Hua Hong Semiconductor is a dividend paying company with a current yield of 1.1% that is well covered by earnings. Next payment date is on 26th June, 2024 with an ex-dividend date of 3rd June, 2024.
Key information
1.1%
Dividend yield
11%
Payout ratio
Industry average yield
1.1%
Next dividend pay date
26 Jun 24
Ex dividend date
03 Jun 24
Dividend per share
n/a
Earnings per share
€0.16
Dividend yield forecast in 3Y
0.7%
Recent dividend updates
No updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 1HH has been paying a dividend for less than 10 years and during this time payments have been volatile.
Growing Dividend: 1HH has only been paying a dividend for 8 years, and since then payments have fallen.
Dividend Yield vs Market
Hua Hong Semiconductor Dividend Yield vs Market
How does 1HH dividend yield compare to the market?
Segment
Dividend Yield
Company (1HH)
1.1%
Market Bottom 25% (DE)
1.7%
Market Top 25% (DE)
4.8%
Industry Average (Semiconductor)
1.1%
Analyst forecast in 3 Years (1HH)
0.7%
Notable Dividend: 1HH's dividend (1.1%) isn’t notable compared to the bottom 25% of dividend payers in the German market (1.65%).
High Dividend: 1HH's dividend (1.1%) is low compared to the top 25% of dividend payers in the German market (4.81%).
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (11.1%), 1HH's dividend payments are thoroughly covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: 1HH is paying a dividend but the company has no free cash flows.