Announcement • 16h
ACM Research, Inc. Maintains Revenue Guidance for the Full Year 2026 ACM Research, Inc. maintained revenue guidance for the full year 2026. The company is maintaining its revenue guidance range of $1.08 billion to $1.175 billion for fiscal year 2026. This expectation is based on ACM management’s current assessment of the continuing impact from international trade policy, together with various expected spending scenarios of key customers, supply chain constraints, and the timing of acceptances for first tools under evaluation in the field, among other factors. Buy Or Sell Opportunity • May 08
Now 22% overvalued after recent price rise Over the last 90 days, the stock has risen 3.4% to €52.10. The fair value is estimated to be €42.86, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 26% over the last 3 years. Earnings per share has grown by 15%. For the next 3 years, revenue is forecast to grow by 19% per annum. Earnings are also forecast to grow by 25% per annum over the same time period. Announcement • Apr 29
ACM Research, Inc., Annual General Meeting, Jun 10, 2026 ACM Research, Inc., Annual General Meeting, Jun 10, 2026. Location: virtualshareholdermeeting.com/acmr2026, United States Announcement • Apr 16
ACM Research, Inc. to Report Q1, 2026 Results on May 07, 2026 ACM Research, Inc. announced that they will report Q1, 2026 results Pre-Market on May 07, 2026 Valuation Update With 7 Day Price Move • Apr 14
Investor sentiment improves as stock rises 21% After last week's 21% share price gain to €43.05, the stock trades at a forward P/E ratio of 25x. Average forward P/E is 27x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €44.46 per share. Announcement • Apr 03
ACM Research, Inc. Introduces ACM Planetary Family Product Portfolio Structure ACM Research, Inc. announced a new branding and organization of its product portfolio into a unified, process-based structure, referred to as the ACM Planetary Family. Under the ACM Planetary Family, ACM’s products are organized into eight distinct families aligned with core process steps across the semiconductor manufacturing flow, collectively referred to as the Eight Planets series. This structure clarifies ACM’s expanding product portfolio, supporting alignment with evolving customer requirements across front-end processing, advanced packaging and related applications. ACM Planetary Family Product Lineup: Earth Series – Cleaning tools, Jupiter Series – Wafer-level advanced packaging tools, Venus Series – Electroplating tools, Mars Series – Furnace tools, Mercury Series – Track tools, Saturn Series – Plasma-enhanced chemical vapor deposition (PECVD) tools, Uranus Series – Panel-level advanced packaging tools, Neptune Series – Stress-free polishing tools. Valuation Update With 7 Day Price Move • Mar 31
Investor sentiment deteriorates as stock falls 18% After last week's 18% share price decline to €32.83, the stock trades at a forward P/E ratio of 19x. Average forward P/E is 24x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €44.03 per share. Buy Or Sell Opportunity • Mar 26
Now 20% undervalued Over the last 90 days, the stock has risen 8.9% to €36.76. The fair value is estimated to be €46.13, however this is not to be taken as a buy recommendation but rather should be used as a guide only. Revenue has grown by 28% over the last 3 years. Earnings per share has grown by 23%. For the next 3 years, revenue is forecast to grow by 18% per annum. Earnings are also forecast to grow by 23% per annum over the same time period. Valuation Update With 7 Day Price Move • Mar 09
Investor sentiment deteriorates as stock falls 17% After last week's 17% share price decline to €40.55, the stock trades at a forward P/E ratio of 22x. Average forward P/E is 26x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €46.57 per share. Reported Earnings • Feb 27
Full year 2025 earnings released: EPS: US$1.47 (vs US$1.67 in FY 2024) Full year 2025 results: EPS: US$1.47 (down from US$1.67 in FY 2024). Revenue: US$901.3m (up 15% from FY 2024). Net income: US$94.1m (down 9.2% from FY 2024). Profit margin: 10% (down from 13% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 14% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe. Announcement • Feb 10
ACM Research, Inc. to Report Q4, 2025 Results on Feb 26, 2026 ACM Research, Inc. announced that they will report Q4, 2025 results Pre-Market on Feb 26, 2026 Valuation Update With 7 Day Price Move • Feb 02
Investor sentiment improves as stock rises 23% After last week's 23% share price gain to €51.94, the stock trades at a forward P/E ratio of 28x. Average forward P/E is 26x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €43.03 per share. Buy Or Sell Opportunity • Feb 01
Now 21% overvalued after recent price rise Over the last 90 days, the stock has risen 29% to €46.41. The fair value is estimated to be €38.45, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 29% over the last 3 years. Earnings per share has grown by 30%. For the next 3 years, revenue is forecast to grow by 14% per annum. Earnings are also forecast to grow by 15% per annum over the same time period. Valuation Update With 7 Day Price Move • Jan 08
Investor sentiment improves as stock rises 15% After last week's 15% share price gain to €40.94, the stock trades at a forward P/E ratio of 23x. Average forward P/E is 25x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €40.89 per share. Buy Or Sell Opportunity • Jan 01
Now 23% overvalued The stock has been flat over the last 90 days, currently trading at €35.47. The fair value is estimated to be €28.89, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 29% over the last 3 years. Earnings per share has grown by 30%. For the next 3 years, revenue is forecast to grow by 14% per annum. Earnings are also forecast to grow by 15% per annum over the same time period. Valuation Update With 7 Day Price Move • Dec 10
Investor sentiment improves as stock rises 16% After last week's 16% share price gain to €32.71, the stock trades at a forward P/E ratio of 18x. Average forward P/E is 19x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €26.86 per share. Buy Or Sell Opportunity • Dec 09
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 34% to €31.91. The fair value is estimated to be €26.49, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 29% over the last 3 years. Earnings per share has grown by 30%. For the next 3 years, revenue is forecast to grow by 15% per annum. Earnings are also forecast to grow by 16% per annum over the same time period. Announcement • Nov 20
ACM Research, Inc. Delivers Advanced Ultra Lith BK Photoresist Hardening Tool with UV Curing and Temperature Uniformity ACM Research, Inc. announced the delivery of its first Ultra Lith Baker ("Ultra Lith BK") system to a leading global display panel manufacturer. The system is engineered to address industry-wide challenges in advanced lithography, including process non-uniformity, thermal drift, and critical dimension ("CD") variation. It can also help semiconductor manufacturers maintain stable yield and pattern fidelity as device geometries continue to shrink. With ultraviolet ("UV") curing uniformity and precision temperature control, the Ultra Lith BK enables highly stable and repeatable lithography processes. The Ultra Lith BK's UV curing system delivers +-5% UV intensity uniformity, ensuring consistent resist hardening across the wafer. The system supports line-scan, rotary, and hybrid UV-curing exposure modes to maximize process flexibility. Its advanced thermal management architecture further reduces CD variation, overlay error, and pattern distortion--all critical to yield improvement and long-term process reliability. The Ultra Lith BK integrates six cold plates delivering temperature uniformity of +-0.1degC. The system adopts a configurable design and can accommodate up to 32 hotplates and two UV curing systems, enabling customers to flexibly configure the tool according to different process recipes and photoresist integration requirements. Two types of hotplates are available: The high-flow hotplate achieves a maximum process temperature of 250degC with temperature uniformity 0.2%. The low-flow hotplate operates at temperatures up to 180degC with temperature uniformity 0.08%, offering benchmark-level performance in the industry. Announcement • Nov 17
ACM Research, Inc. Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging ACM Research, Inc. announced it has delivered the first panel electrochemical plating tool, the Ultra ECP ap-p, to an panel fabrication customer. This achievement underscores ACM's advancement in panel-level electroplating technology and reflects growing market demand for scalable, cost-efficient advanced packaging solutions to meet next generation device requirements. The Ultra ECP ap-p is the first commercial panel-level copper deposition system for the large-panel market, supporting plating steps across pillar, bump, and redistribution layer (RDL) processes. The system achieves panel-processing performance - comparable to traditional round wafer processes, enabling manufacturers to meet demanding device requirements with greater efficiency. The system features ACM proprietary horizontal electroplating technology, and supports copper (Cu), nickel (Ni), tin-silver (SnAg) and a gold (Au) plating. The Cu plating chambers incorporate high-speed plating paddles specifically designed for tall pillar applications, capable of achieving pillar heights exceeding 300 microns. The Ultra ECP ap thep features a four-sided sealing dry contact chuck for improved reliability, in-cell rinse functionality to minimize chemical cross-contamination between different plating cells, and a horizontal electroplating design synchronizing a rotating square electrical field with the rotating chuck for superiorosition uniformity. Reported Earnings • Nov 06
Third quarter 2025 earnings released: EPS: US$0.56 (vs US$0.49 in 3Q 2024) Third quarter 2025 results: EPS: US$0.56 (up from US$0.49 in 3Q 2024). Revenue: US$269.2m (up 32% from 3Q 2024). Net income: US$35.9m (up 16% from 3Q 2024). Profit margin: 13% (down from 15% in 3Q 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 15% p.a. on average during the next 3 years, compared to a 9.3% growth forecast for the Semiconductor industry in Europe. Valuation Update With 7 Day Price Move • Nov 05
Investor sentiment deteriorates as stock falls 24% After last week's 24% share price decline to €27.75, the stock trades at a forward P/E ratio of 19x. Average forward P/E is 22x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €21.91 per share. Announcement • Oct 17
ACM Research, Inc. to Report Q3, 2025 Results on Nov 05, 2025 ACM Research, Inc. announced that they will report Q3, 2025 results Pre-Market on Nov 05, 2025 Buy Or Sell Opportunity • Oct 13
Now 21% overvalued after recent price rise Over the last 90 days, the stock has risen 32% to €33.82. The fair value is estimated to be €27.93, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 32% over the last 3 years. Earnings per share has grown by 34%. For the next 3 years, revenue is forecast to grow by 16% per annum. Earnings are also forecast to grow by 16% per annum over the same time period. Buy Or Sell Opportunity • Sep 23
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 50% to €33.55. The fair value is estimated to be €27.93, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 32% over the last 3 years. Earnings per share has grown by 34%. For the next 3 years, revenue is forecast to grow by 15% per annum. Earnings are also forecast to grow by 15% per annum over the same time period. Valuation Update With 7 Day Price Move • Sep 22
Investor sentiment improves as stock rises 24% After last week's 24% share price gain to €31.19, the stock trades at a forward P/E ratio of 17x. Average forward P/E is 20x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €27.69 per share. Announcement • Sep 19
ACM Research Unveils Ultra ECDP Electrochemical Deplating Tool for Compound Semiconductor Gold Etch Processes ACM Research, Inc. announced the launch of its first Ultra ECDP Electrochemical Deplating tool specifically designed for wide bandgap compound semiconductor manufacturing. The Ultra ECDP tool is engineered for electrochemical wafer-level gold (Au) etching performed outside of the wafer pattern area and delivers improved uniformity, smaller undercut and enhanced gold line appearance. The Ultra ECDP tool offers specialized processes including Au bump removal, thin film Au etching, and deep-hole Au deplating, supported by integrated pre-wet and cleaning chambers. It features precise chemistry circulation and advanced multi-anode electrochemical deplating technology, the system achieves minimized side etching, excellent surface finish, and superior uniformity across all features. The Ultra ECDP tool are engineered to address the evolving requirements of compound semiconductor manufacturing, accommodating the distinct physical characteristics--such as weight, stress, and thickness-- of diverse substrates, including silicon carbide (SiC), gallium arsenide (GaAs), lithium phosphate (Li3PO4) and etc. Featuring a modular design, the Ultra ECDP tool has the flexibility to integrate both plating and deplating processes within a single platform, and utilizes multi-anode technology for controlling deplating in different areas. The Ultra ECDP tool also offers horizontal full-face deplating to prevent cross contamination during processing. The Ultra ECDP Tool: The Ultra ECDP tool is compatible with 6-inch and 8-inch platforms and accommodates 150 millimeter (mm), 159mm and 200mm wafer sizes. The system is configurable with two open cassettes and one vacuum arm, providing adaptability for various manufacturing environments. Announcement • Sep 08
ACM Research, Inc. Delivers High-Throughput Ultra Lith KrF Track System to A Leading Chinese Logic Wafer Fab Customer ACM Research, Inc. announced the launch of its first Ultra Lith KrF track system, designed to support front-end semiconductor manufacturing. The new system expands ACM's lithography product line and delivers high-throughput performance, advanced thermal control, and real-time process control and monitoring. The first system was shipped to a leading Chinese logic wafer fab customer in September 2025. ACM's Ultra Lith KrF track system builds on the proven architecture and process achievements of ACM's ArF track platform, which successfully completed demo-line process verification with a leading Chinese customer in late 2024. That system demonstrated sub-angstrom-level coating uniformity, advanced thermal control, and ASML scanner-aligned CD matching--capabilities that provided the foundation for design optimization in the KrF platform. ACM's Ultra LithKF track system features a flexible process module configuration, including 12 spin coaters and 12 developers (12C12D), supported by 54 hot plates capable of low, mid, and high-temperature processing with thermal uniformity. The system achieves throughput greater than 300 wafers per hour (WPH) and incorporates ACM's proprietary backside particle removal unit (BPRV) technology to minimize cross-contamination risk. In addition, the integrated wafer-scale outlier inspection (WSOI) unit enables real-time process variation detection and yield anomaly monitoring, enhancing process stability and production efficiency. Valuation Update With 7 Day Price Move • Aug 22
Investor sentiment improves as stock rises 25% After last week's 25% share price gain to €27.06, the stock trades at a forward P/E ratio of 14x. Average forward P/E is 22x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €27.31 per share. Announcement • Aug 07
ACM Research, Inc. Maintains Earnings Guidance for the Fiscal Year 2025 ACM Research, Inc. maintained earnings guidance for the fiscal year 2025. For the period, the company expects to maintain its revenue guidance range of $850 million to $950 million for fiscal year 2025. Reported Earnings • Aug 06
Second quarter 2025 earnings released: EPS: US$0.47 (vs US$0.39 in 2Q 2024) Second quarter 2025 results: EPS: US$0.47 (up from US$0.39 in 2Q 2024). Revenue: US$215.4m (up 6.4% from 2Q 2024). Net income: US$29.8m (up 23% from 2Q 2024). Profit margin: 14% (up from 12% in 2Q 2024). The increase in margin was driven by higher revenue. Revenue is forecast to grow 15% p.a. on average during the next 3 years, compared to a 8.5% growth forecast for the Semiconductor industry in Europe. Buy Or Sell Opportunity • Aug 06
Now 23% undervalued Over the last 90 days, the stock has risen 7.3% to €20.64. The fair value is estimated to be €26.97, however this is not to be taken as a buy recommendation but rather should be used as a guide only. Revenue has grown by 32% over the last 3 years. Earnings per share has grown by 34%. For the next 3 years, revenue is forecast to grow by 15% per annum. Earnings are also forecast to grow by 15% per annum over the same time period. Announcement • Jul 25
ACM Research, Inc. Announces Major Upgrades to its Ultra C Wb Wet Bench Cleaning Tool for Advanced Chip Manufacturing ACM Research, Inc. announced major upgrades to its Ultra C wb cleaning tool. These new enhancements are designed to meet the demanding technical requirements of advanced-node manufacturing processes. The upgraded Ultra C wb features a patent-pending nitrogen (N2) bubbling technology to solve poor wet etching uniformity and by-product regrowth. These issues frequently appear in conventional wet bench processes of phosphoric acid in high aspect ratio trenches and via structures in advanced-node processes. ACM's patent-pending N2 bubbling technique enhances the transport efficiency of phosphoric acid and promotes the uniformity of temperature, concentration and flow velocity in wet etching bath. The improved mass transfer efficiency of the wet etching process avoids by-product accumulation in wafer micro-structures to prevent growth. This technology holds significant application potential in the wet etching process for manufacturing 3D DRAM, 3D logic and 500+ layer 3D NAND devices. New Features and Benefits of the Upgraded Ultra C wb Tool: Enhanced Etching Uniformity: Compared to conventional batch processes for wet cleaning, the Ultra C wb platform is equipped with the N2 bubbling technique, improving within-wafer and wafer-to-wafer wet etching uniformity by more than 50%. Enhanced Particle Removal Performance: The Ultra C wb platform's advanced cleaning capabilities have been proven in organic residue removal of special phosphoric acid additives in advanced-node processes. Expanded Process Capabilities: The upgraded bench module is qualified for three layers of advanced-node processes, including: stack silicon nitride removal, channel hole polysilicon etch back and gate line tungsten recess. It is compatible with a variety of chemical solutions, such as phosphoric acid, H4 etchant (a mixed acid solution typically used for metal film etching), tetramethylammonium hydroxide (TMAH), standard clean 1 (SC1) and silicon-germanium (SiGe) etching solution, etc. Additional layers and applications are currently in development at the customer site. Proprietary Design: The nitrogen bubbling technology designs in the patent application generate large-size sizes with good uniformity, while the bubble density can be precisely controlled. The N2 bubbling core technology can be applied to ACM's Ultra C Tahoe (single-wafer and bench combined cleaning tool) platform, effectively addressing customers' future process requirements. Announcement • Jul 18
ACM Research, Inc. to Report Q2, 2025 Results on Aug 06, 2025 ACM Research, Inc. announced that they will report Q2, 2025 results Pre-Market on Aug 06, 2025 Reported Earnings • May 09
First quarter 2025 earnings released: EPS: US$0.32 (vs US$0.28 in 1Q 2024) First quarter 2025 results: EPS: US$0.32 (up from US$0.28 in 1Q 2024). Revenue: US$172.3m (up 13% from 1Q 2024). Net income: US$20.4m (up 17% from 1Q 2024). Profit margin: 12% (in line with 1Q 2024). Revenue is forecast to grow 15% p.a. on average during the next 3 years, compared to a 9.4% growth forecast for the Semiconductor industry in Europe. Announcement • May 01
ACM Research, Inc. Provides Preliminary Unaudited Earnings Guidance for the First Quarter and Re-Affirm Earnings Guidance for the Full Year 2025 ACM Research, Inc. provided preliminary unaudited earnings guidance for the first quarter and re-affirmed earnings guidance for the full year 2025. For the first quarter company expects preliminary unaudited revenue for the first quarter of 2025 is expected to be in the range of $165 million to $170 million, which would represent year-to-year growth of 8.4% to 11.7%.
For the full year company re-affirms revenue outlook in the range of $850 million to $950 million, which would represent year-to-year growth of 9% to 21%. Announcement • Apr 30
ACM Research, Inc., Annual General Meeting, Jun 12, 2025 ACM Research, Inc., Annual General Meeting, Jun 12, 2025. Location: virtualshareholdermeeting.com/acmr2025, United States Board Change • Apr 29
Insufficient new directors No new directors have joined the board in the last 3 years. The company's board is composed of: No new directors. 1 experienced director. 7 highly experienced directors. Member of Advisory Board Lip-Bu Tan was the last director to join the board, commencing their role in 2017. The following issues are considered to be risks according to the Simply Wall St Risk Model: Insufficient board refreshment. 
