Canlı Haberler • Jun 22
Texas Instruments Unveils Battery Monitor With Advanced Diagnostics for EVs and Energy Storage Texas Instruments launched a high cell count battery monitor with integrated advanced diagnostics aimed at electric vehicles and energy storage systems, adding predictive intelligence and real-time cell diagnostics for safety, efficiency and scalability in next generation designs.
The product targets energy management needs in automotive and data center markets linked to AI workloads and sustainability goals, which could help Texas Instruments tap demand in EV platforms and large-scale energy storage tied to those applications.
Texas Instruments shares trade at about $322.86, with the stock up 81.9% year to date, reflecting strong recent momentum in investor interest.
This battery monitor extends Texas Instruments’ reach into EV powertrains and energy storage infrastructure, areas where reliability and accurate diagnostics are critical, so execution and design wins with major automakers and data center customers will be important to watch. Canlı Haberler • Jun 13
Texas Instruments Gains Analyst Upgrades With Silicon Labs Deal and New EV Battery Monitor Texas Instruments is seeing broad analyst support after strong Q1 2026 results, with multiple banks lifting price targets into a US$278 to US$370 range and citing AI, industrial and automotive demand, and U.S. capacity expansion as key drivers of optimism.
The company announced a planned US$7.6b acquisition of Silicon Labs, targeted to close in the first half of 2027, to strengthen its embedded processing portfolio.
TI introduced the BQ79826Z-Q1, a high-cell-count EV and energy storage battery monitor with integrated EIS diagnostics, while continuing a multiyear buildout of 300mm analog manufacturing capacity in the U.S.
The mix of earnings beats, product launches in EV and energy storage, and capacity investments positions TI squarely in areas where many analysts see structurally higher demand tied to AI, data centers, and electrification.
At the same time, the pending Silicon Labs deal and large capital program add execution and integration risk, so you may want to watch how TI manages margins, free cash flow, and balance sheet strength as these initiatives progress. Duyuru • Jun 09
Texas Instruments Introduces BQ79826Z-Q1 Battery Monitor With Integrated EIS Engine Texas Instruments introduced the industry's highest-cell-count battery monitor with an integrated electrochemical impedance spectroscopy engine, bringing predictive intelligence, comprehensive data and real-time diagnostics to battery monitoring in electric vehicles and energy storage system applications. The BQ79826Z-Q1 battery monitor enhances safety and extends battery life by detecting potential failures from within battery cells. The single chip delivers the highest-cell-count monitoring in its class, tracking up to 44% more channels than previous generations. With this increase in channels, the device significantly decreases the number of components required in a battery pack, reducing system complexity and cost without compromising reliability. The BQ79826Z-Q1 supports up to 26 cells per device, eight more than any competing solution, setting a new industry standard. Fewer monitoring devices means a lower bill of materials, simplified architecture and reduced board space requirements, translating to meaningful cost savings per channel without sacrificing quality or reliability. When paired with the BQ79881-Q1 pack monitor and optional Texas Instruments communications bridge, these devices create a powerful chipset that works across different module sizes, battery chemistries and mechanical designs, giving engineers the flexibility to design once and deploy everywhere. Integrated EIS technology enables the BQ78926Z-Q1 to detect fault conditions earlier – from inside the cells – helping maintain safety and notifying passengers of potential vehicle hazards such as thermal runaway. These same benefits extend to energy storage systems, where reliable battery monitoring is critical to meeting the growing power demands of artificial intelligence data centers. As effective storage solutions become increasingly vital in the grid-to-gate ecosystem, EIS gives engineers real-time visibility into the state of charge and state of health of each battery cell, regardless of system size. Canlı Haberler • Jun 05
Texas Instruments Raises Outlook on AI Data Center Growth and Silicon Labs Acquisition Plans Texas Instruments reported Q1 2026 revenue of about US$4.8b, supported by strong AI data center demand and broad industrial strength, and guided Q2 revenue to US$5.0b to US$5.4b with EPS of US$1.77 to US$2.05.
The company agreed to acquire Silicon Labs for roughly US$7.5b to US$7.6b to expand its embedded wireless and connectivity portfolio, with closing targeted in the first half of 2027.
Shares have seen sharp swings as strong results and multiple analyst upgrades contrast with around US$88.9m of recent insider stock sales and concerns that the stock trades well above some intrinsic value estimates.
The core story is that investors are weighing TI’s AI and industrial momentum, improving free cash flow and ongoing US manufacturing build-out against valuation questions, margin sensitivity from capacity expansion and the added execution risk of the Silicon Labs deal.
Short-term trading could remain volatile, especially around the May 28 conference and the July 22 Q2 release, so you may want to be clear about your time horizon and comfort with price swings even if you like the long-term semiconductor and AI data center themes tied to TI. Duyuru • Jun 05
Texas Instruments Incorporated Announces Executive Changes, Effective August 1, 2026 Texas Instruments Incorporated (TI) announced that Julie Knecht has been named the company's next senior vice president, effective August 1, 2026. Knecht succeeds Rafael Lizardi, who will retire after 25 years with the company. Lizardi will provide continued support in an advisory role until August 31, 2026, to facilitate the transition. Knecht joined Texas Instruments in 1999 and has held a number of finance and accounting roles, most recently serving as chief accounting officer and vice president of accounting and tax since 2021. Prior to that, she was vice president of accounting for more than 10 years. Knecht has a bachelor's degree in accounting from Texas A&M University, a Master of Business Administration from the University of Texas at Austin and is a licensed certified public accountant. Duyuru • Jun 04
Texas Instruments Incorporated Announces CFO Changes, Effective August 1, 2026 Texas Instruments Incorporated had announced that Julie Knecht had been named the company's next chief financial officer, effective August 1, 2026. Knecht succeeded Rafael Lizardi, who would retire after 25 years with the company. Lizardi would provide continued support in an advisory role until August 31, 2026, to facilitate the transition. Knecht joined Texas Instruments in 1999 and had held a number of finance and accounting roles, most recently serving as chief accounting officer and vice president of accounting and tax since 2021. Prior to that, she was vice president of accounting for more than 10 years. Knecht had a bachelor's degree in accounting from Texas A&M University, a Master of Business Administration from the University of Texas at Austin and was a licensed certified public accountant. Recent Insider Transactions • May 31
Independent Director recently sold US$3.2m worth of stock On the 28th of May, Martin Craighead sold around 10k shares on-market at roughly US$320 per share. This transaction amounted to 41% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth US$4.2m. Insiders have been net sellers, collectively disposing of US$20m more than they bought in the last 12 months. Recent Insider Transactions Derivative • May 29
Independent Director notifies of intention to sell stock Martin Craighead intends to sell 10k shares in the next 90 days after lodging an Intent To Sell Form on the 28th of May. If the sale is conducted around the recent share price of US$320, it would amount to US$3.2m. Since December 2025, Martin's direct individual holding has increased from 21.39k shares to 21.96k. Company insiders have collectively sold US$64m more than they bought, via options and on-market transactions in the last 12 months. Recent Insider Transactions Derivative • May 14
Independent Director notifies of intention to sell stock Carrie Cox intends to sell 9k shares in the next 90 days after lodging an Intent To Sell Form on the 13th of May. If the sale is conducted around the recent share price of US$306, it would amount to US$2.7m. Since December 2025, Carrie has owned 3.14k shares directly. Company insiders have collectively sold US$55m more than they bought, via options and on-market transactions in the last 12 months. Recent Insider Transactions • May 13
Insider recently sold US$1.5m worth of stock On the 11th of May, Shanon Leonard sold around 5k shares on-market at roughly US$295 per share. This transaction amounted to 17% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth US$4.2m. Insiders have been net sellers, collectively disposing of US$17m more than they bought in the last 12 months. Board Change • May 01
Insufficient new directors There is 1 new director who has joined the board in the last 3 years. The company's board is composed of: 1 new director. 3 experienced directors. 8 highly experienced directors. Independent Director Reginald DesRoches was the last director to join the board, commencing their role in 2024. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Recent Insider Transactions • Apr 29
Independent Director recently sold US$4.2m worth of stock On the 24th of April, Mark Blinn sold around 15k shares on-market at roughly US$278 per share. This transaction amounted to 100% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of US$11m more than they bought in the last 12 months. Recent Insider Transactions Derivative • Apr 26
Senior VP & CFO notifies of intention to sell stock Rafael Lizardi intends to sell 41k shares in the next 90 days after lodging an Intent To Sell Form on the 24th of April. If the sale is conducted around the recent share price of US$274, it would amount to US$11m. Since December 2025, Rafael's direct individual holding has increased from 65.90k shares to 119.45k. Company insiders have collectively sold US$17m more than they bought, via options and on-market transactions in the last 12 months. Price Target Changed • Apr 23
Price target increased by 19% to US$266 Up from US$223, the current price target is an average from 32 analysts. New target price is 5.7% below last closing price of US$282. Stock is up 74% over the past year. The company is forecast to post earnings per share of US$7.71 for next year compared to US$5.47 last year. Reported Earnings • Apr 23
First quarter 2026 earnings: EPS and revenues exceed analyst expectations First quarter 2026 results: EPS: US$1.70 (up from US$1.29 in 1Q 2025). Revenue: US$4.83b (up 19% from 1Q 2025). Net income: US$1.55b (up 32% from 1Q 2025). Profit margin: 32% (up from 29% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue exceeded analyst estimates by 6.6%. Earnings per share (EPS) also surpassed analyst estimates by 23%. Revenue is forecast to grow 10% p.a. on average during the next 3 years, compared to a 21% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has fallen by 17% per year but the company’s share price has increased by 20% per year, which means it is well ahead of earnings. Declared Dividend • Apr 20
Fourth quarter dividend of US$1.42 announced Shareholders will receive a dividend of US$1.42. Ex-date: 5th May 2026 Payment date: 19th May 2026 Dividend yield will be 2.4%, which is higher than the industry average of 0.8%. Sustainability & Growth Dividend is not covered by earnings (101% earnings payout ratio) nor is it covered by cash flows (199% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 12% to bring the payout ratio under control. EPS is expected to grow by 50% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Duyuru • Apr 17
Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026. Buy Or Sell Opportunity • Mar 25
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 11% to US$197. The fair value is estimated to be US$164, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 5.7% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.3% per annum. Earnings are also forecast to grow by 14% per annum over the same time period. Duyuru • Mar 23
Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield Technology Texas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V). Duyuru • Mar 17
Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIA Texas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design. Duyuru • Mar 10
Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence Capabilities Texas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available. Buy Or Sell Opportunity • Mar 09
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 9.3% to US$196. The fair value is estimated to be US$163, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 5.7% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.3% per annum. Earnings are also forecast to grow by 14% per annum over the same time period. Duyuru • Mar 05
Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026 Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States Recent Insider Transactions • Feb 13
Insider recently sold US$2.3m worth of stock On the 10th of February, Mark Gary sold around 10k shares on-market at roughly US$221 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of US$5.4m more than they bought in the last 12 months. Duyuru • Jan 29
Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026 Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48. Reported Earnings • Jan 28
Full year 2025 earnings: Revenues and EPS in line with analyst expectations Full year 2025 results: EPS: US$5.50 (up from US$5.24 in FY 2024). Revenue: US$17.7b (up 13% from FY 2024). Net income: US$5.00b (up 4.7% from FY 2024). Profit margin: 28% (down from 31% in FY 2024). The decrease in margin was driven by higher expenses. Revenue was in line with analyst estimates. Earnings per share (EPS) were also in line with analyst expectations. Revenue is forecast to grow 8.8% p.a. on average during the next 3 years, compared to a 21% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has fallen by 22% per year but the company’s share price has increased by 6% per year, which means it is well ahead of earnings. Buy Or Sell Opportunity • Jan 28
Now 27% overvalued after recent price rise Over the last 90 days, the stock has risen 35% to US$216. The fair value is estimated to be US$170, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 5.7% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 8.8% per annum. Earnings are also forecast to grow by 14% per annum over the same time period. Declared Dividend • Jan 20
Third quarter dividend of US$1.42 announced Shareholders will receive a dividend of US$1.42. Ex-date: 30th January 2026 Payment date: 10th February 2026 Dividend yield will be 2.9%, which is higher than the industry average of 0.8%. Sustainability & Growth Dividend is not adequately covered by earnings (99% earnings payout ratio) nor is it covered by cash flows (248% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 9.6% to bring the payout ratio under control. EPS is expected to grow by 46% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Duyuru • Jan 16
Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026. Duyuru • Jan 05
Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous Vehicles Texas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models. Recent Insider Transactions Derivative • Nov 25
Independent Director notifies of intention to sell stock Ronald Kirk intends to sell 10k shares in the next 90 days after lodging an Intent To Sell Form on the 24th of November. If the sale is conducted around the recent share price of US$162, it would amount to US$1.6m. Since December 2024, Ronald's direct individual holding has decreased from 11.90k shares to 8.01k. Company insiders have collectively sold US$74m more than they bought, via options and on-market transactions in the last 12 months. Recent Insider Transactions Derivative • Nov 21
Insider exercised options and sold US$111k worth of stock On the 13th of November, Christine Witzsche exercised 1k options at a strike price of around US$52.93 and sold these shares for an average price of US$164 per share. This trade did not impact their existing holding. Since March 2025, Christine's direct individual holding has decreased from 22.22k shares to 20.82k. Company insiders have collectively sold US$75m more than they bought, via options and on-market transactions in the last 12 months. Reported Earnings • Oct 22
Third quarter 2025 earnings: EPS in line with analyst expectations despite revenue beat Third quarter 2025 results: EPS: US$1.50 (up from US$1.48 in 3Q 2024). Revenue: US$4.74b (up 14% from 3Q 2024). Net income: US$1.36b (flat on 3Q 2024). Profit margin: 29% (down from 33% in 3Q 2024). The decrease in margin was driven by higher expenses. Revenue exceeded analyst estimates by 2.2%. Earnings per share (EPS) were mostly in line with analyst estimates. Revenue is forecast to grow 8.3% p.a. on average during the next 3 years, compared to a 18% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has fallen by 24% per year but the company’s share price has increased by 3% per year, which means it is well ahead of earnings. Duyuru • Oct 22
Texas Instruments Incorporated Provides Earnings Guidance for the Fourth Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the fourth quarter of 2025. For the quarter, the company expects revenue in the range of $4.22 billion to $4.58 billion and earnings per share between $1.13 and $1.39. Buy Or Sell Opportunity • Oct 20
Now 21% overvalued Over the last 90 days, the stock has fallen 16% to US$180. The fair value is estimated to be US$149, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 9.1% over the last 3 years. Earnings per share has declined by 24%. For the next 3 years, revenue is forecast to grow by 9.1% per annum. Earnings are also forecast to grow by 12% per annum over the same time period. Duyuru • Oct 17
Texas Instruments Incorporated Announces Board Changes On October 16, 2025, Richard K. Templeton notified the Board of Directors of Texas Instruments Incorporated that he will retire as executive chairman and as a member of the Board on December 31, 2025. The Board has appointed Haviv Ilan, the Company’s president and chief executive officer, as the Company’s new chairman, effective on Mr. Templeton’s retirement. Beginning January 2026. Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company. Ilan has been a member of the board of directors since 2021 and TI’s president and CEO since 2023. Prior to that, he was chief operating officer and held senior leadership positions across TI’s analog and embedded processing businesses during his 26-year career at the company. Duyuru • Oct 15
Renesas Reportedly Explores Sale of Timing Unit Renesas Electronics Corporation (TSE:6723) is working with bankers at JPMorgan to explore the potential sale of its timing division in a deal that could value the business at close to $2 billion, Reuters' Milana Vinn reported. According to people familiar with the matter, Texas Instruments Incorporated (NasdaqGS:TXN) and Infineon Technologies AG (XTRA:IFX) are among the potential buyers of the unit. Declared Dividend • Sep 22
Second quarter dividend increased to US$1.42 Dividend of US$1.42 is 4.4% higher than last year. Ex-date: 31st October 2025 Payment date: 12th November 2025 Dividend yield will be 3.1%, which is higher than the industry average of 0.8%. Sustainability & Growth Dividend is not adequately covered by earnings (98% earnings payout ratio) nor is it covered by cash flows (329% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 8.6% to bring the payout ratio under control. EPS is expected to grow by 45% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Duyuru • Sep 19
Texas Instruments Incorporated Raises Quarterly Cash Dividend, Payable on November 12, 2025 Texas Instruments Incorporated (TI) announced it will raise its quarterly cash dividend 4%, from $1.36 per share to $1.42, or $5.68 annualized. The higher dividend will be payable November 12, 2025, to stockholders of record on October 31, 2025, contingent upon formal declaration by the board of directors at its regular meeting in October. Reported Earnings • Jul 23
Second quarter 2025 earnings: EPS and revenues exceed analyst expectations Second quarter 2025 results: EPS: US$1.43 (up from US$1.23 in 2Q 2024). Revenue: US$4.45b (up 16% from 2Q 2024). Net income: US$1.30b (up 16% from 2Q 2024). Profit margin: 29% (in line with 2Q 2024). Revenue exceeded analyst estimates by 3.1%. Earnings per share (EPS) also surpassed analyst estimates by 5.8%. Revenue is forecast to grow 9.0% p.a. on average during the next 3 years, compared to a 16% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has fallen by 24% per year but the company’s share price has increased by 3% per year, which means it is well ahead of earnings. Duyuru • Jul 23
Texas Instruments Incorporated Provides Earnings Guidance for the Third Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the third quarter of 2025. For the quarter company expects revenue in the range of $4.45 billion to $4.80 billion and earnings per share between $1.36 and $1.60. Declared Dividend • Jul 21
First quarter dividend of US$1.36 announced Shareholders will receive a dividend of US$1.36. Ex-date: 31st July 2025 Payment date: 12th August 2025 Dividend yield will be 2.5%, which is higher than the industry average of 0.8%. Sustainability & Growth Dividend is not covered by earnings (100% earnings payout ratio) nor is it covered by cash flows (340% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 11% to bring the payout ratio under control. EPS is expected to grow by 44% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Duyuru • Jul 18
Texas Instruments Incorporated Declares Cash Dividend for the Third Quarter of 2025, Payable on August 12, 2025 Texas Instruments Incorporated's board of directors declared a quarterly cash dividend of $1.36 per share of common stock for the third quarter of 2025, payable August 12, 2025, to stockholders of record on July 31, 2025. Duyuru • Jun 28
Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index Buy Or Sell Opportunity • May 27
Now 23% overvalued Over the last 90 days, the stock has fallen 7.6% to US$183. The fair value is estimated to be US$149, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 9.0% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.3% per annum. Earnings are also forecast to grow by 13% per annum over the same time period. Buy Or Sell Opportunity • May 12
Now 24% overvalued after recent price rise Over the last 90 days, the stock has risen 4.5% to US$187. The fair value is estimated to be US$151, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 9.0% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.4% per annum. Earnings are also forecast to grow by 13% per annum over the same time period. Reported Earnings • Apr 24
First quarter 2025 earnings: EPS and revenues exceed analyst expectations First quarter 2025 results: EPS: US$1.30 (up from US$1.21 in 1Q 2024). Revenue: US$4.07b (up 11% from 1Q 2024). Net income: US$1.18b (up 7.2% from 1Q 2024). Profit margin: 29% (down from 30% in 1Q 2024). The decrease in margin was driven by higher expenses. Revenue exceeded analyst estimates by 4.0%. Earnings per share (EPS) also surpassed analyst estimates by 20%. Revenue is forecast to grow 9.7% p.a. on average during the next 3 years, compared to a 16% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has fallen by 22% per year but the company’s share price has only fallen by 3% per year, which means it has not declined as severely as earnings. Duyuru • Apr 24
Texas Instruments Incorporated Provides Earnings Guidance for the Second Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the second quarter of 2025. The company’s second quarter outlook is for revenue in the range of $4.17 billion to $4.53 billion and earnings per share between $1.21 and $1.47. Declared Dividend • Apr 23
Fourth quarter dividend of US$1.36 announced Shareholders will receive a dividend of US$1.36. Ex-date: 30th April 2025 Payment date: 13th May 2025 Dividend yield will be 3.5%, which is higher than the industry average of 0.8%. Sustainability & Growth Dividend is not covered by earnings (100% earnings payout ratio) nor is it covered by cash flows (330% cash payout ratio). The dividend has increased by an average of 16% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 12% to bring the payout ratio under control. EPS is expected to grow by 44% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Duyuru • Apr 18
Texas Instruments Board Declares Second Quarter 2025 Dividend, Payable on May 13, 2025 The board of directors of Texas Instruments Incorporated declared a Second Quarter 2025 cash dividend of $1.36 per share of common stock, payable May 13, 2025, to stockholders of record on April 30, 2025. Duyuru • Apr 15
Texas Instruments Introduces New Portfolio of Automotive Lidar, Time and Radar Chips Texas Instruments introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities. Real-time decision-making with 30% longer distance measurements. A crucial technology for the future of safe autonomous vehicles, lidar provides a detailed 3D map of the driver's surroundings. This integration also supports an average 30% reduction in system costs while reducing solution size by four times, empowering design engineers to discretely mount compact, affordable lidar modules in more areas and across more vehicle models As lidar technology reaches higher output currents, vast variations in pulse duration over temperature make it challenging to meet eye safety standards. TI's LMH13000 laser driver provides up to 5A of adjustable output current with only 2% variation across its -40C to 125C ambient temperature range, compared to discrete solutions that can have up to 30% variation. The device's short pulse-width generation and current control enable the system to meet Class 1 U.S. Food and Drug Administration eye safety standards. Electronics in ADAS and in-vehicle infotainment systems must work reliably while facing temperature fluctuations, fluctuations and electromagnetic interference. With TI's BAW technology benefits, the new CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators increase reliability by 100 times compared to traditional quartz-based clocks, with a failure-in-time rate of 0.3. Enhanced clocking precision and resilience in harsh conditions enable safer operation, cleaner data communication, and higher-speed data processing across next-generation vehicle subsystems. Additionally, the company unveiled a new front and corner radar sensor, the AWR2944P, building on TI's widely adopted AWR2944 platform. The new radar sensor's enhancements improve vehicle safety by extending detection range, improving angular accuracy, and enabling more sophisticated processing algorithms. Key enhancements include: An improved signal-to-noise ratio. A larger memory capacity. An integrated radar hardware accelerator that allows the microcontroller and digital signal processor to execute machine learning for edge artificial intelligence applications. TI's new automotive lidar, clock and Radar solutions build on the company's commitment to helping engineers design adaptable ADAS for a safer, more automated driving experience. Package, availability and pricing. Pre production quantities of the LMH13000, CDC6C-Q1, CDC6C-Q 1, LMK3H0102 -Q1, LMK3H0105-Q1 and LMK 3C0105-Q1. Buy Or Sell Opportunity • Apr 09
Now 31% overvalued Over the last 90 days, the stock has fallen 12% to US$170. The fair value is estimated to be US$129, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 7.7% over the last 3 years. Earnings per share has declined by 19%. For the next 3 years, revenue is forecast to grow by 10.0% per annum. Earnings are also forecast to grow by 12% per annum over the same time period. Valuation Update With 7 Day Price Move • Apr 08
Investor sentiment deteriorates as stock falls 18% After last week's 18% share price decline to US$146, the stock trades at a forward P/E ratio of 27x. Average forward P/E is 16x in the Semiconductor industry in the US. Total loss to shareholders of 7.9% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$130 per share. Duyuru • Mar 18
Texas Instruments Debuts New Power- Management Chips to Support the Rapidly Growing Power Needs of Data Centers Texas Instruments debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI's new TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the LMG3650R035, LMG3650R025 and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia. The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>98%) and high-power density (>100W/in3). They also integrate advanced protection features including over-current protection, short-circuit protection and over-temperature protection. This is especially important for AC/DC applications like server power, where designers are challenged to push more power into smaller spaces. At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including: Dell's 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell's first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency. Vertiv's 5.5kW server PSU: Part of Vertiv's PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack. Greatwall's 8kWPS: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rackPSU using TI GaN technology and TI C2000 real-time microcontrollers. Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at tuck-in. Package, availability and pricing. Preproduction quantities of the TPS1685, LMG3650R035), LMG3650R070 and LMG3650R025 are available for purchase now on TI.com. Multiple payment and shipping options are available. Evaluation modules are available. Evaluation modules are used to be available for the first and available for purchase now on TI". Duyuru • Mar 12
Texas Instruments Introduces Small MCU, Expanding its Comprehensive Arm Cortex-M0+ MSPM0 MCU Portfolio Texas Instruments (TI) introduced the small MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance. With over 100 cost-effective MCUs, TI's MSPM0 MCU portfolio offers scalable configurations of on-chip analog peripherals and a range of computing options to enhance the sensing and control capabilities of embedded designs. TI will display these devices at embedded world 2025, March 11, 2025 – March 13, 2025, in Nuremberg, Germany. The MSPM0C1104 MCU leverages the advantages of WCSP packaging technology, along with intentional feature selection and TI's cost optimization efforts. The size of the eight-ball WCSP is 1.38mm, making it 38% smaller than competing devices. The MCU features 16KB of memory; a 12-bit analog-to-digital converter with three channels; six general-purpose input/output pins; and compatibility with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (IC). Integrating accurate, high-speed analog components into the world's smallest MCU gives engineers the flexibility to maintain the computing performance of their embedded systems without increasing board size. The new MSPM0C1104 joins TI's MSPM0 MCU portfolio, which offers scalability, cost optimization and ease of use to accelerate time to market. TI's MSPM0 MCUs feature pin-to-pin compatible package options and feature sets to match memory, analog and computing requirements in personal electronics, industrial and automotive applications. Starting at USD 0.16 in 1,000-unit quantities, the portfolio includes other small packages to help reduce board size and bill of materials. This optimization and feature integration across the portfolio help engineers design products of any size while reducing cost and complexity in their systems. For further support, TI's comprehensive ecosystem includes an optimized software development kit for all MSPM0 MCUs; a hardware development kit for rapid prototyping; reference designs; and subsystems, which are code examples for common MCU functions. TI's Zero Code Studio tool enables users to configure, develop and run MCU applications in minutes without coding. Engineers can take advantage of this ecosystem to scale designs and reuse code without the need for significant hardware or software modifications. In addition to this ecosystem, TI's MSPM0 MCU portfolio is supported by TI's growing investments in its internal manufacturing capacity to support future demand. At embedded world 2025, TI will demonstrate how its technologies enable engineers to reimagine embedded systems, helping create a more intelligent and connected world. TI's exhibit in Hall 3A, Booth No. 131 will include advancements in real-time monitoring and perception with edge artificial intelligence, connectivity for the Internet of Things, and development with open-source software. Package, availability and pricing: Preproduction quantities of the MSPM0C1104 MCU are available at TI.com. Pricing of the WCSP device is USD 0.20 in 1,000-unit quantities. Multiple payment and shipping options are available. The MSPM0C1104 LaunchPad development kit is available for USD 5.99 on TI.com. Duyuru • Mar 07
Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025 Texas Instruments Incorporated, Annual General Meeting, Apr 17, 2025. Location: 12500 ti boulevard, texas, dallas United States Buy Or Sell Opportunity • Jan 30
Now 21% overvalued Over the last 90 days, the stock has fallen 9.6% to US$185. The fair value is estimated to be US$153, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 7.7% over the last 3 years. Earnings per share has declined by 18%. For the next 3 years, revenue is forecast to grow by 9.9% per annum. Earnings are also forecast to grow by 12% per annum over the same time period. Reported Earnings • Jan 24
Full year 2024 earnings: EPS exceeds analyst expectations Full year 2024 results: EPS: US$5.26 (down from US$7.13 in FY 2023). Revenue: US$15.6b (down 11% from FY 2023). Net income: US$4.80b (down 26% from FY 2023). Profit margin: 31% (down from 37% in FY 2023). The decrease in margin was driven by lower revenue. Revenue was in line with analyst estimates. Earnings per share (EPS) surpassed analyst estimates by 2.1%. Revenue is forecast to grow 9.7% p.a. on average during the next 3 years, compared to a 20% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has fallen by 18% per year but the company’s share price has increased by 2% per year, which means it is well ahead of earnings. Duyuru • Jan 24
Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter 2025 Texas Instruments Incorporated provided earnings guidance for the first quarter 2025. The company's first quarter outlook is for revenue in the range of $3.74 billion to $4.06 billion and earnings per share between $0.94 and $1.16. Declared Dividend • Jan 21
Third quarter dividend of US$1.36 announced Shareholders will receive a dividend of US$1.36. Ex-date: 31st January 2025 Payment date: 11th February 2025 Dividend yield will be 2.8%, which is higher than the industry average of 0.8%. Sustainability & Growth Dividend is not adequately covered by earnings (96% earnings payout ratio) nor is it covered by cash flows (338% cash payout ratio). The dividend has increased by an average of 16% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 6.5% to bring the payout ratio under control. EPS is expected to grow by 51% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Duyuru • Jan 17
Texas Instruments Incorporated Declares First Quarter 2025 Dividend, Payable on February 11, 2025 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.36 per share of common stock, payable February 11, 2025, to stockholders of record on January 31, 2025. 
