Shinwa Dividends and Buybacks
Dividend criteria checks 5/6
Shinwa is a dividend paying company with a current yield of 4.1% that is well covered by earnings. Next payment date is on 22nd November, 2024 with an ex-dividend date of 29th August, 2024.
Key information
4.1%
Dividend yield
0.003%
Buyback Yield
| Total Shareholder Yield | 4.1% |
| Future Dividend Yield | n/a |
| Dividend Growth | 3.5% |
| Next dividend pay date | 22 Nov 24 |
| Ex dividend date | 29 Aug 24 |
| Dividend per share | JP¥112.000 |
| Payout ratio | 50% |
Recent dividend and buyback updates
Recent updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 7607's dividend payments have been volatile in the past 10 years.
Growing Dividend: 7607's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| Shinwa Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (7607) | 4.1% |
| Market Bottom 25% (JP) | 1.8% |
| Market Top 25% (JP) | 3.8% |
| Industry Average (Machinery) | 2.2% |
| Analyst forecast (7607) (up to 3 years) | n/a |
Notable Dividend: 7607's dividend (4.1%) is higher than the bottom 25% of dividend payers in the JP market (1.8%).
High Dividend: 7607's dividend (4.1%) is in the top 25% of dividend payers in the JP market (3.76%)
Earnings Payout to Shareholders
Earnings Coverage: With its reasonable payout ratio (50%), 7607's dividend payments are covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (46.6%), 7607's dividend payments are well covered by cash flows.