Texas Instruments（TII0）株式概要テキサス・インスツルメンツ・インコーポレイテッドは、米国、中国、その他のアジア、欧州、中東、アフリカ、日本、および世界各国の電子機器設計・製造業者向けに半導体の設計、製造、販売を行っている。 詳細TII0 ファンダメンタル分析スノーフレーク・スコア評価2/6将来の成長3/6過去の実績4/6財務の健全性3/6配当金3/6報酬株価収益率（ 52 x）は、 Semiconductor業界平均（ 65.4 x）を下回っています。収益は年間16.23%増加すると予測されています 過去1年間で収益は10.1%増加しました リスク分析1.86%の配当は、利益やフリーキャッシュフローによって十分にカバーされていない 多額の負債を抱えている すべてのリスクチェックを見るTII0 Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.Your Fair Value€Current Price€19.5093.0% 割安 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture031b2016201920222025202620282031Revenue US$30.8bEarnings US$8.9bAdvancedSet Fair ValueView all narrativesTexas Instruments Incorporated 競合他社Infineon TechnologiesSymbol: XTRA:IFXMarket cap: €88.3bElmos SemiconductorSymbol: XTRA:ELGMarket cap: €3.2bFirst SensorSymbol: XTRA:SISMarket cap: €553.1mAnalog DevicesSymbol: NasdaqGS:ADIMarket cap: US$202.3b価格と性能株価の高値、安値、推移の概要Texas Instruments過去の株価現在の株価US$19.5052週高値US$20.4052週安値US$9.70ベータ1.31ヶ月の変化31.76%3ヶ月変化36.36%1年変化56.00%3年間の変化n/a5年間の変化n/aIPOからの変化55.23%最新ニュースお知らせ • Apr 17Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026.お知らせ • Mar 23Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield TechnologyTexas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V).お知らせ • Mar 17Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIATexas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.お知らせ • Mar 10Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence CapabilitiesTexas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available.お知らせ • Mar 05Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United Statesお知らせ • Feb 04+ 1 more updateTexas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion.Texas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion on February 4, 2026. A cash consideration valued at $231 per share will be paid by Texas Instruments Incorporated. The acquisition will create a global leader in embedded wireless connectivity solutions by combining Silicon Labs’ strong portfolio and expertise in mixed signal solutions with Texas Instruments’ leading analog and embedded processing portfolio and internally owned technology and manufacturing capabilities. The combined company will accelerate growth by better serving existing and new customers through enhanced innovation and market access. Texas Instruments expects to fund the transaction with a combination of cash on hand and debt financing to be arranged prior to closing. Upon termination of the Merger Agreement, the Company, under specified circumstances, including termination by the Company to accept a Superior Proposal or termination by Parent if the Board effects a Change of Recommendation, will be required to pay to Parent a termination fee of $259 million. Additionally, Parent, under specified circumstances, including termination due to any Legal Restraint (solely to the extent such Legal Restraint relates to any Regulatory Law) permanently enjoining consummation of the Merger or failure to receive certain required regulatory approvals by the Termination Date (in each case, if all other conditions to closing have been satisfied or waived, other than conditions that by their nature are to be satisfied at the Closing), will be required to pay the Company a termination fee of $499 million. Under the terms of the agreement, which has been unanimously approved by the Board of Directors of both companies. The transaction is not subject to any financing contingency, the expiration or termination of the required waiting periods under the Hart-Scott-Rodino Antitrust Improvements Act of 1976. The transaction is expected to be accretive to Texas Instruments’ earnings per share, excluding transaction-related costs, in the first full year post-close. Goldman Sachs & Co. LLC is serving as exclusive financial advisor to Texas Instruments, Joele Frank, Wilkinson Brimmer Katcher is serving as strategic communications advisor. Qatalyst Partners is serving as exclusive financial advisor to Silicon Labs, and FGS Global is serving as strategic communications advisor. Robert J. Cardone, Alain A. Dermarkar, Michael Walraven of Allen Overy Shearman Sterling US LLP acted as legal advisor to Texas Instruments. Amanda Maki, Andy Eklund, Jennifer M. Kashatus, Nicholas Klein, Brian Hamano, Jamie Knox, Ronald N. Brown, III, Brian J. Boyle, Jeffrey D. Aronson, Michelle Lara, Jeffrey Scharfstein, John J. Gilluly III and Viktor Sapezhnikov of DLA Piper LLP (US) acted as legal advisor to Silicon Laboratories.最新情報をもっと見るRecent updatesお知らせ • Apr 17Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026.お知らせ • Mar 23Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield TechnologyTexas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V).お知らせ • Mar 17Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIATexas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.お知らせ • Mar 10Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence CapabilitiesTexas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available.お知らせ • Mar 05Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United Statesお知らせ • Feb 04+ 1 more updateTexas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion.Texas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion on February 4, 2026. A cash consideration valued at $231 per share will be paid by Texas Instruments Incorporated. The acquisition will create a global leader in embedded wireless connectivity solutions by combining Silicon Labs’ strong portfolio and expertise in mixed signal solutions with Texas Instruments’ leading analog and embedded processing portfolio and internally owned technology and manufacturing capabilities. The combined company will accelerate growth by better serving existing and new customers through enhanced innovation and market access. Texas Instruments expects to fund the transaction with a combination of cash on hand and debt financing to be arranged prior to closing. Upon termination of the Merger Agreement, the Company, under specified circumstances, including termination by the Company to accept a Superior Proposal or termination by Parent if the Board effects a Change of Recommendation, will be required to pay to Parent a termination fee of $259 million. Additionally, Parent, under specified circumstances, including termination due to any Legal Restraint (solely to the extent such Legal Restraint relates to any Regulatory Law) permanently enjoining consummation of the Merger or failure to receive certain required regulatory approvals by the Termination Date (in each case, if all other conditions to closing have been satisfied or waived, other than conditions that by their nature are to be satisfied at the Closing), will be required to pay the Company a termination fee of $499 million. Under the terms of the agreement, which has been unanimously approved by the Board of Directors of both companies. The transaction is not subject to any financing contingency, the expiration or termination of the required waiting periods under the Hart-Scott-Rodino Antitrust Improvements Act of 1976. The transaction is expected to be accretive to Texas Instruments’ earnings per share, excluding transaction-related costs, in the first full year post-close. Goldman Sachs & Co. LLC is serving as exclusive financial advisor to Texas Instruments, Joele Frank, Wilkinson Brimmer Katcher is serving as strategic communications advisor. Qatalyst Partners is serving as exclusive financial advisor to Silicon Labs, and FGS Global is serving as strategic communications advisor. Robert J. Cardone, Alain A. Dermarkar, Michael Walraven of Allen Overy Shearman Sterling US LLP acted as legal advisor to Texas Instruments. Amanda Maki, Andy Eklund, Jennifer M. Kashatus, Nicholas Klein, Brian Hamano, Jamie Knox, Ronald N. Brown, III, Brian J. Boyle, Jeffrey D. Aronson, Michelle Lara, Jeffrey Scharfstein, John J. Gilluly III and Viktor Sapezhnikov of DLA Piper LLP (US) acted as legal advisor to Silicon Laboratories.お知らせ • Jan 29Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48.お知らせ • Jan 16Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026.お知らせ • Jan 05Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous VehiclesTexas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models.お知らせ • Oct 22Texas Instruments Incorporated Provides Earnings Guidance for the Fourth Quarter of 2025Texas Instruments Incorporated provided earnings guidance for the fourth quarter of 2025. For the quarter, the company expects revenue in the range of $4.22 billion to $4.58 billion and earnings per share between $1.13 and $1.39.お知らせ • Oct 17Texas Instruments Incorporated Announces Board ChangesOn October 16, 2025, Richard K. Templeton notified the Board of Directors of Texas Instruments Incorporated that he will retire as executive chairman and as a member of the Board on December 31, 2025. The Board has appointed Haviv Ilan, the Company’s president and chief executive officer, as the Company’s new chairman, effective on Mr. Templeton’s retirement. Beginning January 2026. Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company. Ilan has been a member of the board of directors since 2021 and TI’s president and CEO since 2023. Prior to that, he was chief operating officer and held senior leadership positions across TI’s analog and embedded processing businesses during his 26-year career at the company.お知らせ • Oct 15Renesas Reportedly Explores Sale of Timing UnitRenesas Electronics Corporation (TSE:6723) is working with bankers at JPMorgan to explore the potential sale of its timing division in a deal that could value the business at close to $2 billion, Reuters' Milana Vinn reported. According to people familiar with the matter, Texas Instruments Incorporated (NasdaqGS:TXN) and Infineon Technologies AG (XTRA:IFX) are among the potential buyers of the unit.お知らせ • Sep 19Texas Instruments Incorporated Raises Quarterly Cash Dividend, Payable on November 12, 2025Texas Instruments Incorporated (TI) announced it will raise its quarterly cash dividend 4%, from $1.36 per share to $1.42, or $5.68 annualized. The higher dividend will be payable November 12, 2025, to stockholders of record on October 31, 2025, contingent upon formal declaration by the board of directors at its regular meeting in October.お知らせ • Jul 23Texas Instruments Incorporated Provides Earnings Guidance for the Third Quarter of 2025Texas Instruments Incorporated provided earnings guidance for the third quarter of 2025. For the quarter company expects revenue in the range of $4.45 billion to $4.80 billion and earnings per share between $1.36 and $1.60.お知らせ • Jul 18Texas Instruments Incorporated Declares Cash Dividend for the Third Quarter of 2025, Payable on August 12, 2025Texas Instruments Incorporated's board of directors declared a quarterly cash dividend of $1.36 per share of common stock for the third quarter of 2025, payable August 12, 2025, to stockholders of record on July 31, 2025.お知らせ • Jun 28Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 IndexTexas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Indexお知らせ • Apr 24Texas Instruments Incorporated Provides Earnings Guidance for the Second Quarter of 2025Texas Instruments Incorporated provided earnings guidance for the second quarter of 2025. The company’s second quarter outlook is for revenue in the range of $4.17 billion to $4.53 billion and earnings per share between $1.21 and $1.47.お知らせ • Apr 18Texas Instruments Board Declares Second Quarter 2025 Dividend, Payable on May 13, 2025The board of directors of Texas Instruments Incorporated declared a Second Quarter 2025 cash dividend of $1.36 per share of common stock, payable May 13, 2025, to stockholders of record on April 30, 2025.お知らせ • Apr 15Texas Instruments Introduces New Portfolio of Automotive Lidar, Time and Radar ChipsTexas Instruments introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities. Real-time decision-making with 30% longer distance measurements. A crucial technology for the future of safe autonomous vehicles, lidar provides a detailed 3D map of the driver's surroundings. This integration also supports an average 30% reduction in system costs while reducing solution size by four times, empowering design engineers to discretely mount compact, affordable lidar modules in more areas and across more vehicle models As lidar technology reaches higher output currents, vast variations in pulse duration over temperature make it challenging to meet eye safety standards. TI's LMH13000 laser driver provides up to 5A of adjustable output current with only 2% variation across its -40C to 125C ambient temperature range, compared to discrete solutions that can have up to 30% variation. The device's short pulse-width generation and current control enable the system to meet Class 1 U.S. Food and Drug Administration eye safety standards. Electronics in ADAS and in-vehicle infotainment systems must work reliably while facing temperature fluctuations, fluctuations and electromagnetic interference. With TI's BAW technology benefits, the new CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators increase reliability by 100 times compared to traditional quartz-based clocks, with a failure-in-time rate of 0.3. Enhanced clocking precision and resilience in harsh conditions enable safer operation, cleaner data communication, and higher-speed data processing across next-generation vehicle subsystems. Additionally, the company unveiled a new front and corner radar sensor, the AWR2944P, building on TI's widely adopted AWR2944 platform. The new radar sensor's enhancements improve vehicle safety by extending detection range, improving angular accuracy, and enabling more sophisticated processing algorithms. Key enhancements include: An improved signal-to-noise ratio. A larger memory capacity. An integrated radar hardware accelerator that allows the microcontroller and digital signal processor to execute machine learning for edge artificial intelligence applications. TI's new automotive lidar, clock and Radar solutions build on the company's commitment to helping engineers design adaptable ADAS for a safer, more automated driving experience. Package, availability and pricing. Pre production quantities of the LMH13000, CDC6C-Q1, CDC6C-Q 1, LMK3H0102 -Q1, LMK3H0105-Q1 and LMK 3C0105-Q1.お知らせ • Mar 18Texas Instruments Debuts New Power- Management Chips to Support the Rapidly Growing Power Needs of Data CentersTexas Instruments debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI's new TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the LMG3650R035, LMG3650R025 and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia. The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>98%) and high-power density (>100W/in3). They also integrate advanced protection features including over-current protection, short-circuit protection and over-temperature protection. This is especially important for AC/DC applications like server power, where designers are challenged to push more power into smaller spaces. At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including: Dell's 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell's first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency. Vertiv's 5.5kW server PSU: Part of Vertiv's PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack. Greatwall's 8kWPS: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rackPSU using TI GaN technology and TI C2000 real-time microcontrollers. Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at tuck-in. Package, availability and pricing. Preproduction quantities of the TPS1685, LMG3650R035), LMG3650R070 and LMG3650R025 are available for purchase now on TI.com. Multiple payment and shipping options are available. Evaluation modules are available. Evaluation modules are used to be available for the first and available for purchase now on TI".お知らせ • Mar 12Texas Instruments Introduces Small MCU, Expanding its Comprehensive Arm Cortex-M0+ MSPM0 MCU PortfolioTexas Instruments (TI) introduced the small MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance. With over 100 cost-effective MCUs, TI's MSPM0 MCU portfolio offers scalable configurations of on-chip analog peripherals and a range of computing options to enhance the sensing and control capabilities of embedded designs. TI will display these devices at embedded world 2025, March 11, 2025 – March 13, 2025, in Nuremberg, Germany. The MSPM0C1104 MCU leverages the advantages of WCSP packaging technology, along with intentional feature selection and TI's cost optimization efforts. The size of the eight-ball WCSP is 1.38mm, making it 38% smaller than competing devices. The MCU features 16KB of memory; a 12-bit analog-to-digital converter with three channels; six general-purpose input/output pins; and compatibility with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (IC). Integrating accurate, high-speed analog components into the world's smallest MCU gives engineers the flexibility to maintain the computing performance of their embedded systems without increasing board size. The new MSPM0C1104 joins TI's MSPM0 MCU portfolio, which offers scalability, cost optimization and ease of use to accelerate time to market. TI's MSPM0 MCUs feature pin-to-pin compatible package options and feature sets to match memory, analog and computing requirements in personal electronics, industrial and automotive applications. Starting at USD 0.16 in 1,000-unit quantities, the portfolio includes other small packages to help reduce board size and bill of materials. This optimization and feature integration across the portfolio help engineers design products of any size while reducing cost and complexity in their systems. For further support, TI's comprehensive ecosystem includes an optimized software development kit for all MSPM0 MCUs; a hardware development kit for rapid prototyping; reference designs; and subsystems, which are code examples for common MCU functions. TI's Zero Code Studio tool enables users to configure, develop and run MCU applications in minutes without coding. Engineers can take advantage of this ecosystem to scale designs and reuse code without the need for significant hardware or software modifications. In addition to this ecosystem, TI's MSPM0 MCU portfolio is supported by TI's growing investments in its internal manufacturing capacity to support future demand. At embedded world 2025, TI will demonstrate how its technologies enable engineers to reimagine embedded systems, helping create a more intelligent and connected world. TI's exhibit in Hall 3A, Booth No. 131 will include advancements in real-time monitoring and perception with edge artificial intelligence, connectivity for the Internet of Things, and development with open-source software. Package, availability and pricing: Preproduction quantities of the MSPM0C1104 MCU are available at TI.com. Pricing of the WCSP device is USD 0.20 in 1,000-unit quantities. Multiple payment and shipping options are available. The MSPM0C1104 LaunchPad development kit is available for USD 5.99 on TI.com.お知らせ • Mar 07Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025. Location: 12500 ti boulevard, texas, dallas United States株主還元TII0DE SemiconductorDE 市場7D2.1%4.9%2.0%1Y56.0%105.1%-0.1%株主還元を見る業界別リターン: TII0過去 1 年間で105.1 % の収益を上げたGerman Semiconductor業界を下回りました。リターン対市場: TII0過去 1 年間で-0.1 % の収益を上げたGerman市場を上回りました。価格変動Is TII0's price volatile compared to industry and market?TII0 volatilityTII0 Average Weekly Movement8.3%Semiconductor Industry Average Movement9.2%Market Average Movement6.2%10% most volatile stocks in DE Market13.3%10% least volatile stocks in DE Market2.7%安定した株価: TII0 、 German市場と比較して、過去 3 か月間で大きな価格変動はありませんでした。時間の経過による変動: TII0の 週次ボラティリティ ( 8% ) は過去 1 年間安定しています。会社概要設立従業員CEO（最高経営責任者ウェブサイト193033,000Haviv Ilanwww.ti.comテキサス・インスツルメンツ・インコーポレイテッドは、米国、中国、その他のアジア、欧州、中東、アフリカ、日本、および世界各国の電子機器設計・製造業者向けに半導体の設計、製造、販売を行っている。アナログ・セグメントとエンベデッド・プロセッシング・セグメ ントを通じて事業を展開している。アナログ部門では、バッテリー管理ソリューション、DC/DCスイッチング・レギュレーター、AC/DCおよび絶縁型コントローラーとコンバーター、電源スイッチ、リニア・レギュレーター、電圧基準、照明製品など、さまざまな電圧レベルの電力要件を管理するための電源製品を提供している。アンプ、データ・コンバータ、インターフェイス製品、モーター・ドライブ、クロック、ロジック・センシング製品など。エンベデッド・プロセッシング部門は、マイクロコントローラー、プロセッサー、ワイヤレス・コネクティビティー、レーダー製品、および特定のコンピューティング・アクティビティー向けのアプリケーション・プロセッサーを提供している。このセグメントでは、産業用、車載用、パーソナル・エレクトロニクス、通信機器、企業システム、電卓など様々な市場で使用される製品を提供している。主に高解像度画像の投影に使用されるDLP製品、電卓、特定用途向け集積回路を提供している。同社は直販や代理店、ウェブサイトを通じて半導体製品を販売する。同社は1930年に設立され、テキサス州ダラスに本社を置いている。もっと見るTexas Instruments Incorporated 基礎のまとめTexas Instruments の収益と売上を時価総額と比較するとどうか。TII0 基礎統計学時価総額€236.58b収益（TTM）€4.59b売上高(TTM)€15.85b52.0xPER（株価収益率15.0xP/SレシオTII0 は割高か？公正価値と評価分析を参照収益と収入最新の決算報告書（TTM）に基づく主な収益性統計TII0 損益計算書（TTM）収益US$18.44b売上原価US$7.87b売上総利益US$10.57bその他の費用US$5.23b収益US$5.34b直近の収益報告Mar 31, 2026次回決算日該当なし一株当たり利益（EPS）5.86グロス・マージン57.32%純利益率28.94%有利子負債／自己資本比率83.7%TII0 の長期的なパフォーマンスは？過去の実績と比較を見る配当金1.9%現在の配当利回り95%配当性向View Valuation企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/20 17:09終値2026/05/20 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Texas Instruments Incorporated 35 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。65 アナリスト機関George ChangAletheia Analyst Network LimitedAlexi UngerArete Research Services LLPBrett SimpsonArete Research Services LLP62 その他のアナリストを表示
お知らせ • Apr 17Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026.
お知らせ • Mar 23Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield TechnologyTexas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V).
お知らせ • Mar 17Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIATexas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.
お知らせ • Mar 10Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence CapabilitiesTexas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available.
お知らせ • Mar 05Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States
お知らせ • Feb 04+ 1 more updateTexas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion.Texas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion on February 4, 2026. A cash consideration valued at $231 per share will be paid by Texas Instruments Incorporated. The acquisition will create a global leader in embedded wireless connectivity solutions by combining Silicon Labs’ strong portfolio and expertise in mixed signal solutions with Texas Instruments’ leading analog and embedded processing portfolio and internally owned technology and manufacturing capabilities. The combined company will accelerate growth by better serving existing and new customers through enhanced innovation and market access. Texas Instruments expects to fund the transaction with a combination of cash on hand and debt financing to be arranged prior to closing. Upon termination of the Merger Agreement, the Company, under specified circumstances, including termination by the Company to accept a Superior Proposal or termination by Parent if the Board effects a Change of Recommendation, will be required to pay to Parent a termination fee of $259 million. Additionally, Parent, under specified circumstances, including termination due to any Legal Restraint (solely to the extent such Legal Restraint relates to any Regulatory Law) permanently enjoining consummation of the Merger or failure to receive certain required regulatory approvals by the Termination Date (in each case, if all other conditions to closing have been satisfied or waived, other than conditions that by their nature are to be satisfied at the Closing), will be required to pay the Company a termination fee of $499 million. Under the terms of the agreement, which has been unanimously approved by the Board of Directors of both companies. The transaction is not subject to any financing contingency, the expiration or termination of the required waiting periods under the Hart-Scott-Rodino Antitrust Improvements Act of 1976. The transaction is expected to be accretive to Texas Instruments’ earnings per share, excluding transaction-related costs, in the first full year post-close. Goldman Sachs & Co. LLC is serving as exclusive financial advisor to Texas Instruments, Joele Frank, Wilkinson Brimmer Katcher is serving as strategic communications advisor. Qatalyst Partners is serving as exclusive financial advisor to Silicon Labs, and FGS Global is serving as strategic communications advisor. Robert J. Cardone, Alain A. Dermarkar, Michael Walraven of Allen Overy Shearman Sterling US LLP acted as legal advisor to Texas Instruments. Amanda Maki, Andy Eklund, Jennifer M. Kashatus, Nicholas Klein, Brian Hamano, Jamie Knox, Ronald N. Brown, III, Brian J. Boyle, Jeffrey D. Aronson, Michelle Lara, Jeffrey Scharfstein, John J. Gilluly III and Viktor Sapezhnikov of DLA Piper LLP (US) acted as legal advisor to Silicon Laboratories.
お知らせ • Apr 17Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026.
お知らせ • Mar 23Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield TechnologyTexas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V).
お知らせ • Mar 17Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIATexas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.
お知らせ • Mar 10Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence CapabilitiesTexas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available.
お知らせ • Mar 05Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States
お知らせ • Feb 04+ 1 more updateTexas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion.Texas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion on February 4, 2026. A cash consideration valued at $231 per share will be paid by Texas Instruments Incorporated. The acquisition will create a global leader in embedded wireless connectivity solutions by combining Silicon Labs’ strong portfolio and expertise in mixed signal solutions with Texas Instruments’ leading analog and embedded processing portfolio and internally owned technology and manufacturing capabilities. The combined company will accelerate growth by better serving existing and new customers through enhanced innovation and market access. Texas Instruments expects to fund the transaction with a combination of cash on hand and debt financing to be arranged prior to closing. Upon termination of the Merger Agreement, the Company, under specified circumstances, including termination by the Company to accept a Superior Proposal or termination by Parent if the Board effects a Change of Recommendation, will be required to pay to Parent a termination fee of $259 million. Additionally, Parent, under specified circumstances, including termination due to any Legal Restraint (solely to the extent such Legal Restraint relates to any Regulatory Law) permanently enjoining consummation of the Merger or failure to receive certain required regulatory approvals by the Termination Date (in each case, if all other conditions to closing have been satisfied or waived, other than conditions that by their nature are to be satisfied at the Closing), will be required to pay the Company a termination fee of $499 million. Under the terms of the agreement, which has been unanimously approved by the Board of Directors of both companies. The transaction is not subject to any financing contingency, the expiration or termination of the required waiting periods under the Hart-Scott-Rodino Antitrust Improvements Act of 1976. The transaction is expected to be accretive to Texas Instruments’ earnings per share, excluding transaction-related costs, in the first full year post-close. Goldman Sachs & Co. LLC is serving as exclusive financial advisor to Texas Instruments, Joele Frank, Wilkinson Brimmer Katcher is serving as strategic communications advisor. Qatalyst Partners is serving as exclusive financial advisor to Silicon Labs, and FGS Global is serving as strategic communications advisor. Robert J. Cardone, Alain A. Dermarkar, Michael Walraven of Allen Overy Shearman Sterling US LLP acted as legal advisor to Texas Instruments. Amanda Maki, Andy Eklund, Jennifer M. Kashatus, Nicholas Klein, Brian Hamano, Jamie Knox, Ronald N. Brown, III, Brian J. Boyle, Jeffrey D. Aronson, Michelle Lara, Jeffrey Scharfstein, John J. Gilluly III and Viktor Sapezhnikov of DLA Piper LLP (US) acted as legal advisor to Silicon Laboratories.
お知らせ • Jan 29Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48.
お知らせ • Jan 16Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026.
お知らせ • Jan 05Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous VehiclesTexas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models.
お知らせ • Oct 22Texas Instruments Incorporated Provides Earnings Guidance for the Fourth Quarter of 2025Texas Instruments Incorporated provided earnings guidance for the fourth quarter of 2025. For the quarter, the company expects revenue in the range of $4.22 billion to $4.58 billion and earnings per share between $1.13 and $1.39.
お知らせ • Oct 17Texas Instruments Incorporated Announces Board ChangesOn October 16, 2025, Richard K. Templeton notified the Board of Directors of Texas Instruments Incorporated that he will retire as executive chairman and as a member of the Board on December 31, 2025. The Board has appointed Haviv Ilan, the Company’s president and chief executive officer, as the Company’s new chairman, effective on Mr. Templeton’s retirement. Beginning January 2026. Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company. Ilan has been a member of the board of directors since 2021 and TI’s president and CEO since 2023. Prior to that, he was chief operating officer and held senior leadership positions across TI’s analog and embedded processing businesses during his 26-year career at the company.
お知らせ • Oct 15Renesas Reportedly Explores Sale of Timing UnitRenesas Electronics Corporation (TSE:6723) is working with bankers at JPMorgan to explore the potential sale of its timing division in a deal that could value the business at close to $2 billion, Reuters' Milana Vinn reported. According to people familiar with the matter, Texas Instruments Incorporated (NasdaqGS:TXN) and Infineon Technologies AG (XTRA:IFX) are among the potential buyers of the unit.
お知らせ • Sep 19Texas Instruments Incorporated Raises Quarterly Cash Dividend, Payable on November 12, 2025Texas Instruments Incorporated (TI) announced it will raise its quarterly cash dividend 4%, from $1.36 per share to $1.42, or $5.68 annualized. The higher dividend will be payable November 12, 2025, to stockholders of record on October 31, 2025, contingent upon formal declaration by the board of directors at its regular meeting in October.
お知らせ • Jul 23Texas Instruments Incorporated Provides Earnings Guidance for the Third Quarter of 2025Texas Instruments Incorporated provided earnings guidance for the third quarter of 2025. For the quarter company expects revenue in the range of $4.45 billion to $4.80 billion and earnings per share between $1.36 and $1.60.
お知らせ • Jul 18Texas Instruments Incorporated Declares Cash Dividend for the Third Quarter of 2025, Payable on August 12, 2025Texas Instruments Incorporated's board of directors declared a quarterly cash dividend of $1.36 per share of common stock for the third quarter of 2025, payable August 12, 2025, to stockholders of record on July 31, 2025.
お知らせ • Jun 28Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 IndexTexas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index
お知らせ • Apr 24Texas Instruments Incorporated Provides Earnings Guidance for the Second Quarter of 2025Texas Instruments Incorporated provided earnings guidance for the second quarter of 2025. The company’s second quarter outlook is for revenue in the range of $4.17 billion to $4.53 billion and earnings per share between $1.21 and $1.47.
お知らせ • Apr 18Texas Instruments Board Declares Second Quarter 2025 Dividend, Payable on May 13, 2025The board of directors of Texas Instruments Incorporated declared a Second Quarter 2025 cash dividend of $1.36 per share of common stock, payable May 13, 2025, to stockholders of record on April 30, 2025.
お知らせ • Apr 15Texas Instruments Introduces New Portfolio of Automotive Lidar, Time and Radar ChipsTexas Instruments introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities. Real-time decision-making with 30% longer distance measurements. A crucial technology for the future of safe autonomous vehicles, lidar provides a detailed 3D map of the driver's surroundings. This integration also supports an average 30% reduction in system costs while reducing solution size by four times, empowering design engineers to discretely mount compact, affordable lidar modules in more areas and across more vehicle models As lidar technology reaches higher output currents, vast variations in pulse duration over temperature make it challenging to meet eye safety standards. TI's LMH13000 laser driver provides up to 5A of adjustable output current with only 2% variation across its -40C to 125C ambient temperature range, compared to discrete solutions that can have up to 30% variation. The device's short pulse-width generation and current control enable the system to meet Class 1 U.S. Food and Drug Administration eye safety standards. Electronics in ADAS and in-vehicle infotainment systems must work reliably while facing temperature fluctuations, fluctuations and electromagnetic interference. With TI's BAW technology benefits, the new CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators increase reliability by 100 times compared to traditional quartz-based clocks, with a failure-in-time rate of 0.3. Enhanced clocking precision and resilience in harsh conditions enable safer operation, cleaner data communication, and higher-speed data processing across next-generation vehicle subsystems. Additionally, the company unveiled a new front and corner radar sensor, the AWR2944P, building on TI's widely adopted AWR2944 platform. The new radar sensor's enhancements improve vehicle safety by extending detection range, improving angular accuracy, and enabling more sophisticated processing algorithms. Key enhancements include: An improved signal-to-noise ratio. A larger memory capacity. An integrated radar hardware accelerator that allows the microcontroller and digital signal processor to execute machine learning for edge artificial intelligence applications. TI's new automotive lidar, clock and Radar solutions build on the company's commitment to helping engineers design adaptable ADAS for a safer, more automated driving experience. Package, availability and pricing. Pre production quantities of the LMH13000, CDC6C-Q1, CDC6C-Q 1, LMK3H0102 -Q1, LMK3H0105-Q1 and LMK 3C0105-Q1.
お知らせ • Mar 18Texas Instruments Debuts New Power- Management Chips to Support the Rapidly Growing Power Needs of Data CentersTexas Instruments debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI's new TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the LMG3650R035, LMG3650R025 and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia. The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>98%) and high-power density (>100W/in3). They also integrate advanced protection features including over-current protection, short-circuit protection and over-temperature protection. This is especially important for AC/DC applications like server power, where designers are challenged to push more power into smaller spaces. At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including: Dell's 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell's first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency. Vertiv's 5.5kW server PSU: Part of Vertiv's PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack. Greatwall's 8kWPS: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rackPSU using TI GaN technology and TI C2000 real-time microcontrollers. Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at tuck-in. Package, availability and pricing. Preproduction quantities of the TPS1685, LMG3650R035), LMG3650R070 and LMG3650R025 are available for purchase now on TI.com. Multiple payment and shipping options are available. Evaluation modules are available. Evaluation modules are used to be available for the first and available for purchase now on TI".
お知らせ • Mar 12Texas Instruments Introduces Small MCU, Expanding its Comprehensive Arm Cortex-M0+ MSPM0 MCU PortfolioTexas Instruments (TI) introduced the small MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance. With over 100 cost-effective MCUs, TI's MSPM0 MCU portfolio offers scalable configurations of on-chip analog peripherals and a range of computing options to enhance the sensing and control capabilities of embedded designs. TI will display these devices at embedded world 2025, March 11, 2025 – March 13, 2025, in Nuremberg, Germany. The MSPM0C1104 MCU leverages the advantages of WCSP packaging technology, along with intentional feature selection and TI's cost optimization efforts. The size of the eight-ball WCSP is 1.38mm, making it 38% smaller than competing devices. The MCU features 16KB of memory; a 12-bit analog-to-digital converter with three channels; six general-purpose input/output pins; and compatibility with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (IC). Integrating accurate, high-speed analog components into the world's smallest MCU gives engineers the flexibility to maintain the computing performance of their embedded systems without increasing board size. The new MSPM0C1104 joins TI's MSPM0 MCU portfolio, which offers scalability, cost optimization and ease of use to accelerate time to market. TI's MSPM0 MCUs feature pin-to-pin compatible package options and feature sets to match memory, analog and computing requirements in personal electronics, industrial and automotive applications. Starting at USD 0.16 in 1,000-unit quantities, the portfolio includes other small packages to help reduce board size and bill of materials. This optimization and feature integration across the portfolio help engineers design products of any size while reducing cost and complexity in their systems. For further support, TI's comprehensive ecosystem includes an optimized software development kit for all MSPM0 MCUs; a hardware development kit for rapid prototyping; reference designs; and subsystems, which are code examples for common MCU functions. TI's Zero Code Studio tool enables users to configure, develop and run MCU applications in minutes without coding. Engineers can take advantage of this ecosystem to scale designs and reuse code without the need for significant hardware or software modifications. In addition to this ecosystem, TI's MSPM0 MCU portfolio is supported by TI's growing investments in its internal manufacturing capacity to support future demand. At embedded world 2025, TI will demonstrate how its technologies enable engineers to reimagine embedded systems, helping create a more intelligent and connected world. TI's exhibit in Hall 3A, Booth No. 131 will include advancements in real-time monitoring and perception with edge artificial intelligence, connectivity for the Internet of Things, and development with open-source software. Package, availability and pricing: Preproduction quantities of the MSPM0C1104 MCU are available at TI.com. Pricing of the WCSP device is USD 0.20 in 1,000-unit quantities. Multiple payment and shipping options are available. The MSPM0C1104 LaunchPad development kit is available for USD 5.99 on TI.com.
お知らせ • Mar 07Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025. Location: 12500 ti boulevard, texas, dallas United States
