Announcement • May 09
Teradyne, Inc. announces Quarterly dividend, payable on June 12, 2026 Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on June 12, 2026, ex-date on May 21, 2026 and record date on May 21, 2026. Announcement • Apr 29
Teradyne, Inc. Provides Earnings Guidance for the Second Quarter of 2026 Teradyne, Inc. provided earnings guidance for the Second quarter of 2026. For the quarter, the company provided revenue guidance of $1,150 million to $1,250 million, with GAAP net income of $1.83 to $2.12 per diluted share. Reported Earnings • Apr 29
First quarter 2026 earnings released: EPS: US$2.55 (vs US$0.61 in 1Q 2025) First quarter 2026 results: EPS: US$2.55 (up from US$0.61 in 1Q 2025). Revenue: US$1.28b (up 87% from 1Q 2025). Net income: US$398.9m (up 303% from 1Q 2025). Profit margin: 31% (up from 14% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 16% p.a. on average during the next 3 years, compared to a 13% growth forecast for the Semiconductor industry in Europe. Announcement • Apr 17
Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd. Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd. on April 16, 2026. The acquisition strengthens Teradyne’s ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets. By combining TestInsight’s pattern conversion, validation, and virtual test capabilities with Teradyne’s ATE platforms, customers will benefit from a tightly integrated design-to-test workflow that reduces debug cycles, improves coverage, and enables earlier test program readiness. As part of Teradyne’s ongoing commitment to an open ecosystem, TestInsight will continue to support existing customers across all ATE platforms and preserve its long-standing OEM and partner relationships.
Teradyne, Inc. (NasdaqGS:TER) completed the acquisition of Test Insight Ltd. on April 16, 2026. Announcement • Apr 15
Teradyne, Inc. to Report Q1, 2026 Results on Apr 28, 2026 Teradyne, Inc. announced that they will report Q1, 2026 results at 4:30 PM, US Eastern Standard Time on Apr 28, 2026 Announcement • Mar 30
Teradyne, Inc., Annual General Meeting, May 08, 2026 Teradyne, Inc., Annual General Meeting, May 08, 2026. Location: at the ofices of teradyne, inc. at 600 riverpark drive, north reading, massachusets 01864, United States Announcement • Mar 23
Teradyne Inc Showcases Test Solutions At Semicon China Teradyne, Inc. participated at SEMICON China 2026, taking place March 25-27 at the Shanghai New International Expo Centre in Shanghai, China. Visitors are invited to experience Teradyne’s latest innovations and connect with experts at the booth in hall N2, booth 2371. Teradyne showcased four test solutions at the booth, each designed to address the evolving challenges of advanced devices powering AI infrastructure. Teradyne UltraFLEXplus is a scalable, future-ready platform for testing AI accelerators, xPUs, datacenter networking equipment and ADAS semiconductors, combining superior digital capabilities and robust power delivery to support the demanding test requirements of next-generation devices. Streamlined workflows and advanced automation speed time to market while delivering on rigorous quality standards. Teradyne ETS-800 ensures clean, stable voltage and high-accuracy measurements for ultra-low resistance devices. Its efficient current delivery for measuring resistance supports mission-critical reliability and scalable production from low to high volume. Teradyne Titan HP sets a new standard in system level test for AI and cloud devices with advanced active thermal control and multi-branch cooling, preventing overheating while optimizing test time. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured their investment today will meet the demanding requirements of tomorrow’s devices as well. Teradyne Magnum EPIC is a high-performance test solution for the latest generation of DRAM devices. Featuring a near-DUT test architecture, it delivers superior signal integrity performance at high data rates to enhance yield gain. With over 18,000 high-speed digital channels, the Magnum EPIC delivers high-speed clocks to enable device test speeds up to 12.12 Gbps with the high parallel capacity needed for testing high-volume DRAM devices. On Thursday at 16:40, Teradyne will have a featured speaking session DevOpsForTest at the SEMICON China Design Innovation Forum: AI Intelligent Applications and Automotive ICs. This year marks a significant milestone for Teradyne as the company celebrates 25 years in China. Since establishing the first office in the region in 2001, Teradyne has played a pivotal role in supporting the rapid growth of China’s semiconductor and electronics industries. Through close collaboration with local customers and ongoing investment in engineering and service capabilities, Teradyne remains committed to advancing innovation, fostering talent, and contributing to the development of China’s technology ecosystem. Explore the latest test solutions at the booth at SEMICON China in hall N2, booth 2371. Reported Earnings • Feb 03
Full year 2025 earnings released: EPS: US$3.48 (vs US$3.41 in FY 2024) Full year 2025 results: EPS: US$3.48 (up from US$3.41 in FY 2024). Revenue: US$3.19b (up 13% from FY 2024). Net income: US$554.0m (up 2.2% from FY 2024). Profit margin: 17% (down from 19% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe. Announcement • Feb 03
Teradyne, Inc. Provides Earnings Guidance for the First Quarter of 2026 Teradyne, Inc. provided earnings guidance for the first quarter of 2026. Guidance for the first quarter of 2026 is revenue of $1,150 million to $1,250 million, with GAAP net income of $1.82 to $2.19 per diluted share. Declared Dividend • Jan 29
Third quarter dividend of US$0.12 announced Shareholders will receive a dividend of US$0.12. Ex-date: 12th February 2026 Payment date: 13th March 2026 Dividend yield will be 0.2%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 17%. Cash payout ratio: 16%. Announcement • Jan 27
Teradyne, Inc. announces Quarterly dividend, payable on March 13, 2026 Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on March 13, 2026, ex-date on February 13, 2026 and record date on February 13, 2026. Announcement • Jan 14
Teradyne, Inc. to Report Q4, 2025 Results on Feb 02, 2026 Teradyne, Inc. announced that they will report Q4, 2025 results at 5:00 PM, US Eastern Standard Time on Feb 02, 2026 Valuation Update With 7 Day Price Move • Jan 06
Investor sentiment improves as stock rises 16% After last week's 16% share price gain to €195, the stock trades at a forward P/E ratio of 49x. Average forward P/E is 25x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €94.64 per share. Valuation Update With 7 Day Price Move • Nov 28
Investor sentiment improves as stock rises 17% After last week's 17% share price gain to €157, the stock trades at a forward P/E ratio of 40x. Average forward P/E is 18x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €94.87 per share. Declared Dividend • Nov 13
Dividend of US$0.12 announced Shareholders will receive a dividend of US$0.12. Ex-date: 21st November 2025 Payment date: 17th December 2025 Dividend yield will be 0.2%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 17%. Cash payout ratio: 16%. Announcement • Nov 11
Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on December 17, 2025 Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on December 17, 2025, to shareholders of record as of the close of business on November 24, 2025. Reported Earnings • Oct 29
Third quarter 2025 earnings released: EPS: US$0.75 (vs US$0.89 in 3Q 2024) Third quarter 2025 results: EPS: US$0.75 (down from US$0.89 in 3Q 2024). Revenue: US$769.2m (up 4.3% from 3Q 2024). Net income: US$119.6m (down 18% from 3Q 2024). Profit margin: 16% (down from 20% in 3Q 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 9.1% growth forecast for the Semiconductor industry in Europe. Announcement • Oct 16
Teradyne, Inc. to Report Q3, 2025 Results on Oct 28, 2025 Teradyne, Inc. announced that they will report Q3, 2025 results at 5:00 PM, US Eastern Standard Time on Oct 28, 2025 Announcement • Oct 08
Teradyne, Inc. Announces the ETS-800 Dual Sector Automated Test System Teradyne, Inc. announced the launch of the ETS-800 D20, the latest addition to the ETS-800 platform of high-performance test systems for power semiconductors. The Teradyne ETS-800 D20 is designed to address the diverse needs of customers by offering a versatile and cost-effective solution for both high volume and high mix/low volume device testing. Announcement • Oct 03
Teradyne, Inc. Unveils Titan HP Teradyne, Inc. announced the launch of its Titan HP system level test (SLT) platform, designed specifically for the artificial intelligence (AI) and cloud infrastructure markets. This innovative solution addresses the increasing demands of today's advanced technologies as process nodes become smaller and new architectures emerge. SLT has become an integral part of the high-volume manufacturing process, as the complex devices used in AI and cloud infrastructure deployments push the boundaries of power consumption and thermal output. Teradyne Titan HP, currently in production at a number of large customers, is purpose-built to test these devices in real-world conditions. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured that their investment will meet the demanding requirements of tomorrow's devices as well. Teradyne Titan HP's superior thermal control ensures devices meet rigorous quality standards at or above the expected yield. This includes: A multi-branch cold plate architecture, which cools both the device under test (DUT) and non-DUT components for comprehensive thermal management. Asynchronous cooling control with proportional, integral and derivative (PID)-tuned, per-site thermal control, which provides precise, efficient cooling to prevent overheating. A DUT heater option, which enhances the accuracy of automated temperature control (ATC) for more precise thermal testing. Announcement • Oct 01
Teradyne, Inc. Unveils PHY Performance Testing Capabilities Teradyne, Inc. announced the release of Teradyne UltraPHY224G for UltraFLEXplus, a breakthrough in high-speed PHY performance testing that extends its portfolio beyond the UltraPHY 112G instrument already in production and adopted by a number of customers. Both solutions are designed for the UltraFLEXplus, and leverage Teradyne's IG-XL software for ease of adoption. Teradyne UltraPHY 224G for UltraFLEX plus is a breakthrough in high-speedPHY performance testing to address emerging data rates in the data center and silicon photonics (SiPh) markets. Developed by Teradyne with Multilane modules, UltraPHY 224G delivers bench-quality signal generation and measurement for production testing, setting a new benchmark for test density and the signal fidelity required by next-generation semiconductor interfaces. Customers can be confident that their UltraPHY investments support both today's and tomorrow's chiplet-based architectures, advanced packaging, and KGD workflows. UltraPHY 224G, developed by Teradyne with MultILane modules, delivers bench-quality signal generation, and measurement for production testing. Designed to meet strict hardware and software standards, it sets a new benchmark for testdensity and the signal fidelity required by Next-generation semiconductor interfaces. While UltraPHY 112G is optimized for today's high-speed standards, UltraPHY 224G extends the performance envelope to address emerging data rates in The data center and silicon photonics markets. Both instruments are designed to co-exist in the same UltraFLEXplus platform, giving customers maximum flexibility to test the broadest range of current and future high-speed interfaces. UltraPHY 224G provides 8 full-duplex differential lanes plus 8 Rx-only differential lanes per instrument, supporting data rates up to 112 Gb/s NRZ and 224 Gb/s (112 Gbaud PAM4) using a DSO + BERT architecture. Like Teradyne's UltraPHY 112G, the UltraPHY 224G is extremely scalable, with support for multiple instruments per UltraFLEXplus platform and the flexibility to extend to emerging advanced modulation formats as the industry evolves. Key benefits include: Single tester platform for all PHY testing needs - both the UltraPHY 224G and the UltraPHY 112G are designed for Teradyne UltraFLEXplus. Integrated DSO, AWG, and BERT capabilities for comprehensive PHY production testing and characterization. >50GHz signal delivery bandwidth with proven reliability in production environments. Extensible architecture to support current and future electrical interface standards for SiPh and non-SiPh devices. As PHY interfaces continue to evolve, Teradyne UltraPHY is a future-proof solution deployed on a single test platform - Teradyne UltraFLE Xplus. New Risk • Sep 22
New major risk - Share price stability The company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of Italian stocks, typically moving 7.3% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. This is currently the only risk that has been identified for the company. Valuation Update With 7 Day Price Move • Sep 22
Investor sentiment improves as stock rises 15% After last week's 15% share price gain to €111, the stock trades at a forward P/E ratio of 33x. Average forward P/E is 20x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €91.84 per share. Buy Or Sell Opportunity • Sep 19
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 35% to €100. The fair value is estimated to be €83.58, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 6.2% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 12% per annum. Earnings are also forecast to grow by 22% per annum over the same time period. Announcement • Sep 03
Teradyne, Inc. Announces Change of Group President of the Teradyne Robotics Group Teradyne, Inc. named Jean-Pierre ‘JP’ Hathout as Group President of the Teradyne Robotics Group, succeeding Ujjwal Kumar. Hathout was appointed President of Universal Robots in May and was previously President of Mobile Industrial Robotics (MiR) for two years. Hathout brings over two decades of international management experience, including 17 years at Bosch, and most recently led MiR to strengthen its product portfolio and global position. He will continue to lead Universal Robots in his new position. Announcement • Aug 26
Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on September 29, 2025 Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on September 29, 2025, to shareholders of record as of the close of business on September 5, 2025. Buy Or Sell Opportunity • Aug 25
Now 21% overvalued after recent price rise Over the last 90 days, the stock has risen 39% to €99.81. The fair value is estimated to be €82.66, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 6.2% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 12% per annum. Earnings are also forecast to grow by 22% per annum over the same time period. Announcement • Aug 05
Teradyne, Inc. Unveils Magnum 7H - the Next-Generation Memory Tester for High Bandwidth Memory Devices Teradyne, Inc. announced the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices, integrated with GPUs and accelerators in high-performance, generative AI servers. The Magnum 7H is engineered to deliver high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale. Volume shipments and HBM device production on Teradyne's Magnum 7H have started ramping at the largest HBM manufacturers in the industry. The Magnum 7H is a cutting-edge memory tester that supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It offers comprehensive test coverage, from base-die wafer test to memory core test and burn-in, ensuring the quality and reliability of HBM devices. Additionally, the Magnum 7H supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer level with traditional probers and probe cards, as well as post-singulated HBM with new bare-die probers/handlers for improved device quality. The Teradyne Magnum 7H delivers: Enhanced Device Quality: Superior DPS response time delivers higher device yield. Comprehensive Memory and Logic Testing:Magnum 7H is ideally suited for testing HBM stacks that contain both logic base dies and DRAM dies. It delivers high-speed memory testing with a flexible algorithmic pattern generator (APG) and logic testing with Logic Vector Memory (LVM) option. The Fail List Streaming (FLS) feature ensures high-speed error capture for both memory and logic testing. High Performance: High-speed testing of current HBM3/3E and next-generation HBM4/4E devices up to 4.5Gbps. High Parallelism: Essential for lowering overall cost-of-test for HBM, the Magnum 7H is configurable for up to 9,216 digital pins and 2,560 power pins, enabling superior touchdown efficiency at probe and resulting in 1.6x increased throughput in mass production environments. The increasing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne's Magnum 7 HBM is a next-generation memory testers engineered to test both and tomorrow's HBM devices with high parallelism, speed, and accuracy, across the entire manufacturing process. Board Change • Aug 01
High number of new directors There are 5 new directors who have joined the board in the last 3 years. Independent Director Necip Sayiner was the last director to join the board, commencing their role in 2025. The company’s lack of board continuity is considered a risk according to the Simply Wall St Risk Model. Reported Earnings • Jul 30
Second quarter 2025 earnings released: EPS: US$0.49 (vs US$1.18 in 2Q 2024) Second quarter 2025 results: EPS: US$0.49 (down from US$1.18 in 2Q 2024). Revenue: US$651.8m (down 11% from 2Q 2024). Net income: US$78.4m (down 58% from 2Q 2024). Profit margin: 12% (down from 26% in 2Q 2024). The decrease in margin was primarily driven by lower revenue. Revenue is forecast to grow 12% p.a. on average during the next 3 years, compared to a 8.4% growth forecast for the Semiconductor industry in Europe. Announcement • Jul 30
Teradyne, Inc. Provides Earnings Guidance for the Third Quarter of 2025 Teradyne, Inc. provided earnings guidance for the third quarter of 2025. For the period, the company expects revenue of $710 million to $770 million, with GAAP net income of $0.62 to $0.80 per diluted share. Announcement • Jul 15
Teradyne, Inc. to Report Q2, 2025 Results on Jul 29, 2025 Teradyne, Inc. announced that they will report Q2, 2025 results at 5:00 PM, US Eastern Standard Time on Jul 29, 2025 Announcement • Jun 27
Teradyne, Inc. Announces Election of Two New Independent Directors Teradyne, Inc. announced the election of two new independent directors to its Board of Directors. Drew Henry, Executive Vice President of Strategy & Ecosystem at Arm Holdings, and Dr. Necip Sayiner, former President and CEO of Intersil Corporation, will join the Teradyne Board effective July 1, 2025. Mr. Henry was appointed to the Board's Compensation Committee and Nominating and Corporate Governance Committee, and Dr. Sayiner was appointed to the Board’s Audit Committee. Drew Henry brings more than 30 years of deep industry experience across the semiconductor, computing, and technology sectors, with a focus on strategic growth, platform development, and operational execution. Prior to joining Arm, Mr. Henry served as the CEO of Acetti Software and held senior roles at SanDisk and Nvidia. He holds a Master of Science in Electrical Engineering from the University of Southern California and a BS in Engineering Physics from the University of the Pacific. Dr. Necip Sayiner has over 25 years of leadership experience in the semiconductor industry. He served as President and CEO of Intersil Corporation and later joined Renesas as Executive Vice President and General Manager. Prior to Intersil, he was President and CEO of Silicon Laboratories and held senior executive positions at Agere Systems. Dr. Sayiner holds a Ph.D. in Electrical Engineering from the University of Pennsylvania, an MS in Engineering from Southern Illinois University, and dual BS degrees in Electrical and Electronics Engineering and Physics from Bosphorus University in Turkey. Announcement • May 09
Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on June 13, 2025 Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on June 13, 2025, to shareholders of record as of the close of business on May 22, 2025. Reported Earnings • May 06
First quarter 2025 earnings released: EPS: US$0.61 (vs US$0.42 in 1Q 2024) First quarter 2025 results: EPS: US$0.61 (up from US$0.42 in 1Q 2024). Revenue: US$685.7m (up 14% from 1Q 2024). Net income: US$98.9m (up 54% from 1Q 2024). Profit margin: 14% (up from 11% in 1Q 2024). The increase in margin was driven by higher revenue. Revenue is forecast to grow 11% p.a. on average during the next 3 years, compared to a 9.4% growth forecast for the Semiconductor industry in Europe. 
