BESV.F Stock Overview
BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally.
Snowflake Score | |
---|---|
Valuation | 0/6 |
Future Growth | 6/6 |
Past Performance | 3/6 |
Financial Health | 6/6 |
Dividends | 1/6 |
BE Semiconductor Industries N.V. Competitors
Price History & Performance
Historical stock prices | |
---|---|
Current Share Price | €151.55 |
52 Week High | €187.28 |
52 Week Low | €92.05 |
Beta | 1.5 |
1 Month Change | -2.67% |
3 Month Change | n/a |
1 Year Change | 80.40% |
3 Year Change | 66.36% |
5 Year Change | 411.13% |
Change since IPO | 376.57% |
Recent News & Updates
Recent updates
Shareholder Returns
BESV.F | US Semiconductor | US Market | |
---|---|---|---|
7D | -4.4% | -7.3% | -3.7% |
1Y | 80.4% | 87.9% | 20.5% |
Return vs Industry: BESV.F underperformed the US Semiconductor industry which returned 92.1% over the past year.
Return vs Market: BESV.F exceeded the US Market which returned 20.2% over the past year.
Price Volatility
BESV.F volatility | |
---|---|
BESV.F Average Weekly Movement | n/a |
Semiconductor Industry Average Movement | 6.8% |
Market Average Movement | 6.0% |
10% most volatile stocks in US Market | 16.4% |
10% least volatile stocks in US Market | 3.0% |
Stable Share Price: BESV.F has not had significant price volatility in the past 3 months.
Volatility Over Time: Insufficient data to determine BESV.F's volatility change over the past year.
About the Company
Founded | Employees | CEO | Website |
---|---|---|---|
1995 | 1,736 | Richard Blickman | www.besi.com |
BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company’s principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems.
BE Semiconductor Industries N.V. Fundamentals Summary
BESV.F fundamental statistics | |
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Market cap | US$11.67b |
Earnings (TTM) | US$188.47m |
Revenue (TTM) | US$616.07m |
62.5x
P/E Ratio19.1x
P/S RatioIs BESV.F overvalued?
See Fair Value and valuation analysisEarnings & Revenue
BESV.F income statement (TTM) | |
---|---|
Revenue | €578.86m |
Cost of Revenue | €203.07m |
Gross Profit | €375.79m |
Other Expenses | €198.70m |
Earnings | €177.08m |
Last Reported Earnings
Dec 31, 2023
Next Earnings Date
Apr 25, 2024
Earnings per share (EPS) | 2.30 |
Gross Margin | 64.92% |
Net Profit Margin | 30.59% |
Debt/Equity Ratio | 71.3% |
How did BESV.F perform over the long term?
See historical performance and comparison