Senshu Ikeda Holdings Dividends and Buybacks
Dividend criteria checks 2/6
Senshu Ikeda Holdings is a dividend paying company with a current yield of 3.72% that is well covered by earnings. Next payment date is on 27th June, 2025 with an ex-dividend date of 28th March, 2025.
Key information
3.7%
Dividend yield
-0.004%
Buyback Yield
| Total Shareholder Yield | 3.7% |
| Future Dividend Yield | n/a |
| Dividend Growth | 2.8% |
| Next dividend pay date | 27 Jun 25 |
| Ex dividend date | 28 Mar 25 |
| Dividend per share | JP¥15.000 |
| Payout ratio | 14% |
Recent dividend and buyback updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 8714's dividend payments have been volatile in the past 10 years.
Growing Dividend: 8714's dividend payments have not increased over the past 10 years.
Dividend Yield vs Market
| Senshu Ikeda Holdings Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (8714) | 3.7% |
| Market Bottom 25% (JP) | 1.8% |
| Market Top 25% (JP) | 3.8% |
| Industry Average (Banks) | 3.0% |
| Analyst forecast (8714) (up to 3 years) | n/a |
Notable Dividend: 8714's dividend (3.72%) is higher than the bottom 25% of dividend payers in the JP market (1.82%).
High Dividend: 8714's dividend (3.72%) is low compared to the top 25% of dividend payers in the JP market (3.82%).
Current Payout to Shareholders
Earnings Coverage: With its low payout ratio (13.9%), 8714's dividend payments are thoroughly covered by earnings.
Future Payout to Shareholders
Future Dividend Coverage: Insufficient data to determine if a dividend will be paid in 3 years or that it will be covered by earnings.