Shanghai Biren Technology Co., Ltd. operates as a graphics processing unit (GPU) developer that researches and develops general computing systems. The company’s products include Wall-Sharpening 166L, a cold-plate liquid-cooled OAM module; Wall-Sharpening 166M, a 4U OAM V1.1 air-cooled module; Wall-Sharpening 166C, a full-height and full-length, dual-width PCIe card; Wall-Sharpening 106M, an air-cooled OAM module; and Wall-Sharp 106B, a full-height, full-length, dual-width PCIe board. The company also provides the BR100 chip, a 7-nanometer graphics processing unit, and BIRENSUPA, a software development platform, including a hardware abstraction layer, the original BIRENSUPA programming model and the BRCC compiler, deep learning and general computing acceleration libraries, and tool chains. It serves the artificial intelligence, cloud computing, graphics rendering, and big data processing industries. The company was founded in 2019 and is based in Shanghai, China.