Key Takeaways Surging AI and technology adoption boosts demand for Amtech's advanced packaging equipment, with new products and recurring revenue streams supporting growth and margin expansion. Cost reductions and a flexible manufacturing model enhance profitability, while strong cash flow enables continued R&D investment and strategic growth.Read more
Amtech Systems, Inc., together with its subsidiaries, manufactures and sells capital equipment and related consumables for use in fabricating silicon carbide, silicon power devices, digital and analog devices, power electronic and semiconductor packages, and electronic assemblies in the United States, Canada, Mexico, China, Malaysia, Taiwan, the Czech Republic, Austria, Germany, and internationally. It operates through Thermal Processing Solutions and Semiconductor Fabrication Solutions segments. The company offers thermal processing equipment for use in solder reflow operations for advanced semiconductor packaging and electronics assembly; high-temperature belt furnaces for use in producing power semiconductor packaging substrates and electronic components; and horizontal diffusion furnaces for use in wafer processing. It also provides double-sided wafer cleaning systems, entegrity head testers, substrate carriers, substrate polishing templates, substrate process chemicals, wafer processing lubricants, and coolants under the Entrepix, PR Hoffman, and Intersurface Dynamics brands. The company sells its products to semiconductor substrate, device, electronic assembly, and module manufacturers through sales personnel and a network of independent sales representatives and distributors. Amtech Systems, Inc. was incorporated in 1981 and is headquartered in Tempe, Arizona.
