CLP Holdings Dividends and Buybacks
Dividend criteria checks 4/6
CLP Holdings is a dividend paying company with a current yield of 4.77%. Next payment date is on 13th December, 2024 with an ex-dividend date of 2nd December, 2024.
Key information
4.8%
Dividend yield
n/a
Buyback Yield
| Total Shareholder Yield | n/a |
| Future Dividend Yield | 4.9% |
| Dividend Growth | 2.4% |
| Next dividend pay date | 13 Dec 24 |
| Ex dividend date | 02 Dec 24 |
| Dividend per share | HK$3.100 |
| Payout ratio | 104% |
Recent dividend and buyback updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 2's dividends per share have been stable in the past 10 years.
Growing Dividend: 2's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| CLP Holdings Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (2) | 4.8% |
| Market Bottom 25% (HK) | 3.3% |
| Market Top 25% (HK) | 8.1% |
| Industry Average (Electric Utilities) | 5.1% |
| Analyst forecast (2) (up to 3 years) | 4.9% |
Notable Dividend: 2's dividend (4.77%) is higher than the bottom 25% of dividend payers in the Hong Kong market (3.3%).
High Dividend: 2's dividend (4.77%) is low compared to the top 25% of dividend payers in the Hong Kong market (8.06%).
Earnings Payout to Shareholders
Earnings Coverage: With its high payout ratio (103.8%), 2's dividend payments are not well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonable cash payout ratio (66.7%), 2's dividend payments are covered by cash flows.