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Resonac Holdings Corporation Stock Price

TSE:4004 Community·JP¥2.7t Market Cap
  • 3 Narratives written by author
  • 0 Comments on narratives written by author
  • 2 Fair Values set on narratives written by author

4004 Share Price Performance

JP¥14,505.00
10804.00 (291.92%)
JP¥20,533.33
Fair Value
JP¥14,505.00
10804.00 (291.92%)
29.4% undervalued intrinsic discount
JP¥20,533.33
Fair Value
Price JP¥14,505.00
AnalystConsensusTarget JP¥20,533.33
AnalystLowTarget JP¥9,388.21
AnalystHighTarget JP¥24,580.00

4004 Community Narratives

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Fair Value JP¥20.53k 29.4% undervalued intrinsic discount

4004: Future Consortium Developments Will Limit Near-Term Upside Potential

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Fair Value JP¥9.39k 54.5% overvalued intrinsic discount

Sustainability Trends Will Increase Costs But Spur Efficiency Gains

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Fair Value JP¥24.58k 41.0% undervalued intrinsic discount

Electrification And Digital Data Will Boost Advanced Materials

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JP¥20.53k
29.4% undervalued intrinsic discount
Revenue
2.38% p.a.
Profit Margin
11.82%
Future PE
25.82x
Price in 2029
JP¥24.13k
JP¥9.39k
54.5% overvalued intrinsic discount
Revenue
-2.78% p.a.
Profit Margin
11.96%
Future PE
13.62x
Price in 2029
JP¥11.02k

Trending Discussion

No trending discussion available.

Updated Narratives

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4004: Semiconductor Upside And Index Inclusions Will Support Stronger Earnings Expectations

Fair Value: JP¥20.53k 29.4% undervalued intrinsic discount
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4004: Index Additions And Buybacks Will Support Back End Semiconductor Focus

Fair Value: JP¥24.58k 41.0% undervalued intrinsic discount
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4004: Rising Semiconductor Earnings Expectations Will Likely Outrun Future Margin Reality

Fair Value: JP¥9.39k 54.5% overvalued intrinsic discount
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Snowflake Analysis

Moderate growth potential with acceptable track record.

2 Risks
2 Rewards

Resonac Holdings Corporation Key Details

JP¥1.3t

Revenue

JP¥992.0b

Cost of Revenue

JP¥341.9b

Gross Profit

JP¥306.3b

Other Expenses

JP¥35.6b

Earnings

Last Reported Earnings
Mar 31, 2026
Next Reporting Earnings
Aug 06, 2026
189.63
25.63%
2.67%
127.5%
View Full Analysis

About 4004

Founded
1939
Employees
21525
CEO
Hidehito Takahashi
WebsiteView website
www.resonac.com

Resonac Holdings Corporation operates as a chemical company in Japan and internationally. It operates through the Semiconductor and Electronic Materials, Mobility, Innovation Enabling Materials, Chemicals, and Crasus Chemical segments. The company offers gases and solvents, abatement equipment systems and surface treatments, CMP slurries, and anti-charging materials; semiconductor-related materials, display and sensor-related materials, and films; base and photosensitive materials for PWBs; hard disks, SiCs, and optical semiconductors for use as electronic device components; and molded plastics/sheet-formed, powder metal, and aluminum products for automotives. It provides lithium-ion batteries and mechanical carbon; ceramics, resins, cosmetic ingredients, monomers, adhesives, tapes, and chromatography products; industrial gases, and elastomers. In addition, the company offers polyimides; HD media; friction materials; plastic molded; aluminum gravity casting products; packaging/containers; electrical insulating epoxy resin molded products; zipper bags and tapes; titanium oxide and alumina; and elastic polishing grindstone. Further, it provides petrochemical and organic chemicals; polypropylene and polyethylene; liquefied carbon dioxide, dry ice, and gas-related equipment; liquefied oxygen, nitrogen, and argon; molecular sieve; graphite electrodes; plasters, fireproofing pipes, and wall sidings; cement and moisture removal sheets; industrial materials; and FRP, coated sand, and separating mediums. Additionally, the company engages in leasing personnel computers and other business equipment; outsourcing of salary, welfare, and finance-related business; and synthesis, analysis, and SDS preparation services. The company was formerly known as Showa Denko K.K. and changed its name to Resonac Holdings Corporation in January 2023. The company was incorporated in 1939 and is headquartered in Tokyo, Japan.

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