LEPU ScienTech Medical Technology (Shanghai) Co., Ltd.

SZSC:2291 Stock Report

Market Cap: HK$5.8b

LEPU ScienTech Medical Technology (Shanghai) Dividends and Buybacks

Dividend criteria checks 1/6

LEPU ScienTech Medical Technology (Shanghai) is a dividend paying company with a current yield of 3.67%.

Key information

3.7%

Dividend yield

-5.6%

Buyback Yield

Total Shareholder Yield-1.9%
Future Dividend Yieldn/a
Dividend Growthn/a
Next dividend pay daten/a
Ex dividend daten/a
Dividend per shareHK$0.616
Payout ratio91%

Recent dividend and buyback updates

Recent updates

Stability and Growth of Payments

Fetching dividends data

Stable Dividend: Too early to tell whether 2291's dividend payments have been stable as they only just started paying a dividend.

Growing Dividend: Too early to tell if 2291's dividend payments are increasing as they only just started paying a dividend.


Dividend Yield vs Market

LEPU ScienTech Medical Technology (Shanghai) Dividend Yield vs Market
How does 2291 dividend yield compare to the market?
SegmentDividend Yield
Company (2291)3.7%
Market Bottom 25% (HK)3.3%
Market Top 25% (HK)8.1%
Industry Average (Medical Equipment)3.4%
Analyst forecast (2291) (up to 3 years)n/a

Notable Dividend: 2291's dividend (3.67%) is higher than the bottom 25% of dividend payers in the Hong Kong market (3.31%).

High Dividend: 2291's dividend (3.67%) is low compared to the top 25% of dividend payers in the Hong Kong market (8.06%).


Earnings Payout to Shareholders

Earnings Coverage: With its high payout ratio (91.4%), 2291's dividend payments are not well covered by earnings.


Cash Payout to Shareholders

Cash Flow Coverage: With its high cash payout ratio (167.3%), 2291's dividend payments are not well covered by cash flows.


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