Announcement • May 26

Wiwynn Showcases Next-Generation Datacenter Designs At Computex 2026 with High-Power and Optical Interconnect

Wiwynn announced to showcase its vision of next-generation data center designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans rack-scale AI servers, developed with Wistron, cooling technologies, optical scale-up designs, and high voltage DC (HVDC) power delivery architectures. Powering the AI Factory: Next-Generation AI Compute and Storage Systems: NVIDIA Vera Rubin NVL72: Wiwynn and Wistron are among the first in line with readiness for the fully liquid-cooled, rack-scale platform unifying 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs. Optimized for frontier AI model training, inference and reasoning, the platform delivers up to 10X higher performance per watt through extreme co-design —delivering performance and efficiency for AI factories. AMD Helios rack-scale solution: Built on the OCP ORv3 Open Rack Wide (ORW) specification and powered by AMD Instinct MI400 Series GPUs, 6th gen AMD EPYC CPUs, AMD Pensando networking technologies and the AMD ROCm software stack, this AI platform is purpose-built for demanding workloads. Its open rack design enables power density, streamlined scaling, and simplified serviceability. Wiwynn brings the AMD Helios platform from reference design to production, accelerating open, interoperable AI infrastructure for hyperscale AI deployments. Storage: A storage server prototype providing aggregate high IOPs from 96 liquid-cooled E3.S SSDs, accessed with NVIDIA SCADA, using NVIDIA GPUs capable of saturating the PCIe connections to the drives for GNN and vector databases. Rethinking Power: High Voltage DC (HVDC) Power Distribution: Wiwynn, together with Delta and TE Connectivity (TE), showcases a rack level 800 VDC solution, spanning the power rack, liquid-cooled busbar, and an 800V-to-50V power distribution board (PDB), demonstrating the end-to-end HVDC system integration for high-density AI deployments. Beyond Copper: Optical AI Scale-up with Co-Packaged Optics (CPO): Wiwynn collaborates with Ayar Labs and GUC, to demonstrate a CPO-based optical scale-up rack design, integrating AI ASIC with 2.5D advanced package, TeraPHY optical engines, ELSFP SuperNova remote light sources, advanced fiber routing and optical interconnects. Wiwynn will also highlight its in-house liquid-cooling solution, purpose-built for ELSFP, ensuring reliable in-chassis optical connections. This end-to-end demonstration marks a milestone in transitioning CPO from component-level innovation to hyperscale-ready deployment. Breaking Thermal Barriers: Advanced Cooling innovation: 6kW Double-sided Cold Plate with Liquid Metal TIM: Designed to support AI ASICs up to 6kW, this double-sided liquid cooling solution integrates cavity PCB architecture to support Vertical Power Delivery (VPD), shorten power delivery paths and improve power delivery efficiency by more than 80% in a compact environment. With Liquid Metal TIM reducing silicon-to-cold plate temperature differentials, the solution delivers over 30% gains in thermal efficiency. Diamond Composite Cooling: Wiwynn pushes material science boundaries with diamond composite, a thermal material offering thermal conductivity and a weight advantage over copper. Demonstrated in a microchannel cold plate design, diamond composite enhances cooling performance, addressing both thermal and structural challenges in high-density AI deployments, while unlocking potential for future IC package-level cooling applications.

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Wiwynn Unveils Co-Packaged Optics Interconnect Technologies at Computex 2026

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Wiwynn Showcases Next-Generation Datacenter Designs At Computex 2026 with High-Power and Optical Interconnect

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