Nissha Dividends and Buybacks
Dividend criteria checks 3/6
Nissha is a dividend paying company with a current yield of 3.09%. Next payment date is on 4th March, 2025 with an ex-dividend date of 27th December, 2024.
Key information
3.1%
Dividend yield
2.2%
Buyback Yield
Total Shareholder Yield | 5.3% |
Future Dividend Yield | 3.5% |
Dividend Growth | 13.7% |
Next dividend pay date | 04 Mar 25 |
Ex dividend date | 27 Dec 24 |
Dividend per share | JP¥50.000 |
Payout ratio | 281% |
Recent dividend and buyback updates
Recent updates
Nissha Co., Ltd. Earnings Missed Analyst Estimates: Here's What Analysts Are Forecasting Now
Nov 12Some May Be Optimistic About Nissha's (TSE:7915) Earnings
Aug 13Nissha Co., Ltd. Beat Analyst Estimates: See What The Consensus Is Forecasting For This Year
Aug 10Nissha Co., Ltd.'s (TSE:7915) Stock Retreats 26% But Revenues Haven't Escaped The Attention Of Investors
Aug 05Nissha Co., Ltd.'s (TSE:7915) Intrinsic Value Is Potentially 68% Above Its Share Price
Aug 02Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 7915's dividend payments have been volatile in the past 10 years.
Growing Dividend: 7915's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Nissha Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (7915) | 3.1% |
Market Bottom 25% (JP) | 1.8% |
Market Top 25% (JP) | 3.8% |
Industry Average (Electronic) | 1.6% |
Analyst forecast (7915) (up to 3 years) | 3.5% |
Notable Dividend: 7915's dividend (3.09%) is higher than the bottom 25% of dividend payers in the JP market (1.81%).
High Dividend: 7915's dividend (3.09%) is low compared to the top 25% of dividend payers in the JP market (3.78%).
Earnings Payout to Shareholders
Earnings Coverage: With its high payout ratio (281.5%), 7915's dividend payments are not well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (29.5%), 7915's dividend payments are well covered by cash flows.