HP is a dividend paying company with a current yield of 3.09% that is well covered by earnings. Next payment date is on 2nd October, 2024 with an ex-dividend date of 11th September, 2024.
Key information
3.1%
Dividend yield
36%
Payout ratio
Industry average yield
1.5%
Next dividend pay date
02 Oct 24
Ex dividend date
11 Sep 24
Dividend per share
CHF 1.102
Earnings per share
CHF 3.03
Dividend yield forecast in 3Y
3.5%
Recent dividend updates
Recent updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: HPQ's dividend payments have been volatile in the past 10 years.
Growing Dividend: HPQ's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
HP Dividend Yield vs Market
How does HPQ dividend yield compare to the market?
Segment
Dividend Yield
Company (HPQ)
3.1%
Market Bottom 25% (CH)
1.9%
Market Top 25% (CH)
4.3%
Industry Average (Tech)
1.5%
Analyst forecast in 3 Years (HPQ)
3.5%
Notable Dividend: HPQ's dividend (3.09%) is higher than the bottom 25% of dividend payers in the Swiss market (1.88%).
High Dividend: HPQ's dividend (3.09%) is low compared to the top 25% of dividend payers in the Swiss market (4.28%).
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (35.8%), HPQ's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (34.9%), HPQ's dividend payments are well covered by cash flows.