Hua Hong Semiconductor Dividend
Dividend criteria checks 0/6
Hua Hong Semiconductor is a dividend paying company with a current yield of 1.05%. Next payment date is on 26th June, 2024 with an ex-dividend date of 3rd June, 2024.
Key information
1.0%
Dividend yield
11%
Payout ratio
| Industry average yield | 2.7% |
| Next dividend pay date | 26 Jun 24 |
| Ex dividend date | 03 Jun 24 |
| Dividend per share | n/a |
| Earnings per share | HK$0.16 |
| Dividend yield forecast in 3Y | 0.6% |
Recent dividend updates
No updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 1347 is not paying a notable dividend for the Hong Kong market, therefore no need to check if payments are stable.
Growing Dividend: 1347 is not paying a notable dividend for the Hong Kong market, therefore no need to check if payments are increasing.
Dividend Yield vs Market
| Hua Hong Semiconductor Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (1347) | 1.0% |
| Market Bottom 25% (HK) | 3.3% |
| Market Top 25% (HK) | 8.0% |
| Industry Average (Semiconductor) | 2.7% |
| Analyst forecast in 3 Years (1347) | 0.6% |
Notable Dividend: 1347's dividend (1.05%) isn’t notable compared to the bottom 25% of dividend payers in the Hong Kong market (3.29%).
High Dividend: 1347's dividend (1.05%) is low compared to the top 25% of dividend payers in the Hong Kong market (8.07%).
Earnings Payout to Shareholders
Earnings Coverage: 1347 is not paying a notable dividend for the Hong Kong market.
Cash Payout to Shareholders
Cash Flow Coverage: 1347 is paying a dividend but the company has no free cash flows.