Shenzhen Institute of Building Research Balance Sheet Health
Financial Health criteria checks 2/6
Shenzhen Institute of Building Research has a total shareholder equity of CN¥595.5M and total debt of CN¥542.5M, which brings its debt-to-equity ratio to 91.1%. Its total assets and total liabilities are CN¥1.4B and CN¥788.7M respectively.
Key information
91.1%
Debt to equity ratio
CN¥542.52m
Debt
Interest coverage ratio | n/a |
Cash | CN¥97.45m |
Equity | CN¥595.46m |
Total liabilities | CN¥788.73m |
Total assets | CN¥1.38b |
Recent financial health updates
No updates
Recent updates
Shenzhen Institute of Building Research's (SZSE:300675) Profits May Not Reveal Underlying Issues
Nov 04Shenzhen Institute of Building Research Co., Ltd. (SZSE:300675) Stocks Shoot Up 43% But Its P/E Still Looks Reasonable
Oct 08Returns Are Gaining Momentum At Shenzhen Institute of Building Research (SZSE:300675)
Sep 28Getting In Cheap On Shenzhen Institute of Building Research Co., Ltd. (SZSE:300675) Is Unlikely
Jul 01One Shenzhen Institute of Building Research Co., Ltd. (SZSE:300675) Analyst Just Made A Major Cut To Next Year's Estimates
Apr 11Earnings Troubles May Signal Larger Issues for Shenzhen Institute of Building Research (SZSE:300675) Shareholders
Apr 05Shenzhen Institute of Building Research Co., Ltd. (SZSE:300675) Shares May Have Slumped 26% But Getting In Cheap Is Still Unlikely
Feb 26Financial Position Analysis
Short Term Liabilities: 300675's short term assets (CN¥658.3M) exceed its short term liabilities (CN¥556.1M).
Long Term Liabilities: 300675's short term assets (CN¥658.3M) exceed its long term liabilities (CN¥232.6M).
Debt to Equity History and Analysis
Debt Level: 300675's net debt to equity ratio (74.7%) is considered high.
Reducing Debt: 300675's debt to equity ratio has increased from 46.5% to 91.1% over the past 5 years.
Debt Coverage: 300675's debt is not well covered by operating cash flow (1.9%).
Interest Coverage: Insufficient data to determine if 300675's interest payments on its debt are well covered by EBIT.