Declared Dividend • Jul 27
Second quarter dividend of US$1.42 announced Shareholders will receive a dividend of US$1.42. Ex-date: 31st July 2026 Payment date: 11th August 2026 Dividend yield will be 2.2%, which is higher than the industry average of 1.2%. Sustainability & Growth Dividend is covered by earnings (85% earnings payout ratio) but not adequately covered by cash flows (97% cash payout ratio). The dividend has increased by an average of 14% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. EPS is expected to grow by 61% over the next 3 years, which should provide support to the dividend and adequate earnings cover. Ankündigung • Jul 25
Texas Instruments Incorporated Provides Earnings Guidance for the Third Quarter of 2026 Texas Instruments Incorporated provided earnings guidance for the third quarter of 2026. For the third quarter of 2026, the company expects revenue in the range of $5.65 billion to $6.15 billion and earnings per share to be in the range of $2.23 to $2.57. Reported Earnings • Jul 24
Second quarter 2026 earnings released: EPS: US$2.17 (vs US$1.42 in 2Q 2025) Second quarter 2026 results: EPS: US$2.17 (up from US$1.42 in 2Q 2025). Revenue: US$5.46b (up 23% from 2Q 2025). Net income: US$1.98b (up 54% from 2Q 2025). Profit margin: 36% (up from 29% in 2Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 11% p.a. on average during the next 3 years, compared to a 16% growth forecast for the Semiconductor industry in Europe. Ankündigung • Jul 17
Texas Instruments Incorporated Declares Quarterly Cash Dividend for Third Quarter 2026, Payable on August 11, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable August 11, 2026, to stockholders of record on July 31, 2026. Buy Or Sell Opportunity • Jun 30
Now 21% overvalued after recent price rise Over the last 90 days, the stock has risen 53% to CHF237. The fair value is estimated to be CHF196, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 2.5% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 11% per annum. Earnings are also forecast to grow by 17% per annum over the same time period. New Risk • Jun 30
New major risk - Share price stability The company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of Swiss stocks, typically moving 7.5% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. Currently, the following risks have been identified for the company: Major Risks Share price has been highly volatile over the past 3 months (7.5% average weekly change). Dividend is not well covered by earnings and cash flows. Payout ratio: 95% Cash payout ratio: 139% Minor Risks High level of debt (53% net debt to equity). Significant insider selling over the past 3 months (CHF11m sold). Ankündigung • Jun 09
Texas Instruments Introduces BQ79826Z-Q1 Battery Monitor With Integrated EIS Engine Texas Instruments introduced the industry's highest-cell-count battery monitor with an integrated electrochemical impedance spectroscopy engine, bringing predictive intelligence, comprehensive data and real-time diagnostics to battery monitoring in electric vehicles and energy storage system applications. The BQ79826Z-Q1 battery monitor enhances safety and extends battery life by detecting potential failures from within battery cells. The single chip delivers the highest-cell-count monitoring in its class, tracking up to 44% more channels than previous generations. With this increase in channels, the device significantly decreases the number of components required in a battery pack, reducing system complexity and cost without compromising reliability. The BQ79826Z-Q1 supports up to 26 cells per device, eight more than any competing solution, setting a new industry standard. Fewer monitoring devices means a lower bill of materials, simplified architecture and reduced board space requirements, translating to meaningful cost savings per channel without sacrificing quality or reliability. When paired with the BQ79881-Q1 pack monitor and optional Texas Instruments communications bridge, these devices create a powerful chipset that works across different module sizes, battery chemistries and mechanical designs, giving engineers the flexibility to design once and deploy everywhere. Integrated EIS technology enables the BQ78926Z-Q1 to detect fault conditions earlier – from inside the cells – helping maintain safety and notifying passengers of potential vehicle hazards such as thermal runaway. These same benefits extend to energy storage systems, where reliable battery monitoring is critical to meeting the growing power demands of artificial intelligence data centers. As effective storage solutions become increasingly vital in the grid-to-gate ecosystem, EIS gives engineers real-time visibility into the state of charge and state of health of each battery cell, regardless of system size. Ankündigung • Jun 05
Texas Instruments Incorporated Announces Executive Changes, Effective August 1, 2026 Texas Instruments Incorporated (TI) announced that Julie Knecht has been named the company's next senior vice president, effective August 1, 2026. Knecht succeeds Rafael Lizardi, who will retire after 25 years with the company. Lizardi will provide continued support in an advisory role until August 31, 2026, to facilitate the transition. Knecht joined Texas Instruments in 1999 and has held a number of finance and accounting roles, most recently serving as chief accounting officer and vice president of accounting and tax since 2021. Prior to that, she was vice president of accounting for more than 10 years. Knecht has a bachelor's degree in accounting from Texas A&M University, a Master of Business Administration from the University of Texas at Austin and is a licensed certified public accountant. Ankündigung • Jun 04
Texas Instruments Incorporated Announces CFO Changes, Effective August 1, 2026 Texas Instruments Incorporated had announced that Julie Knecht had been named the company's next chief financial officer, effective August 1, 2026. Knecht succeeded Rafael Lizardi, who would retire after 25 years with the company. Lizardi would provide continued support in an advisory role until August 31, 2026, to facilitate the transition. Knecht joined Texas Instruments in 1999 and had held a number of finance and accounting roles, most recently serving as chief accounting officer and vice president of accounting and tax since 2021. Prior to that, she was vice president of accounting for more than 10 years. Knecht had a bachelor's degree in accounting from Texas A&M University, a Master of Business Administration from the University of Texas at Austin and was a licensed certified public accountant. Buy Or Sell Opportunity • Jun 03
Now 23% overvalued after recent price rise Over the last 90 days, the stock has risen 53% to CHF242. The fair value is estimated to be CHF197, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 2.5% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 11% per annum. Earnings are also forecast to grow by 16% per annum over the same time period. Recent Insider Transactions • May 31
Independent Director recently sold CHF2.5m worth of stock On the 28th of May, Martin Craighead sold around 10k shares on-market at roughly CHF251 per share. This transaction amounted to 41% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth CHF3.3m. Insiders have been net sellers, collectively disposing of CHF16m more than they bought in the last 12 months. Board Change • May 20
Insufficient new directors There is 1 new director who has joined the board in the last 3 years. The company's board is composed of: 1 new director. 3 experienced directors. 8 highly experienced directors. Independent Director Reginald DesRoches was the last director to join the board, commencing their role in 2024. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Ankündigung • Apr 17
Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026. Ankündigung • Mar 23
Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield Technology Texas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V). Ankündigung • Mar 17
Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIA Texas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design. Ankündigung • Mar 10
Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence Capabilities Texas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available. Ankündigung • Mar 05
Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026 Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States Recent Insider Transactions • Feb 13
Insider recently sold CHF1.7m worth of stock On the 10th of February, Mark Gary sold around 10k shares on-market at roughly CHF169 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of CHF4.2m more than they bought in the last 12 months. Reported Earnings • Feb 10
Full year 2025 earnings released: EPS: US$5.47 (vs US$5.24 in FY 2024) Full year 2025 results: EPS: US$5.47 (up from US$5.24 in FY 2024). Revenue: US$17.7b (up 13% from FY 2024). Net income: US$4.97b (up 4.1% from FY 2024). Profit margin: 28% (down from 31% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 9.6% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe. Ankündigung • Jan 29
Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026 Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48. Ankündigung • Jan 16
Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026. Ankündigung • Jan 05
Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous Vehicles Texas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models. 
