Micro Silicon Electronics Co., Ltd. provides semiconductor backend services in Taiwan, America, rest of Asia, and Europe. The company offers semiconductor testing services comprising CP and FT testing; wafer thinning services consisting of backgrinding and backside metallization, and frontside metallization; and semiconductor packaging services, such as COB and COG dicing, and WLCSP-DPS. It also provides probe card maintenance services. In addition, the company engages in the design, processing, testing, manufacture, and sale of various integrated circuits. Micro Silicon Electronics Co., Ltd. was incorporated in 1987 and is headquartered in Zhunan, Taiwan.