Resorttrust Dividend
Dividend criteria checks 4/6
Resorttrust is a dividend paying company with a current yield of 2.05% that is well covered by earnings. Next payment date is on 11th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
2.0%
Dividend yield
3%
Payout ratio
Industry average yield | 0.7% |
Next dividend pay date | 11 Dec 24 |
Ex dividend date | 27 Sep 24 |
Dividend per share | n/a |
Earnings per share | JP¥150.54 |
Dividend yield forecast in 3Y | 2.7% |
Recent dividend updates
Resorttrust (TSE:4681) Has Announced A Dividend Of ¥27.00
Jul 12Resorttrust (TSE:4681) Is Increasing Its Dividend To ¥29.00
Mar 25Recent updates
Resorttrust (TSE:4681) Has Announced A Dividend Of ¥27.00
Jul 12Returns On Capital At Resorttrust (TSE:4681) Have Stalled
Apr 25Resorttrust (TSE:4681) Is Increasing Its Dividend To ¥29.00
Mar 25Investors Interested In Resorttrust, Inc.'s (TSE:4681) Earnings
Mar 19Estimating The Fair Value Of Resorttrust, Inc. (TSE:4681)
Mar 04Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 4681's dividend payments have been volatile in the past 10 years.
Growing Dividend: 4681's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Resorttrust Dividend Yield vs Market |
---|
Segment | Dividend Yield |
---|---|
Company (4681) | 2.0% |
Market Bottom 25% (JP) | 1.7% |
Market Top 25% (JP) | 3.4% |
Industry Average (Hospitality) | 0.7% |
Analyst forecast in 3 Years (4681) | 2.7% |
Notable Dividend: 4681's dividend (2.05%) is higher than the bottom 25% of dividend payers in the JP market (1.68%).
High Dividend: 4681's dividend (2.05%) is low compared to the top 25% of dividend payers in the JP market (3.43%).
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (2.8%), 4681's dividend payments are thoroughly covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (26%), 4681's dividend payments are well covered by cash flows.