Tillkännagivande • Apr 23
Parade Technologies, Ltd. (TPEX:4966) completed the acquisition of Substantially All Assets of Spectra7 Microsystems Inc. (TSXV:SEV). Parade Technologies, Ltd. (TPEX:4966) entered into a definitive agreement to acquire Substantially All Assets of Spectra7 Microsystems Inc. (TSXV:SEV) for $9 million on March 7, 2025. The purchase price for the assets is $9 million in cash. On closing of the transaction, Parade shall make a cash payment to Spectra7 equal to the purchase price, less: (i) the Bridge Loans, and (ii) $1,800,000. The Escrow Amount shall be deposited into escrow with a third-party escrow agent to cover certain potential indemnity claims by Parade until the date that is one year after the closing of the transaction. Parade has agreed to advance a loan to Spectra7 in the amount of $450,000, with an additional loan in the amount of $300,000 to be advanced on or about March 21, 2025 (collectively, the "Bridge Loans"), in order to assist Spectra7 to maintain its operations and carry on its business until Closing. A termination fee of $2,500,000 is payable by Spectra7 to Parade in case of termination of the transaction under certain circumstances. As part of the acquisition, a significant number of Spectra7's employees will join Parade, ensuring continuity of technical expertise and customer support. It is the intention of Spectra7 to distribute all of the net proceeds received from the Sale Transaction to its shareholders in two special distributions.
The transaction is subject to various conditions, including the approval of the TSXV and approval of at least 66 2/3% of the votes cast by Spectra7 Shareholders at the Meeting pursuant to the Business Corporations Act (Ontario). The members of the Spectra7 Board, after consultation with management and legal and financial advisors, have approved the Sale Transaction. The transaction is expected to close in the second quarter of 2025. As of April 15, 2025, the transaction is expected to close in the week following the meeting scheduled on April 17, 2025. As of April 17, 2025, Spectra7 Microsystems shareholders approved the transaction. Craig-Hallum Capital Group LLC and The Benchmark Company LLC acted as financial advisors to Spectra7 in connection with the transaction, and are together entitled to a transaction fee equal to $1,000,000 on Closing. Richard Kimel of Aird & Berlis LLP acted as legal advisor for Spectra7 Microsystems Inc. John Park of Morgan, Lewis & Bockius LLP acted as legal advisor for Parade Technologies, Ltd.
Parade Technologies, Ltd. (TPEX:4966) completed the acquisition of Substantially All Assets of Spectra7 Microsystems Inc. (TSXV:SEV) on April 22, 2025. Tillkännagivande • Apr 17
Spectra7 Microsystems Inc. Announces Special Cash Distribution Spectra7 Microsystems Inc. announced that the cash portion of the Special Distribution is estimated to be approximately USD 1,070,000 (approximately CAD 1,537,590), or approximately USD 0.0039 per share based on the share information below, and is expected to be made within two weeks after Closing. The reduction of the cash portion of the Special Distribution compared to prior disclosure by the Company is as a result of updated employee compensation obligations and governance, maintenance and wind-down costs amongst the Company's international operations. Assuming the Escrow Amount is released in full, the distribution to CVR holders is estimated to be USD 1,800,000 (approximately CAD 2,586,600) or approximately USD0.0065 per share, and is expected to be made shortly following the Escrow Release Date. The total Special Distribution, including the estimated payment to CVR holders, to the Spectra7 Shareholders is expected to be approximately USD 2,870,000 (approximately CAD 4,124,190) or approximately USD 0.0104 per share. Reported Earnings • Apr 16
Full year 2024 earnings released: US$0.10 loss per share (vs US$0.21 loss in FY 2023) Full year 2024 results: US$0.10 loss per share. Revenue: US$2.31m (down 77% from FY 2023). Net loss: US$10.7m (loss widened 31% from FY 2023). Tillkännagivande • Mar 05
Spectra7 Microsystems Inc., Annual General Meeting, Apr 14, 2025 Spectra7 Microsystems Inc., Annual General Meeting, Apr 14, 2025. New Risk • Jan 16
New major risk - Market cap size The company's market capitalization is less than US$10m. Market cap: CA$14.2m (US$9.91m) This is considered a major risk. Companies with a small market capitalization are most likely businesses that have not yet released a product to market or are simply a very small company without a wide reach. Either way, risk is elevated with these companies because there is a chance the product may not come to fruition or the company's addressable market or demand may not be as large as expected. In addition, if the company's size is the main factor, it is less likely to have many investors and analysts following it and scrutinizing its performance and outlook. Currently, the following risks have been identified for the company: Major Risks Less than 1 year of cash runway based on free cash flow trend (-US$6.9m free cash flow). Share price has been highly volatile over the past 3 months (30% average weekly change). Earnings have declined by 5.5% per year over the past 5 years. Shareholders have been substantially diluted in the past year (252% increase in shares outstanding). Market cap is less than US$10m (CA$14.2m market cap, or US$9.91m). Minor Risk Revenue is less than US$5m (US$2.2m revenue). Tillkännagivande • Nov 20
Spectra7 and Keysight to Demonstrate Robust Performance Testing of 800Gbps Active Copper Interconnects at SC24 Spectra7 Microsystems Inc. and Keysight announced they will be demonstrating robust performance testing of 800Gbps Active Copper Interconnects (ACCs) at SC24, the International Conference for High Performance Computing, Networking, Storage and Analysis in Atlanta, GA from November 19th thru November 21, 2024. The demonstration will highlight Spectra7 silicon in 800G OSFP and QSFP-DD ACC interconnects operating with robust pre-FEC Bit Error Rates (BERs) with the Keysight AresONE-M 800GE Layer 1-3 Test System at 800Gbps speeds. SC24 is the premier High-Performance Computing and Networking conference attended by engineers from around the world. The Spectra7 and Keysight demonstration will be on exhibit in Spectra7's booth #1263. Spectra7's analog based GaugeChanger™ GC1122 chips designed for use in advanced ACCs and offer significant power, latency, and cost advantages versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies. Reported Earnings • Nov 12
Third quarter 2024 earnings released: US$0.017 loss per share (vs US$0.038 loss in 3Q 2023) Third quarter 2024 results: US$0.017 loss per share. Revenue: US$152.5k (down 95% from 3Q 2023). Net loss: US$2.48m (loss widened 65% from 3Q 2023). Tillkännagivande • Oct 18
Spectra7 and I-PEX to Demonstrate 800G Active Copper Internal Cables for Next Generation 25.6T Data Center Switches at OCP Spectra7 Microsystems Inc. announced that I-PEX Inc. will offer the CABLINE®-CA IIEQ PLUS 112G active copper cable (ACC) to hyperscalers and OEM/ODMs that will include Spectra7's 112G PAM4 GC1122 GaugeChangerTM chips. I-PEX will be demonstrating this new product at the OCP Global Summit to be held in the San Jose Convention Center, Calif., October 15-17, 2024. CABLINE®-CA IIEQ PLUS 112G is an active copper cable solution that supports four lanes of 112 Gbps PAM4 data. With a height of only 2.0 mm and a width of 30.95 mm, the compact design minimizes the required PCB footprint, and allows it to be mounted close to the ASIC, underneath the heat sink. Large, bulky cables in servers and switches can greatly impede airflow, which is crucial for cooling the equipment. The CABLINE®-CA IIEQ PLUS 112G can use cables as small as 46 AWG that perform as well as much larger 36 AWG. The improved airflow within the equipment leads to better heat dissipation and enhanced cooling. The thinner cables also offer the advantage of increased flexibility, which facilitates easier wiring inside the equipment. The demonstration at OCP will show that an I-PEX CABLINE® 46 AWG micro-coaxial ACC cable assembly with the GC1122 will perform as well as a much larger passive 36 AWG micro-coaxial cable assembly for an internal system interconnect. GaugeChangerTM is a unique analog redriver technology that allows copper to extend to much longer lengths without the cost and power penalty of optics or DSP- based retimed copper solutions. Typical power savings of 700% to 1000% are achieved compared to these competing technologies. It works equally well at 25 Gbps NRZ, 50 Gbps PAM4 and 100 Gbps PAM4, enabling new connector standards of 100, 200, 400, and 800 Gbps. I-PEX anticipates delivering cable sample to their customers for qualification in the first half of 2025. Reported Earnings • Aug 31
Second quarter 2024 earnings released: US$0.12 loss per share (vs US$0.032 loss in 2Q 2023) Second quarter 2024 results: US$0.12 loss per share (further deteriorated from US$0.032 loss in 2Q 2023). Revenue: US$862.5k (down 74% from 2Q 2023). Net loss: US$9.32m (loss widened US$8.04m from 2Q 2023). Over the last 3 years on average, earnings per share has increased by 15% per year but the company’s share price has fallen by 58% per year, which means it is significantly lagging earnings. Board Change • Aug 01
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 2 experienced directors. 2 highly experienced directors. Independent Director Chris Morgan was the last director to join the board, commencing their role in 2021. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Reported Earnings • Jun 04
First quarter 2024 earnings released: US$0.055 loss per share (vs US$0.031 loss in 1Q 2023) First quarter 2024 results: US$0.055 loss per share (further deteriorated from US$0.031 loss in 1Q 2023). Revenue: US$815.9k (down 74% from 1Q 2023). Net loss: US$2.24m (loss widened 106% from 1Q 2023). Over the last 3 years on average, earnings per share has increased by 31% per year but the company’s share price has fallen by 54% per year, which means it is significantly lagging earnings. New Risk • May 22
New major risk - Shareholder dilution The company's shareholders have been substantially diluted in the past year. Increase in shares outstanding: 272% This is considered a major risk. Shareholder dilution occurs when there is an increase in the number of shares on issue that is not proportionally distributed between all shareholders. Often due to the company raising equity capital or some options being converted into stock. All else being equal, if there are more shares outstanding then each existing share will be entitled to a lower proportion of the company's total earnings, thus reducing earnings per share (EPS). While dilution might not always result in lower EPS (like if the company is using the capital to fund an EPS accretive acquisition) in a lot cases it does, along with lower dividends per share and less voting power at shareholder meetings. Currently, the following risks have been identified for the company: Major Risks Share price has been highly volatile over the past 3 months (29% average weekly change). Negative equity (-US$1.8m). Shareholders have been substantially diluted in the past year (272% increase in shares outstanding). Minor Risk Market cap is less than US$100m (CA$18.5m market cap, or US$13.6m). Reported Earnings • May 01
Full year 2023 earnings released: US$0.21 loss per share (vs US$0.21 loss in FY 2022) Full year 2023 results: US$0.21 loss per share (further deteriorated from US$0.21 loss in FY 2022). Revenue: US$9.90m (down 12% from FY 2022). Net loss: US$8.18m (loss widened 16% from FY 2022). Over the last 3 years on average, earnings per share has increased by 43% per year but the company’s share price has fallen by 56% per year, which means it is significantly lagging earnings. New Risk • Apr 16
New major risk - Market cap size The company's market capitalization is less than US$10m. Market cap: CA$4.05m (US$2.93m) This is considered a major risk. Companies with a small market capitalization are most likely businesses that have not yet released a product to market or are simply a very small company without a wide reach. Either way, risk is elevated with these companies because there is a chance the product may not come to fruition or the company's addressable market or demand may not be as large as expected. In addition, if the company's size is the main factor, it is less likely to have many investors and analysts following it and scrutinizing its performance and outlook. Currently, the following risks have been identified for the company: Major Risks Share price has been highly volatile over the past 3 months (30% average weekly change). Market cap is less than US$10m (CA$4.05m market cap, or US$2.93m). Tillkännagivande • Mar 06
Spectra7 Microsystems Inc. announced a financing transaction Spectra7 Microsystems Inc announced a private placement to issue equity securities on March 5, 2024. The transaction includes participation from certain institutional investors, Board members and insiders. The transaction is expected to close in March 2024, and is subject to receipt of all necessary approvals, including the approval of the TSX Venture Exchange. New Risk • Feb 14
New major risk - Share price stability The company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of Canadian stocks, typically moving 19% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. Currently, the following risks have been identified for the company: Major Risks Less than 1 year of cash runway based on free cash flow trend (-US$4.3m free cash flow). Share price has been highly volatile over the past 3 months (19% average weekly change). Minor Risks Shareholders have been diluted in the past year (20% increase in shares outstanding). Market cap is less than US$100m (CA$27.9m market cap, or US$20.6m). Tillkännagivande • Feb 07
Spectra7 and Volex Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects Spectra7 Microsystems Inc. and Volex plc announced that they successfully demonstrated industry leading performance of 800G Active Copper Cables (ACCs) at this year's annual DesignCon Conference Exhibition held last week in Santa Clara, California. In the demonstration, Volex 800Gbps QSFP-DD ACCs with Spectra7's embedded GC1122 chips successfully interoperated with test equipment from several vendors to produce very robust low pre-FEC bit error rates (BERs) significantly below standard required BER. Spectra7's analog based GaugeChanger GC1122 chips are used in ACCs and offer significant cost, size, and energy consumption value versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies. Tillkännagivande • Feb 01
Spectra7 Microsystems Inc. and MultiLane Technologies Inc. to Demonstrate Robust Performance Testing of 800G Active Copper Interconnects At DesignCon 2024 Spectra7 Microsystems Inc. and MultiLane Technologies Inc. announced they will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from January 31-February 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications. The demo will highlight Spectra7's ACCs successfully interoperating with the ML4015E Digital Sampling Oscilloscope (DSO) Test System at 112G PAM4 signaling that is used for 800Gbps port speeds. The demo will highlight a 112G PAM4 Eye Diagram showing superior signal integrity. DesignCon is the premier high-speed interconnect and system design conference attended by engineers from around the world. The Spectra7 will be on exhibit in booth #1344. Spectra7's analog based GaugeChangerTM GC1122 chips are used in ACCs and offer significant cost, size, and energy consumption value versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies. Tillkännagivande • Jan 26
Spectra7 Microsystems Inc. and Keysight Achieves Robust Performance Testing of 800Gbps Active Copper Interconnects and Plan Demonstration at DesignCon 2024 Spectra7 Microsystems Inc. and Keysight announced they successfully achieved robust performance testing and will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications. In the testing, Spectra7's ACCs successfully interoperated with the Keysight AresONE-M 800GE QSFP-DD800 Layer 1-3 Test System at 800Gbps speeds. Link training produced a very robust low bit error rate (BER) of 3.3e-9 which demonstrates a wide margin over standard required BER. DesignCon is the premier high-speed interconnect and system design conference attended by engineers from around the world. The Spectra7 will be on exhibit in booth #1344. Spectra7's analog based GaugeChanger GC1122 chips are used in ACCs and offer significant cost, size, and energy consumption value versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies. Tillkännagivande • Jan 19
Spectra7 to Demonstrate Robust Performance of 800Gbps Active Copper Interconnects at DesignCon 2024 Spectra7 Microsystems Inc. announced that it will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with several leading equipment suppliers at this year's annual DesignCon Conference Exhibition being held in Santa Clara, California from Jan 31- Feb. 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications. DesignCon is the premier high speed interconnect and system design conference attended by engineers from around the world. Spectra7 will be exhibiting in booth #1344. Spectra7's analog based GaugeChangerTM GC1122 chips are used in Active Copper Cables (ACCs) and offer significant cost, size and energy consumption value vs. competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies. Tillkännagivande • Dec 28
Spectra7 Microsystems Inc. Provides Revenue Guidance for the Fourth Quarter and Full Year of 2023 Spectra7 Microsystems Inc. provided revenue guidance for the fourth quarter and full year of 2023 . For the fourth quarter of 2023, the company expects fourth quarter revenue to be approximately $0.1 million.Revenue for the full year 2023 is expected to be approximately $9.7 million. Tillkännagivande • Nov 21
Spectra7 Microsystems Inc. Announces Chief Financial Officer Changes Spectra7 Microsystems Inc. announced the appointment of David Mier as Interim Chief Financial Officer. The Company previously announced that its Chief Financial Officer, Bonnie Tomei, is taking a personal leave of absence effective December 1, 2023 due to a family medical matter. The leave is expected to be for approximately three months but may be adjusted as necessary. Mr. Mier has extensive experience with Spectra7's business, investor base and growth strategy having previously served as Spectra7's Chief Financial Officer for over three years prior to his retirement in 2021. He has more than 30 years of senior financial executive experience with both public and private companies, including his position with Yahoo! as Vice President Finance, Americas Controller and Vice President Finance, Americas at Sun Microsystems. Tillkännagivande • Nov 09
Bonnie Tomei, Chief Financial Officer of Spectra7 Microsystems Inc., Takes Personal Leave of Absence Effective December 1, 2023 Spectra7 Microsystems Inc. announced that its Chief Financial Officer, Bonnie Tomei, is taking a personal leave of absence effective December 1, 2023 due to a family medical matter. The leave is expected to be for approximately three months but may be adjusted as necessary. Spectra7 expects to hire an interim CFO and does not anticipate any interruption to its ongoing business plans or outlook. Reported Earnings • Nov 09
Third quarter 2023 earnings: EPS and revenues miss analyst expectations Third quarter 2023 results: US$0.038 loss per share. Revenue: US$3.15m (up 18% from 3Q 2022). Net loss: US$1.50m (loss widened 2.6% from 3Q 2022). Revenue missed analyst estimates by 7.2%. Earnings per share (EPS) also missed analyst estimates by 33%. Revenue is forecast to grow 51% p.a. on average during the next 2 years, compared to a 15% growth forecast for the Semiconductor industry in North America. Tillkännagivande • Sep 27
Spectra7 Appoints Steffen Hahn as Senior Vice President, Engineering Spectra7 Microsystems Inc. announced the appointment of Steffen Hahn as Senior Vice President, Engineering. Prior to joining Spectra7, Mr. Hahn ran engineering at Kumu Networks, where he pioneered its unique same-channel 'Full Duplex' technology and designed custom SoCs (Systems on Chip) using silicon on insulator technologies. Before Kumu, he was VP of Engineering at Scintera Networks (now ADI) working on fully stand-alone power amplifier linearization chips. Prior to Scintera, he was VP of Engineering at Quellan (acquired by Intersil), developing noise cancellation solutions for cellular and handheld GPS as well as high speed equalizer products for copper channels, and at Airgo Networks (acquired by Qualcomm), where he worked on miniaturizing the first WiFi MIMO systems. His early career was spent at Philips Semiconductors on developing the technology and design environment for chips on glass. Mr. Hahn holds an M.S. degree from RWTH Aachen in Germany and has 41 granted patents. Tillkännagivande • Sep 16
Spectra7 Microsystems Inc. announced that it has received CAD 2.838 million in funding On September 15, 2023, Spectra7 Microsystems Inc., closed the transaction. Tillkännagivande • Aug 23
Spectra7 Microsystems Inc. Provides Revenue Guidance for Second Half of 2023 Spectra7 Microsystems Inc. provided revenue guidance for second half of 2023. For the half, the company expects revenue for second half of 2023 to be in the range of $5.5 millionto $7.0 million. Reported Earnings • Aug 22
Second quarter 2023 earnings: EPS and revenues exceed analyst expectations Second quarter 2023 results: US$0.032 loss per share (improved from US$0.047 loss in 2Q 2022). Revenue: US$3.27m (down 7.5% from 2Q 2022). Net loss: US$1.27m (loss narrowed 20% from 2Q 2022). Revenue exceeded analyst estimates by 2.1%. Earnings per share (EPS) also surpassed analyst estimates by 25%. Revenue is forecast to grow 45% p.a. on average during the next 2 years, compared to a 14% growth forecast for the Semiconductor industry in North America. Over the last 3 years on average, earnings per share has increased by 62% per year but the company’s share price has fallen by 17% per year, which means it is significantly lagging earnings. Tillkännagivande • Jul 21
Spectra7 Microsystems Inc. Provides Earnings Guidance for the Second Half of 2023 Spectra7 Microsystems Inc. provided earnings guidance for the second half of 2023. For the year, the company anticipated revenue to be in the range of $5.5 million to $7.0 million. Reported Earnings • Apr 28
Full year 2022 earnings released: US$0.21 loss per share (vs US$0.27 loss in FY 2021) Full year 2022 results: US$0.21 loss per share. Revenue: US$11.3m (up 107% from FY 2021). Net loss: US$7.04m (loss widened 22% from FY 2021). Revenue is forecast to grow 34% p.a. on average during the next 2 years, compared to a 11% growth forecast for the Semiconductor industry in North America. Tillkännagivande • Feb 10
Spectra7 Microsystems Inc. Targets High Growth 800Gbps AI Server Market Spectra7 Microsystems Inc. announced that it is targeting the high growth Artificial Intelligence (AI) server connectivity market with its new GC1122 product designed to support 800Gbps throughput. New technologies like the chatbot ChatGPT and others are fueling the race to build out high-performance AI infrastructure. AI requires massive amounts of computing power from specialized server hardware connected in clusters by a very high bandwidth and low latency interconnect fabric, including Spectra7's 800Gbps technologies. As Grand View Research cited in its latest Artificial Intelligence Market report: "The global artificial intelligence market size was valued at USD 136.55 billion in 2022 and projected to expand at a compound annual growth rate (CAGR) of 37.3% from 2023 to 2030. The continuous research and innovation directed by tech giants are driving the adoption of advanced technologies in high-growth industry verticals, such as automotive, healthcare, retail, finance, and manufacturing". Specialized AI servers in particular are expected to see high growth in the next few years, growing from 1.4 million units in 2022 to 4.7 million units in 20262. The chips used in these servers are increasingly relying on 800Gbps ports to directly connect to the fabric. Tillkännagivande • Feb 02
Spectra7 Microsystems Inc. to Showcase 200 and 400Gbps Connectivity using Active Copper Cables at DesignCon Spectra7 Microsystems Inc. announced that it will be showcasing server and switch connectivity at this year's annual DesignCon Conference Exhibition being held in Santa Clara, California from February 1-2, 2023. Spectra7 will be showing Active Copper Cables with the Company's GaugeChanger(TM) chips from cable partners Molex, Amphenol and Luxshare, with Broadcom's Tomahawk(R) 4 switch and Broadcom's BCM957508-P2100G Network Interface Card (NIC). As switches and servers move to higher bandwidth ports utilizing 56G PAM4 signaling, passive copper cables cannot serve all lengths needed. Instead of deploying optical interconnects that are much higher power and more costly, data center operators are looking to Active Copper Cables (ACCs) to serve this growing need. The use of 56G PAM4 signaling is growing significantly for Hyperscale data center interconnects. Total 56G PAM4 interfaces are expected to continue to increase, reaching over 150 million interface shipments by 2024. Spectra7's GaugeChanger(TM) is an innovative technology that allows copper to extend much longer lengths without the cost and power penalty of optics or DSP-based retimed copper solutions. It works equally well at 25G NRZ, 56G PAM4 and 112G PAM4 signaling, enabling new connector standards of 100, 200, 400, 800Gbps and 1.6Tbps. DesignCon is the premier high-speed interconnect and system design conference attended by engineers from around the world. Spectra7 will be exhibiting in booth #509. Tillkännagivande • Feb 01
Spectra7 Microsystems Inc. and Volex plc Demonstrate 112G PAM4 Signaling for 800Gbps Active Copper Interconnects at DesignCon Spectra7 Microsystems Inc. announced that it will partner with Volex plc to demonstrate Spectra7's new 112G PAM4 GaugeChanger™ chip intended for next generation 800Gbps data center interconnects at this year's annual DesignCon Conference and Exhibition being held in Santa Clara, CA from February 1-2, 2023. The demonstration will highlight a Volex 3-meter 28AWG Active Copper Cable with Spectra7's GC1122 ICs. The GC1122 is the latest addition to the GaugeChanger™ product line and extends the data rate from 56 to 112Gbps per lane. Since the GC1122 is analog and highly linear, dynamics such as line rate adjustment, multi-level signaling, intermittent line silence, transmit pre-emphasis or amplitude adjustment and receiver adaptivity are fully preserved. GC1122 chips are now sampling to leading cable partners and end customers. Spectra7's GaugeChanger™ is an innovative technology that allows copper to extend much longer lengths without the cost and power penalty of optics or DSP based retimed copper solutions. It works equally well at 25G NRZ, 56G PAM4 and 112G PAM4 signaling, enabling Ethernet interface standards of 100, 200, 400, 800Gbps and 1.6Tbps. Tillkännagivande • Jan 19
Spectra7 Microsystems Inc. Provides Revenue Guidance for the Fourth Quarter, Full Year Ended December 31, 2022 and First Quarter of 2023 Spectra7 Microsystems Inc. provided revenue guidance for the fourth quarter, full year ended December 31, 2022 and first quarter of 2023 . For the fourth quarter of 2022, the Company expects to report revenue of approximately $3.0 million, compared with $2.7 million in the third quarter of 2022 and $2.6 million in the fourth quarter of 2021. This represents an increase of approximately 11% from the prior quarter and approximately 14% year-over-year.For the year 2022, the company expected revenue of $11.3 million, up approximately 106% compared to $5.5 million in the previous year. For the first quarter of 2023, the company expected revenue to be in the range of $3.0 million to $3.2 million. Reported Earnings • Dec 01
Third quarter 2022 earnings released: US$0.043 loss per share (vs US$0.12 loss in 3Q 2021) Third quarter 2022 results: US$0.043 loss per share (improved from US$0.12 loss in 3Q 2021). Revenue: US$2.68m (up 71% from 3Q 2021). Net loss: US$1.46m (loss narrowed 41% from 3Q 2021). Over the last 3 years on average, earnings per share has increased by 82% per year but the company’s share price has fallen by 17% per year, which means it is significantly lagging earnings. Tillkännagivande • Nov 30
Spectra7 Microsystems Inc. Provides Revenue Guidance for the Full Year of 2022 Spectra7 Microsystems Inc. provided revenue guidance for the full year of 2022. The company expects to generate record revenue for the full 2022 year. The current outlook for revenue in the second half of 2022 is in the range of $5.3 million to $6.1 million. At the mid-point of the updated range, the projected full year results represent an annual revenue of approximately $11.2 million, which would be double the revenue generated in 2021. Tillkännagivande • Oct 26
Spectra7 Announces Return of Chief Executive Officer Raouf Halim to Half Time Status After Temporary Medical Leave of Absence Spectra7 Microsystems Inc. announced that, on October 24, 2022, Chief Executive Officer Raouf Halim returned on a half time basis. The Company previously announced that Mr. Halim had resumed board related duties on a limited time basis on August 29, 2022. Tillkännagivande • Oct 14
Spectra7 Microsystems Inc. Revises Revenue Guidance for the Second Half of 2022 Spectra7 Microsystems Inc. revised revenue guidance for the second half of 2022. The outlook for the second half of 2022 is expected to be in a range of $5.3 million to $6.0 million, which is within the range of $4.6 million to $6.0 million provided on August 29, 2022. Tillkännagivande • Aug 30
Spectra7 Microsystems Inc. Provides Revenue Guidance for the Second Half and Full Year of 2022 Spectra7 Microsystems Inc. provided revenue guidance for the second half and full year of 2022. The current outlook for revenue in the second half of 2022 is in the range of $4.6 million to $6.0 million. While the demand environment remains strong, continued supply related constraints are impacting the current revenue outlook. The Company expects to generate record revenue in 2022. At the mid-point of this range, the projected full year results represent an annual revenue of over $11.0 million, which would be double the revenue generated in 2021. Reported Earnings • Aug 29
Second quarter 2022 earnings released: US$0.047 loss per share (vs US$0.078 loss in 2Q 2021) Second quarter 2022 results: US$0.047 loss per share. Revenue: US$3.53m (up 382% from 2Q 2021). Net loss: US$1.59m (loss widened 19% from 2Q 2021). Tillkännagivande • Aug 26
Spectra7 Microsystems Inc. announced that it has received CAD 8.69554 million in funding On August 25, 2022, Spectra7 Microsystems Inc. closed the transaction. The company raised CAD 5,064,000 principal amount of debentures for gross proceeds of CAD 4,962,720 in its second and final tranche. The company has issued a total of CAD 8,873,000 principal amount of debentures for gross proceeds of CAD 8,695,540 in the transaction. The round was oversubscribed. The transaction included participation from insiders of the company for CAD 2,037,000. The company paid finder's fees totaling CAD 273,900 and issued 283,548 finder's warrants to arm's length parties in connection with the second tranche of the Offering. Each Finder's Warrant entitles the holder to purchase one Common Share at a price of CAD 1.02 for a period of two years from issuance. Tillkännagivande • Jul 28
Spectra7 Microsystems Inc. announced that it expects to receive CAD 7.84 million in funding Spectra7 Microsystems Inc. announced a non-brokered private placement offering of up to CAD 8,000,000 principal amount of 14% unsecured convertible debentures for gross proceeds of up to CAD 7,840,000 on July 26, 2022. Each CAD 1,000 principal amount of debentures will be sold at a subscription price of CAD 980. On same day company closing of the first tranche consisting of the issuance of CAD 3,809,000 principal amount of debentures for gross proceeds of CAD 3,732,820. Insiders of the company participated in the first tranche of the offering purchasing an aggregate of CAD 506,000 principal amount of debentures. The debentures shall mature on December 31, 2024, and the principal amount of each debenture will be convertible into common shares of the company at the option of the holder at any time prior to the close of business on the last business day immediately preceding the maturity date, at a conversion price of CAD 1.02 per common share, subject to adjustment upon certain customary events. Holders converting their debentures will receive accrued and unpaid interest thereon for the period from and including the date of the latest interest payment date to, and including, the date of conversion. The company paid finder's fees totaling CAD 47,373 and issued 118,055 finder's warrants to arm's length parties, including Cormark Securities Inc., in connection with the first tranche of the offering. Each finder's warrant entitles the holder to purchase one common share at a price of CAD 1.02 for a period of two years from issuance. All securities to be issued pursuant to the transaction are subject to a hold period of four months plus one day from issuance. Approval of the TSX Venture Exchange is required prior any conversion of debentures that would result in a holder holding more than 9.9% of the issued and outstanding common shares of the corporation and prior to the settlement of any interest payment in common shares. The second tranche of the offering is expected to close on or before August 25, 2022. Reported Earnings • Jun 01
First quarter 2022 earnings released: US$0.083 loss per share (vs US$0.072 loss in 1Q 2021) First quarter 2022 results: US$0.083 loss per share (down from US$0.072 loss in 1Q 2021). Revenue: US$2.08m (up 275% from 1Q 2021). Net loss: US$2.76m (loss widened 152% from 1Q 2021). Over the last 3 years on average, earnings per share has increased by 82% per year but the company’s share price has fallen by 23% per year, which means it is significantly lagging earnings. Tillkännagivande • May 31
Spectra7 Microsystems Inc. Updates Revenue Guidance for the First Half of 2022 Spectra7 Microsystems Inc. has updated its revenue outlook for the first half of 2022 and now expects revenue to be in the range of $5.3 million to $5.6 million. At the midpoint, this would represent an increase of over 300% from the first half of fiscal 2021. The Company had previously announced a revenue outlook for the first half of 2022 in the range of $5.5 million to $7.0 million. Tillkännagivande • Apr 08
Spectra7 Microsystems Inc. Provides Preliminary Revenue Guidance for the First Quarter and First Half of 2022 Spectra7 Microsystems Inc. provided preliminary revenue guidance for the first quarter and first half of 2022. Preliminary first quarter revenue is expected to be approximately $2.0 million.Fiscal 2022 unconstrained product demand based on customer indications continues to exceed $20.0 million - Revenue realization expected to improve in the second half of the year due to accelerated deployment of capital to secure greater supply, as well as assembly and test capacity. While long-term trends in the business are favorable, continued supply chain disruptions and constraints lead the Company to expect that revenue for the first half of fiscal 2022 will be in the range of $5.5 million to $7.0 million. At the midpoint of the outlook, this represents an increase of approximately 285% from the first half of fiscal 2021. Tillkännagivande • Jan 25
Spectra7 Microsystems Inc. Provides Revenue Guidance for the Fourth Quarter Ended December 31, 2021, First Quarter of 2022 and Year of 2022 Spectra7 Microsystems Inc. provided revenue guidance for the fourth quarter ended December 31, 2021, first quarter of 2022 and year of 2022. The Company expects to report revenue of approximately $2.6 million for the fourth quarter of 2021, compared with $1.6 million in the third quarter of 2021 and $0.4 million in the fourth quarter of 2020. This represents an increase of approximately 67% from the prior quarter and approximately 600% year-over-year.Based on current order trends and $9 million in total backlog, Spectra7 expects revenue for the first quarter of 2022 will be in the range of $3.0 million to $4.0 million, given current constraints in the semiconductor supply chain.For fiscal 2022, the Company currently expects revenue to increase each quarter with an acceleration in the second half of the year. With the potential for improvement across the supply chain and continued strong demand driving order and backlog growth, unconstrained product demand for fiscal 2022 is expected to exceed $20 million, with full-year revenue realization potentially constrained by supply availability. Tillkännagivande • Sep 02
Spectra7 Microsystems Inc. Provides Earnings Guidance for the Second Half of 2021 Spectra7 Microsystems Inc. provided earnings guidance for the second half of 2021. The company expects continued revenue growth for the second half of 2021. The company currently estimates total revenue in the second half of 2021 will be between $4.0 million and $5.0 million. Tillkännagivande • Apr 13
Spectra7 Microsystems Inc. announced a financing transaction Spectra7 Microsystems Inc. (TSXV:SEV) announced best efforts brokered private placement of up to 220,000,000 units on April 12, 2021. The company will issue securities in one or more tranches. Each unit will consist of one common share and one share purchase warrant exercisable at CAD 0.05 per share for a period of 5 years from issuance, subject to adjustment upon certain customary events. The expiry date of the warrants can be accelerated by the company at any time following the date that is four months and one day after the closing of the transaction and prior to the expiry date of the warrants if the closing price of the common shares on the TSX Venture Exchange is greater than CAD 0.08 for any 10 non-consecutive trading days. The transaction is expect to close on or about May 7, 2021. Insiders of the company may subscribe to 25% of units. The closing of the transaction is subject to certain conditions including, but not limited to, the receipt of all necessary approvals including the approval of the TSX Venture Exchange. Tillkännagivande • Feb 13
Spectra7 Microsystems Inc. announced that it has received CAD 4.560289 million in funding On February 12, 2021, Spectra7 Microsystems Inc. (TSXV:SEV) closed the transaction. The company amended the terms of the transaction. The company will now issue 152,009,633 units for the gross proceeds of CAD 4,560,288.99 in the transaction. The company issued 37,995,866 units for gross proceeds of CAD 1,139,875.98 in its second tranche. The tranche included participation from insiders fir CAD 96,475. The company paid 280,000 units to finders in the transaction. Tillkännagivande • Dec 31
Spectra7 Microsystems Inc. announced that it expects to receive CAD 3.5 million in funding Spectra7 Microsystems Inc. (TSX:SEV) announced a non-brokered private placement of up to 116,666,667 units at CAD 0.03 per unit for gross proceeds of up to CAD 3,500,000 on December 30, 2020. Each unit consists of one common share and one-half of one common share purchase warrant. Each warrant entitles the holder to purchase one additional common share at a price of CAD 0.05 per share for a period of five years from the date of issuance, subject to adjustment upon certain customary events. The expiry date of the warrants can be accelerated by the company at any time following the date that is 4 months and one day after closing of the transaction and prior to the expiry date of the Warrants if the closing price of the common shares on the TSX Venture Exchange is greater than CAD 0.08 for any 10 non-consecutive trading days. The transaction will be completed in one or more tranches. The transaction is subject to certain conditions including, but not limited to, the receipt of all necessary approvals including the approval of the TSX Venture Exchange. Tillkännagivande • Nov 11
Spectra7 Announces Longer Reach Active Copper Cable Solution for Data Center Connectivity Applications Spectra7 Microsystems Inc. announced the GC2802 IC to support longer reach data center server interconnect applications. New Artificial Intelligence (AI) and Machine Learning (ML) architectures are driving the need for longer and higher bandwidth server interconnects. Additionally, as Hyperscalers transition from 32 port switches to higher radix 64 port switches, interconnect lengths to servers will increase and span several racks. The GC2802 is the latest addition to the GaugeChanger™ product line and provides additional gain at higher bandwidth to achieve 30% longer reach Active Copper Cables (ACCs) than the current GC2502 product. The GC2802 also supports extended temperature range of -40 to 85C and is footprint compatible with the GC2502. GaugeChanger™ is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ and 50Gbps PAM-4 enabling new connector standards of 100, 200 and 400Gbps. Tillkännagivande • Nov 06
Spectra7 Microsystems Inc. Announces Three New Reference Designs Targeted at New Server Connectivity Needs Implementing 56Gbps Pam4 Signaling on Ethernet Network Interface Cards (Nics) Spectra7 Microsystems Inc. announced three new reference designs targeted at new server connectivity needs implementing 56Gbps PAM4 signaling on Ethernet Network Interface Cards (NICs). As servers adopt higher bandwidth ports that utilize 56Gbps PAM4 signaling, passive cables cannot serve all lengths needed. Instead of deploying optical interconnects that are much higher power and more costly, operators are looking to Active Copper Cables (ACCs) to serve this growing need. One example is Tencent who demonstrated a Spectra7 enabled ACC for server connectivity in September at China’s Open Data Center Committee (ODCC) conference. The 200Gbps demonstration showed a Spectra7 enabled ACC “splitter cable” connecting from a 200Gbps top-of-rack (ToR) switch port to 2 separate servers with 100Gbps NIC ports. The signaling in the cable was 56Gbps PAM4. This “splitter cable” architecture is being widely planned both in the US and in China for next generation deployments. Spectra7 is announcing immediate availability of three reference designs to support this critical need. All designs utilize Spectra7’s Dual Channel 56Gbps PAM4 technology. GCS-QSFP Reference Design - Server Connectivity Splitter Cable with 200Gbps QSFP56-CR4 form factor module at switch end and 2 QSFP56-CR2 form factor modules at server ends. A total of 4 GC2502 ICs are used in this reference design. GCS-DSFP Reference Design - Server Connectivity Splitter Cable with 200Gbps QSFP56-CR4 form factor module at switch end and 2 DSFP-CR2 form factor modules at server ends. A total of 4 GC2502 ICs are used in this reference design. GCS-SFP-DD Reference Design - Server Connectivity Splitter Cable with 200Gbps QSFP56-CR4 form factor module at switch end and 2 SFP-DD-CR2 form factor modules at server ends. A total of 4 GC2502 ICs are used in this reference design. Tillkännagivande • Oct 30
Spectra7 Microsystems Inc. Enables 400Gbps Active Copper Cables Achieve Production Ready Status at Molex Spectra7 Microsystems Inc. announced that Molex has achieved Production Ready status with Spectra7 enabled 400Gbps Active Copper Cables (ACCs). First customers and deployments for 400Gbps ACCs are expected in North America. Tillkännagivande • Oct 20
Spectra7 Announces Entry into 5G Mobile Infrastructure Market with its GaugeChanger™ Technology Spectra7 Microsystems Inc. announced its entry into the 5G mobile infrastructure market. The Company’s new GC2801 product will support extended temperature range requirements for ruggedized outdoor 5G network deployments. The 5G infrastructure market is estimated to be valued at USD 784 million in 2019 and is projected to reach USD 48 billion by 2027, at a compounded annual growth rate of 67.1%. Major growth drivers include lower latency in 5G, growing adoption of virtual networking architecture in telecommunications, and growth in mobile data traffic. Market Opportunity Expansion; Spectra7 believes interconnect opportunities in the 5G mobile infrastructure market represent a high growth and immediately addressable expansion of the addressable market for Spectra7 GaugeChanger™ products over the next several years. As recently announced in the Company’s second quarter 2020 earnings release on August 31st, 2020, the Company’s first 5G mobile operator is already in qualification and is expected to ramp production in 2021. Spectra7’s opportunities encompass each end of the 5G mobile network, both at the edge and in the core. 5G Network Edge; At the mobile network edge, there is an urgent need for single channel high bandwidth connections between Remote Radio Units and Baseband Units using an open standard protocol called enhanced Common Public Radio Interface (eCPRI). Here, a ruggedized version of the standard SFP connector is typically used. Using optics for longer length connections is a must, but for the many shorter lengths up to 12 meters, Spectra7’s solution is much lower power and less expensive than specialized wide temperature range optical components. 5G Network Core; In the core, mobile operators are embracing a new core switching architecture called Distributed, Disaggregated Chassis which eliminates traditional large monolithic modular switches and moves to a more flexible design using 1U and 2U “pizza box” switches. This architecture is being led by AT&T who released a 400Gbps PAM4 switch reference design in late 2019 to the Open Compute Project. In this architecture, cables replace the traditional backplane. Spectra7 enabled Active Copper Cables (ACCs) are ideal here due to their much thinner gauge, low power and lower cost compared to optics. GaugeChanger™ GC2801; The GC2801 is the latest addition to the GaugeChanger™ product line and supports a single channel of 56Gbps PAM4 signaling over an extended temperature range of -40 to 85C that is required for the extreme conditions of outdoor 5G deployments. Standard optical components will not support this temperature range, forcing interconnect suppliers to use much more expensive premium priced optical components. Spectra7’s GC2801 provides a low power, cost effective solution for lengths up to 12 meters. The GC2801 enables ACC interconnects compliant with the eCPRI standard that is widely used by mobile carriers. Tillkännagivande • Oct 16
Tencent Plans to Expand Use of Spectra7 Technology Spectra7 Microsystems Inc. announced that Tencent demonstrated 200Gbps and 400Gbps Active Copper Cables (ACCs) enabled by Spectra7’s technology at China’s Open Data Center Committee (ODCC) conference held in September in Beijing. Tencent recently completed qualification of these 200Gbps Spectra7 enabled cables and has now begun an initial trial run network deployment. Tencent is already using Spectra7 enabled ACC cables in its data centers for 25Gbps server interconnect. The 200Gbps demonstration showed a Spectra7 enabled ACC “splitter cable” connecting from a 200Gbps top-of-rack (ToR) switch port to 2 separate servers with 100Gbps ports. The signaling in the cable was 50Gbps PAM4. This architecture is being widely planned in China for next generation deployments. Tencent also demonstrated a 400Gbps QSFP-DD PAM4 Spectra7 based ACC for future applications. GaugeChanger™ is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25 Gbps NRZ and 50 Gbps PAM4 enabling new connector standards of 100, 200 and 400 Gbps. Tillkännagivande • Oct 15
Alibaba and Tencent Chart Path Forward with Spectra7 Enabled Active Copper Cable Technology Spectra7 Microsystems Inc. announced that Alibaba made public a new white paper High-speed Copper Cable Technology for Next Generation Data Centers” that includes details on the use of Active Copper Cables using Spectra7 technology for future deployments. The white paper was compiled by Alibaba, Tencent, Luxshare Precision, Zhejiang Zhaolong Interconnection and others. The announcement was made at China’s Open Data Center Committee (ODCC) conference held in September in Beijing. The ODCC Networking Group, led by project manager Chen Liang, Senior Technical Expert at Alibaba, authored the white paper. The paper details Active Copper Cables using Spectra7 technology as a critical interconnect solution at 56Gbps PAM4 rates for extending the reach of high-speed copper cables for next generation data centers. ODCC is co-sponsored by Alibaba, Baidu, Tencent, China Telecom, China Mobile, CAICT (the China Academy of Information and Communications Technology) and Intel. ODCC is an industry non-profit organization, voluntarily formed by enterprises and institutions related to the data center market. Tillkännagivande • Oct 08
Spectra7 Microsystems Inc. Partners with Foxconn to Deliver Next Generation 800Gbps Data Center Interconnects Spectra7 Microsystems Inc. announced that Foxconn Interconnect Technology Inc. (Foxconn) will support next generation 800Gbps Active Copper Cable (ACC) interconnects using Spectra7’s new GC1122 solution. The GC1122 is the latest addition to the GaugeChanger product line and extends the data rate from 56Gbps to 112Gbps per lane. Since the GC1122 is analog and highly linear, dynamics such as line rate adjustment, multi-level signaling, intermittent line silence, transmit pre-emphasis or amplitude adjustment and receiver adaptivity are fully preserved. GaugeChanger is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ, 50Gbps PAM-4 and 100Gbps PAM-4 enabling new connector standards of 100, 200, 400 and 800Gbps. Tillkännagivande • Jun 19
Spectra7 Microsystems Inc. announced that it expects to receive CAD 1 million in funding Spectra7 Microsystems Inc. (TSX:SEV) announced a non-brokered private placement of up to 40,000,000 units at CAD 0.025 per unit for gross proceeds of up to CAD 1,000,000 on June 18, 2020. Each unit consists of one common share and one-half of one common share purchase warrant. Each warrant entitles the holder to purchase one additional common share at a price of CAD 0.05 per share for a period of five years from the date of issuance, subject to adjustment upon certain customary events. The expiry date of the Warrants can be accelerated by the company at any time following the date that is 4 month and one day after closing of the transaction and prior to the expiry date of the Warrants if the closing price of the Common Shares on the TSX Venture Exchange is greater than CAD 0.08 for any 10 non-consecutive trading days. The transaction will be completed in one or more tranches. Insiders of the company may participate in the transaction. The transaction is subject to certain conditions including, but not limited to, the receipt of all necessary approvals including the approval of the TSX Venture Exchange.