CLP Holdings is a dividend paying company with a current yield of 4.66%. Next payment date is on 14th June, 2024 with an ex-dividend date of 31st May, 2024.
Key information
4.7%
Dividend yield
118%
Payout ratio
Industry average yield
5.4%
Next dividend pay date
14 Jun 24
Ex dividend date
31 May 24
Dividend per share
n/a
Earnings per share
HK$2.63
Dividend yield forecast in 3Y
4.9%
Recent dividend updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 2's dividends per share have been stable in the past 10 years.
Growing Dividend: 2's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
CLP Holdings Dividend Yield vs Market
How does 2 dividend yield compare to the market?
Segment
Dividend Yield
Company (2)
4.7%
Market Bottom 25% (HK)
3.1%
Market Top 25% (HK)
7.4%
Industry Average (Electric Utilities)
5.4%
Analyst forecast in 3 Years (2)
4.9%
Notable Dividend: 2's dividend (4.66%) is higher than the bottom 25% of dividend payers in the Hong Kong market (3.07%).
High Dividend: 2's dividend (4.66%) is low compared to the top 25% of dividend payers in the Hong Kong market (7.43%).
Earnings Payout to Shareholders
Earnings Coverage: With its high payout ratio (117.7%), 2's dividend payments are not well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: At its current cash payout ratio (75.4%), 2's dividend payments are covered by cash flows.