Announcement • Apr 17
Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026. Announcement • Mar 23
Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield Technology Texas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V). Announcement • Mar 17
Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIA Texas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design. Announcement • Mar 10
Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence Capabilities Texas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available. Announcement • Mar 05
Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026 Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States Recent Insider Transactions • Feb 13
Insider recently sold CHF1.7m worth of stock On the 10th of February, Mark Gary sold around 10k shares on-market at roughly CHF169 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of CHF4.2m more than they bought in the last 12 months. 
