Sansei Technologies Dividends and Buybacks
Dividend criteria checks 5/6
Sansei Technologies is a dividend paying company with a current yield of 3.96% that is well covered by earnings. Next payment date is on 4th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
4.0%
Dividend yield
n/a
Buyback Yield
| Total Shareholder Yield | n/a |
| Future Dividend Yield | n/a |
| Dividend Growth | 5.0% |
| Next dividend pay date | 04 Dec 24 |
| Ex dividend date | 27 Sep 24 |
| Dividend per share | JP¥50.000 |
| Payout ratio | 30% |
Recent dividend and buyback updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 6357's dividend payments have been volatile in the past 10 years.
Growing Dividend: 6357's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| Sansei Technologies Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (6357) | 4.0% |
| Market Bottom 25% (JP) | 1.8% |
| Market Top 25% (JP) | 3.8% |
| Industry Average (Machinery) | 2.2% |
| Analyst forecast (6357) (up to 3 years) | n/a |
Notable Dividend: 6357's dividend (3.96%) is higher than the bottom 25% of dividend payers in the JP market (1.83%).
High Dividend: 6357's dividend (3.96%) is in the top 25% of dividend payers in the JP market (3.79%)
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (30.1%), 6357's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its low cash payout ratio (10.9%), 6357's dividend payments are thoroughly covered by cash flows.