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Consensus Narrative from 10 Analysts
AI Packaging Demand And New Metrology Tools Will Drive Future Semiconductor Advancements
Key Takeaways Strong growth in AI packaging and panel markets, along with new product launches, is expected to significantly boost revenue streams in the coming years. Increased adoption of metrology tools in advanced packaging processes indicates potential for sustained revenue growth as these tools become more integrated in industry practices.
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US$235.02
FV
48.8% undervalued
intrinsic discount
10.09%
Revenue growth p.a.
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ONTO
ONTO
Onto Innovation
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US$
Current Price
US$120.40
8.7% undervalued
intrinsic discount
Growth estimate over
Annual revenue growth rate
5 Years
time period
%/yr
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-5m
2b
2015
2018
2021
2024
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2030
Revenue US$1.7b
Earnings US$337.4m
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