Hirakawa Hewtech Dividend

Dividend criteria checks 5/6

Hirakawa Hewtech is a dividend paying company with a current yield of 3.21% that is well covered by earnings. Next payment date is on 9th December, 2024 with an ex-dividend date of 27th September, 2024.

Key information

3.2%

Dividend yield

32%

Payout ratio

Industry average yield2.0%
Next dividend pay date09 Dec 24
Ex dividend date27 Sep 24
Dividend per shareJP¥45.000
Earnings per shareJP¥112.76
Dividend yield forecast in 3Y3.2%

Recent dividend updates

Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Aug 08
Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Jul 25
Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Hirakawa Hewtech (TSE:5821) Will Pay A Larger Dividend Than Last Year At ¥22.00

Jul 11
Hirakawa Hewtech (TSE:5821) Will Pay A Larger Dividend Than Last Year At ¥22.00

Recent updates

Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Aug 08
Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Jul 25
Hirakawa Hewtech (TSE:5821) Is Paying Out A Larger Dividend Than Last Year

Hirakawa Hewtech (TSE:5821) Will Pay A Larger Dividend Than Last Year At ¥22.00

Jul 11
Hirakawa Hewtech (TSE:5821) Will Pay A Larger Dividend Than Last Year At ¥22.00

Some May Be Optimistic About Hirakawa Hewtech's (TSE:5821) Earnings

May 21
Some May Be Optimistic About Hirakawa Hewtech's (TSE:5821) Earnings

Upcoming Dividend Payment

TodayAug 22 2024Ex Dividend DateSep 27 2024Dividend Pay DateDec 09 202473 days from Ex DividendBuy in the next 36 days to receive the upcoming dividend

Stability and Growth of Payments

Fetching dividends data

Stable Dividend: 5821's dividends per share have been stable in the past 10 years.

Growing Dividend: 5821's dividend payments have increased over the past 10 years.


Dividend Yield vs Market

Hirakawa Hewtech Dividend Yield vs Market
How does 5821 dividend yield compare to the market?
SegmentDividend Yield
Company (5821)3.2%
Market Bottom 25% (JP)1.8%
Market Top 25% (JP)3.7%
Industry Average (Electrical)2.0%
Analyst forecast in 3 Years (5821)3.2%

Notable Dividend: 5821's dividend (3.21%) is higher than the bottom 25% of dividend payers in the JP market (1.83%).

High Dividend: 5821's dividend (3.21%) is low compared to the top 25% of dividend payers in the JP market (3.74%).


Earnings Payout to Shareholders

Earnings Coverage: With its reasonably low payout ratio (31.9%), 5821's dividend payments are well covered by earnings.


Cash Payout to Shareholders

Cash Flow Coverage: With its low cash payout ratio (20.4%), 5821's dividend payments are well covered by cash flows.


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