proprietary design platform and robust global supply chain, the company is proactively responding to the surging demand for next-generation AI chips while expanding its market influence. SEMIFIVE delivers its optimized Big Die Solution for reliable large-scale AI semiconductor design and will showcase its latest achievements in Big Die design at this forum. The company highlights its collaboration with AI semiconductor startup HyperAccel on 'Bertha,' the LLM Processing Unit (LPU)-based AI inference accelerator. SEMIFIVE successfully executed the comprehensive design and verification process for the Big Die exceeding 500mm² based on Samsung Foundry's 4nm (SF4X) process technology. At the event, SEMIFIVE will host a dedicated exhibition booth to solidify business collaboration and strengthen networking with global customers and partners.
Breakeven Date Change • May 26Forecast breakeven date moved forward to 2026The analyst covering SemiFive previously expected the company to break even in 2027. New forecast suggests the company will make a profit of ₩5.59b in 2026. Earnings growth of 99% is required to achieve expected profit on schedule.
New Risk • Apr 10New major risk - Share price stabilityThe company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of South Korean stocks, typically moving 17% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. This is currently the only risk that has been identified for the company.
お知らせ • Feb 14SemiFive Inc., Annual General Meeting, Mar 31, 2026SemiFive Inc., Annual General Meeting, Mar 31, 2026, at 10:00 Tokyo Standard Time. Location: conference room, 8, seongnam-daero 331beon-gil, bundang-gu, gyeonggi-do, seongnam South Korea
Board Change • Jan 02No independent directorsNo new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 4 experienced directors. No highly experienced directors. No independent directors (4 non-independent directors). President & Director Steve H. Park was the last director to join the board, commencing their role in 2019. The following issues are considered to be risks according to the Simply Wall St Risk Model: Lack of independent directors. Insufficient board refreshment.