LEPU ScienTech Medical Technology (Shanghai) Dividend
Dividend criteria checks 1/6
LEPU ScienTech Medical Technology (Shanghai) is a dividend paying company with a current yield of 3.93%.
Key information
3.9%
Dividend yield
130%
Payout ratio
| Industry average yield | 3.4% |
| Next dividend pay date | n/a |
| Ex dividend date | n/a |
| Dividend per share | HK$0.616 |
| Earnings per share | HK$0.44 |
| Dividend yield forecast | n/a |
Recent dividend updates
Recent updates
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: Too early to tell whether 2291's dividend payments have been stable as they only just started paying a dividend.
Growing Dividend: Too early to tell if 2291's dividend payments are increasing as they only just started paying a dividend.
Dividend Yield vs Market
| LEPU ScienTech Medical Technology (Shanghai) Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (2291) | 3.9% |
| Market Bottom 25% (HK) | 3.4% |
| Market Top 25% (HK) | 8.2% |
| Industry Average (Medical Equipment) | 3.4% |
| Analyst forecast (2291) (up to 3 years) | n/a |
Notable Dividend: 2291's dividend (3.93%) is higher than the bottom 25% of dividend payers in the Hong Kong market (3.37%).
High Dividend: 2291's dividend (3.93%) is low compared to the top 25% of dividend payers in the Hong Kong market (8.2%).
Earnings Payout to Shareholders
Earnings Coverage: With its high payout ratio (130.4%), 2291's dividend payments are not well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (255%), 2291's dividend payments are not well covered by cash flows.