Meiho Facility Works Ltd.

TSE:1717 Stock Report

Market Cap: JP¥9.9b

Meiho Facility Works Dividends and Buybacks

Dividend criteria checks 2/6

Meiho Facility Works is a dividend paying company with a current yield of 4.28%. Next payment date is on 10th June, 2025 with an ex-dividend date of 28th March, 2025.

Key information

4.3%

Dividend yield

n/a

Buyback Yield

Total Shareholder Yieldn/a
Future Dividend Yield4.6%
Dividend Growthn/a
Next dividend pay date10 Jun 25
Ex dividend date28 Mar 25
Dividend per sharen/a
Payout ration/a

Recent dividend and buyback updates

Recent updates

Upcoming Dividend Payment

TodayNov 27 2024Ex Dividend DateMar 28 2025Dividend Pay DateJun 10 202574 days from Ex DividendBuy in the next 121 days to receive the upcoming dividend

Stability and Growth of Payments

Fetching dividends data

Stable Dividend: Insufficient data to determine if 1717's dividends per share have been stable in the past.

Growing Dividend: Insufficient data to determine if 1717's dividend payments have been increasing.


Dividend Yield vs Market

Meiho Facility Works Dividend Yield vs Market
How does 1717 dividend yield compare to the market?
SegmentDividend Yield
Company (1717)4.3%
Market Bottom 25% (JP)1.8%
Market Top 25% (JP)3.8%
Industry Average (Professional Services)0.9%
Analyst forecast (1717) (up to 3 years)4.6%

Notable Dividend: 1717's dividend (4.28%) is higher than the bottom 25% of dividend payers in the JP market (1.81%).

High Dividend: 1717's dividend (4.28%) is in the top 25% of dividend payers in the JP market (3.78%)


Earnings Payout to Shareholders

Earnings Coverage: Insufficient data to calculate 1717's payout ratio to determine if its dividend payments are covered by earnings.


Cash Payout to Shareholders

Cash Flow Coverage: Unable to calculate sustainability of dividends as 1717 has not reported any payouts.


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