Aankondiging • 15h
Ambarella Reportedly in Talks to Be Acquired by NXP Semiconductors NXP Semiconductors N.V. (NasdaqGS:NXPI) is in discussions to acquire Ambarella, Inc. (NasdaqGS:AMBA), a chip designer focused on AI-enabled chips for camera technology in self-driving cars, the Financial Times reported on Friday. The talks between the two companies are ongoing, though a transaction is not certain, the report said. Other buyers could emerge or the discussions could fall through entirely. The potential acquisition would strengthen NXP's automotive chip business, which is expected to represent roughly half of the company's $15.1 billion in revenue this year. Ambarella produces image-processing semiconductors used in security cameras and self-driving car systems. The deal would come during a period of consolidation in the semiconductor industry as chip suppliers prepare for the AI revolution. Texas Instruments agreed to buy Silicon Labs for $7.5 billion earlier this year, while SoftBank acquired Ampere Computing for $6.5 billion last year. Reported Earnings • Jul 29
Second quarter 2026 earnings released: EPS: US$3.04 (vs US$1.76 in 2Q 2025) Second quarter 2026 results: EPS: US$3.04 (up from US$1.76 in 2Q 2025). Revenue: US$3.50b (up 20% from 2Q 2025). Net income: US$767.0m (up 72% from 2Q 2025). Profit margin: 22% (up from 15% in 2Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 8.9% p.a. on average during the next 3 years, compared to a 14% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has fallen by 5% per year but the company’s share price has increased by 2% per year, which means it is well ahead of earnings. Aankondiging • Jul 29
Nnxp Semiconductors N.V. Provides Earnings Guidance for the Third Quarter of 2026 NXP Semiconductors N.V. provided earnings guidance for the third quarter of 2026. For the quarter, the company expected total revenue to be $3,650 million to $3,850 million. Operating Income to be $1,137 million to $1,272 million. Earnings Per Share - diluted to be $3.21 to $3.64. Valuation Update With 7 Day Price Move • Jun 29
Investor sentiment deteriorates as stock falls 17% After last week's 17% share price decline to €237, the stock trades at a forward P/E ratio of 19x. Average forward P/E is 42x in the Semiconductor industry in Germany. Total returns to shareholders of 32% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €228 per share. Aankondiging • Jun 26
NXP Semiconductors N.V. Announces Executive Changes NXP Semiconductors N.V. announced that Jeff Palmer, Senior Vice President of Investor Relations, decided to retire following a distinguished 16-year career with the company. Following Jeff's retirement, Mike Lucarelli will serve as Senior Vice President of Investor Relations. Mike will report to Bill Betz, Chief Financial Officer, serving as a key liaison to the investment community. Mike Lucarelli was most recently the Global Head of FP&A and Corporate Finance at Uber. His extensive background includes a decade at Analog Devices, where he served as Head of Investor Relations and oversaw the FP&A organization, along with seven years as a sell-side analyst covering semiconductors. Mike Lucarelli will formally step into the Investor Relations role as of the third quarter 2026 earnings cycle. Jeff Palmer will continue as an advisor to the company through the fourth quarter 2026 earnings cycle in early 2027. Declared Dividend • Jun 16
First quarter dividend of US$1.01 announced Shareholders will receive a dividend of US$1.01. Ex-date: 24th June 2026 Payment date: 9th July 2026 Dividend yield will be 1.3%, which is higher than the industry average of 1.1%. Sustainability & Growth Dividend is well covered by both earnings (39% earnings payout ratio) and cash flows (40% cash payout ratio). The dividend has increased by an average of 19% per year over the past 8 years and payments have been stable during that time. EPS is expected to grow by 52% over the next 3 years, which should provide support to the dividend and adequate earnings cover. Aankondiging • Jun 11
NXP Semiconductors N.V. Approves Interim Cash Dividend on Ordinary Share for the Second Quarter of 2026, Payable on July 9, 2026 NXP Semiconductors N.V. announced that on June 11, 2026, the Board approved the payment of an interim cash dividend of $1.014 per ordinary share for the second quarter of 2026. The interim dividend will be paid on July 9, 2026 to shareholders of record as of June 24, 2026. Board Change • Jun 01
Insufficient new directors There is 1 new director who has joined the board in the last 3 years. The company's board is composed of: 1 new director. 7 experienced directors. 2 highly experienced directors. CEO, President & Executive Director Rafael Sotomayor was the last director to join the board, commencing their role in 2025. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Buy Or Sell Opportunity • May 26
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 42% to €283. The fair value is estimated to be €236, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 3.2% over the last 3 years. Earnings per share has declined by 7.9%. For the next 3 years, revenue is forecast to grow by 9.0% per annum. Earnings are also forecast to grow by 14% per annum over the same time period. Aankondiging • May 01
Nnxp Semiconductors N.V. Provides Earnings Guidance for the Second Quarter of 2026 NXP Semiconductors N.V. provided earnings guidance for the second quarter of 2026. For the quarter, the company expected total revenue to be $3,350 million to $3,550 million. Gross Profit to be $1,892 million to $2,043 million. Operating Income to be $948 million to $1,079 million. Earnings Per Share - diluted to be $2.60 to $2.80. Aankondiging • Apr 21
NXP Semiconductors N.V., Annual General Meeting, Jun 10, 2026 NXP Semiconductors N.V., Annual General Meeting, Jun 10, 2026. Location: high tech campus 60, eindhoven, Netherlands Aankondiging • Mar 13
NXP Semiconductors N.V. Approves Interim Dividend for the First Quarter of 2026, Payable in Cash on April 9, 2026 NXP Semiconductors N.V. announced that its board of directors has approved the payment of an interim dividend. The actions are based on the continued and significant strength of the NXP capital structure, and the board’s confidence in the company’s ability to drive long-term growth and strong cash flow. The board of directors has approved the payment of an interim dividend of $1.014 per ordinary share for the first quarter of 2026. The interim dividend will be paid in cash on April 9, 2026, to shareholders of record as of March 25, 2026. Aankondiging • Mar 10
NXP Semiconductors N.V. Announces IMX 93W Applications Processor NXP Semiconductors N.V. announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. The i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications. NXP’s new i.MX 93W addresses this need by integrating scalable edge compute, AI acceleration, and secure wireless connectivity in a single package, supported by NXP’s software, eIQ AI enablement and pre-certified reference designs. The highly integrated i.MX 93W SoC also allows customers to rapidly scale physical AI across healthcare devices, smart building controllers, industrial gateways, energy infrastructure monitors and smart home hubs. The i.MX 93W applications processor combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. This eliminates the need for up to 60 discrete components, significantly reducing board area, design and supply chain complexity and system-level costs. The i.MX 93W features a dual-core Arm CortexA55 applications processor with a dedicated Arm Ethos NPU capable of up to 1.8 eTOPs. The integrated IW610 tri-radio combines Wi-Fi 6, Bluetooth Low Energy, and 802.15.4 connectivity supporting Matter and Thread deployments. This eliminates complex RF tuning steps and coexistence challenges that traditionally slow development and certification, speeding time-to-market. The i.MX 93W SoC integrates an EdgeLock Secure Enclave (Advanced Profile), addressing regulatory requirements, including European Cyber Resilience Act (CRA). The embedded EdgeLock Secure Enclave is a hardware root of trust simplifying implementation of security-critical functions like secure boot, secure update, device attestation and secure device access. Combined with NXP’s EdgeLock 2GO key management services, OEMs can securely provision i.MX 93W SoC-based products at device manufacturing or in the field. NXP’s pre-certified i.MX 93W SoC-based single and dual-antenna reference designs minimize RF tuning effort and eliminating many common integration challenges. Certified across multiple countries and regions, these reference designs reduce the complexity, cost and risk traditionally associated with RF design and wireless certification. By leveraging validated antenna options and pre-approved designs, customers can shorten regulatory approval timelines, reduce development cost, and bring products to market faster. The i.MX 93W is expected to begin sampling in 2H 2026. Aankondiging • Feb 11
NXP Semiconductors N.V. Announces Executive Changes, Effective June 30, 2026 On February 4, 2026, Ms. Jennifer Wuamett, EVP, General Counsel, Secretary and Chief Sustainability Officer of NXP Semiconductors N.V. (the “Company”), provided notice that she would voluntarily retire as General Counsel and Secretary of the Company on June 30, 2026. Mr. Michael Hoffmann, currently serving as SVP, Chief Commercial Counsel and Deputy General Counsel, will be appointed as General Counsel upon Ms. Wuamett’s retirement from the General Counsel role. Ms. Wuamett will continue to serve as Chief Sustainability Officer and as a strategic advisor to the CEO through the termination of her employment on December 31, 2026. Aankondiging • Jan 07
NXP Semiconductors N.V. Advances Edge AI Leadership with New eIQ Agentic AI Framework NXP Semiconductors N.V. announced its new eIQ Agentic AI Framework, advancing its leadership in secure, real-time edge AI. This new tool enables autonomous agentic intelligence directly on edge devices, allowing both expert and novice device developers to simplify and accelerate agentic AI development, orchestration and deployment. When combined with NXP's secure edge AI hardware, the eIQ Agentic AI Framework provides a trusted foundation to rapidly prototype and deploy optimized, secure, autonomous AI systems at the edge. As agentic AI becomes essential for next-generation automation, the new eIQ Agentic AI framework is one of the first solutions to enable agentic AI development at the edge, delivering low-latency performance, built-in security and resilience to accelerate innovation. Using the eIQ Agentic AI framework, expert developers can integrate sophisticated, multi-agent workflows into existing toolchains, while novice developers can quickly build functional edge-native agentic systems without requiring deep technical experience. This is essential for robotics, industrial automation, smart buildings, transportation, and other real time systems. Security at the Forefront of AI Design AI solutions offer new pathways for malicious actors to cause harm, and security must be considered at every layer of design. Designed with security in mind, NXP's eIQ Agentic AI Framework will include features to prevent prompt injection attacks, adversarial inputs, model spoofing and more. By bridging these software-level protections with the advanced security of NXP's edge intelligence hardware, such as secure boot, runtime isolation zones, and a hardware root of trust, NXP enables secure deployment where data integrity, safety, and resilience are critical.otype Faster with eIQ AI Hub and eIQ AI Toolkit in the Cloud. NXP has also introduced its new eIQ AI Hub, a cloud-based developer platform offering immediate cloud access to edge AI development tools. Developers can prototype faster with access to the latest tools and capabilities instantly, including deploying on cloud-connected hardware boards for real performance reporting, while still retaining the option for on-premise deployment. Aankondiging • Jan 06
NXP Semiconductors N.V. Unlocks the Full Potential of SDVs NXP Semiconductors N.V. unveiled the S32N7 super-integration processor series, building on the same 5 nm foundation as the S32N55, to enable a new era where carmakers can digitalize the core functions of every vehicle - propulsion, vehicle dynamics, body, gateway and safety domains - cutting complexity and unlocking AI-powered innovation at scale. The S32N7 series is engineered to consolidate software and data into a single centralized hub at the core of the vehicle, with uncompromising safety and security. The new processor series empowers carmakers to greatly simplify vehicle architectures and reduce total cost of ownership by as much as 20%, achieved through the elimination of dozens of hardware modules, and enhanced efficiencies in wiring, electronics and software. By centralizing intelligence, automakers gain a foundation to scale AI-driven innovation across the entire vehicle. This accelerates software business models and enables intelligent features such as personalized driving, predictive maintenance, and virtual sensors. A high-performance data backbone on the S32N7 series ensures a future-proof path for upgrading to the latest AI silicon without re-architecting the vehicle, allowing automakers to continually differentiate. Designed for the software-defined future, the S32N7 redefines vehicle architectures by digitalizing the core functions of the vehicle, enabling scalable hardware and software across models and brands. Centralizing software accelerates development and reduces total cost of ownership. With access to core vehicle data and high compute performance, the S32N7 series becomes the central AI control point for next-generation mobility. Bosch is the first to deploy the S32N7 in its vehicle integration platform. Together, NXP and Bosch have co-developed reference designs, safety frameworks, hardware integration, and an expert enablement program, accelerating system deployment and reducing integration effort for early adopters. The S32N7 Series offers a scalable portfolio with 32 compatible variants, delivering application and real-time compute with high-performance networking, hardware isolation technology, AI and data acceleration on a system-on-chip (SoC), while meeting the strict timing, safety, and security requirements of the vehicle core. It is a key element of NXP's S32 automotive processing platform, designed to accelerate the shift toward intelligent, next-generation vehicles. The S32N79, the superset of the series, is sampling now with customers. Please visit the S32N7 product page and the NXP Smarter World Blog for more information. Aankondiging • Nov 20
NXP Semiconductors Announces Quarterly Dividend, Payable on January 7, 2026 As part of its ongoing capital return program, NXP Semiconductors N.V. announced that its board of directors has approved the payment of an interim dividend. The actions are based on the continued and significant strength of the NXP capital structure, and the board’s confidence in the company’s ability to drive long-term growth and strong cash flow. The board of directors has approved the payment of an interim dividend of $1.014 per ordinary share for the fourth quarter of 2025. The interim dividend will be paid in cash on January 7, 2026, to shareholders of record as of December 10, 2025. Aankondiging • Aug 29
Nxp Semiconductors N.V. Approves Interim Dividend for Third Quarter of 2025, Payable on October 8, 2025 NXP Semiconductors N.V. announced that its board of directors has approved the payment of an interim dividend. The board of directors has approved the payment of an interim dividend of $1.014 per ordinary share for the third quarter of 2025. The interim dividend will be paid in cash on October 8, 2025, to shareholders of record as of September 17, 2025. Board Change • Aug 18
Insufficient new directors There is 1 new director who has joined the board in the last 3 years. The company's board is composed of: 1 new director. 7 experienced directors. 2 highly experienced directors. Independent Non-Executive Director Moshe N. Gavrielov was the last director to join the board, commencing their role in 2023. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Aankondiging • Jul 22
NXP Semiconductors N.V. Provides Earnings Guidance for the Third Quarter of 2025 NXP Semiconductors N.V. provided earnings guidance for the third quarter of 2025. for the quarter, the company expects Total Revenue in the range of $3,050 million to $3,250 million ($3,150 million midpoint), Operating Income in the range of $818 million to $944 million ($881 million midpoint) and Earnings Per Share - diluted in the range of $2.22 to $2.62 ($2.42 midpoint). Aankondiging • Jun 12
NXP Semiconductors N.V. Approves the Payment of an Interim Dividend for the Second Quarter of 2025, Payable on July 9, 2025 On June 12, 2025, NXP Semiconductors N.V. approved the payment of an interim dividend of $1.014 per ordinary share for the second quarter of 2025. The interim dividend will be paid on July 9, 2025 to shareholders of record as of June
25, 2025. Aankondiging • May 08
NXP Semiconductors N.V. Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving NXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP's proven expertise in the imaging radar space. The third generation of imaging radar processors delivers up to twice the processing power versus the previous generation, alongside improved system cost and power efficiency. In combination with NXP's mmWave radar transceivers, power management and in-vehicle networking solutions, the S32R47 family meets functional safety ASIL ISO 26262 ASIL B(D) requirements and prepares the automotive industry for new levels of autonomous driving. According to Yole Intelligence's Status of the Radar Industry 2024 report, by 2029, approximately 40% of vehicles entering the road will be passenger cars with driving automation Level 2+L2+)/Level 3 (L3) as well as an increasing number of vehicles with Level 4 (L4). To serve the fast-growing autonomous driving market for SDVs, automotive OEMs and tier 1 suppliers need to improve radar performance as it is essential for safe, advanced autonomy features such as piloted driving or fully automated parking. Imaging radar leverages richer point cloud data for more detailed modeling of the environment. This is a key enabler for AI based perception systems which allow for assisted and autonomous driving in the most challenging environmental conditions, such as complex urban scenarios. The S32R47 integrates a high-performance multi-core radar processing system, allowing denser point cloud output and enhanced algorithms that enable next-generation ADAS systems. This results in better separability of objects, improved detection reliability and more accurate classification of objects such as vulnerable road users or lost cargo. NXP's 3rd generation imaging radar solutions: Built on know-how and the proven technology of two previous generations, the new solution delivers up to 2x processing performance in the radar MPU in a 38% smaller IC footprint. It also includes AI/ML support for features like enhanced Direction of Arrival (DoA) processing and object classification; NXP's next generation imaging radar solutions enable new imaging radars with optimized bill of material and increased scalability in terms of antenna channels and processing capability; NXP's solution achieves comparable or better performance with up to 89% less antenna channels than alternative solutions, solving integration challenges with reduced system cost, size and power consumption. Aankondiging • Apr 30
NXP Semiconductors N.V., Annual General Meeting, Jun 11, 2025 NXP Semiconductors N.V., Annual General Meeting, Jun 11, 2025. Location: the sheraton amsterdam airporthotel, conference center, schiphol boulevard 101, 1118 bg, netherlands, amsterdam United States Aankondiging • Mar 11
NXP Semiconductors N.V. Unveils New S32K5 Family of Automotive Microcontrollers NXP Semiconductors N.V. unveiled its new S32K5 family of automotive microcontrollers (MCU), the automotive industry's first 16nm FinFET MCU with embedded magnetic RAM (MRAM). The S32K5 MCU family will extend the NXP CoreRide platform with pre-integrated zonal and electrification system solutions for scalable software-defined vehicle (SDV) architectures. Automakers are embracing zonal architectures with diverse approaches to the distribution and integration of electronic control unit (ECU) functions. NXP's new S32K5 family features Arm®? Cortex®? CPU cores running up to 800 MHz and offers power-efficient application performance, enabled by the 16nm FinFET process. Optimized accelerators are available to boost key workloads, including network translation, security and digital signal processing. The integrated Ethernet switch core, common with NXP's S32N family of automotive processors, brings a proven networking solution that streamlines network design and enables software re-use. Working with the Synopsys virtualizer development kit (VDK) to port EB tresos AutoCore OS and full Classic AUTOSAR stack, Elektrobit is proud to play a dynamic part in fully utilizing the NXP CoreRide platforms. With the EB tresos port to the VDK, products will not only be available for the first samples faster, but also NXP's K5 customers will be able to start their application development sooner. Aankondiging • Mar 06
NXP Semiconductors N.V. Announces Quarterly Dividend, Payable on April 9, 2025 NXP Semiconductors N.V. approved the payment of an interim dividend of $1.014 per ordinary share for the first quarter of 2025. The interim dividend will be paid in cash on April 9, 2025, to shareholders of record as of March 19, 2025. Aankondiging • Feb 10
NXP Semiconductors N.V. (NasdaqGS:NXPI) entered into a definitive agreement to acquire Kinara, Inc. for approximately $310 million. NXP Semiconductors N.V. (NasdaqGS:NXPI) entered into a definitive agreement to acquire Kinara, Inc. for approximately $310 million on February 10, 2025. The acquisition will be an all-cash transaction valued at $307 million. The acquisition will enhance NXP’s ability to provide complete and scalable AI platforms from TinyML to generative AI by integrating discrete NPUs and robust AI software into its portfolio of processors, connectivity, security, and advanced analog solutions, the combined innovations of NXP and Kinara will be on display at Embedded World 2025 in Nuremberg. The transaction is expected to close in the first half of 2025, subject to customary closing conditions, including regulatory clearances. Aankondiging • Nov 22
NXP Semiconductors N.V. Announces Interim Dividend for the Fourth Quarter of 2024, Payable on January 8, 2025 The board of directors of NXP Semiconductors N.V. has approved the payment of an interim dividend of $1.014 per ordinary share for the fourth quarter of 2024. The interim dividend will be paid in cash on January 8, 2025, to shareholders of record as of December 5, 2024. Aankondiging • Nov 13
MathWorks and NXP Unveil Model-Based Design Toolbox for Battery Management Systems MathWorks and NXP Semiconductors announced the availability of the Model-Based Design Toolbox (MBDT) for Battery Management Systems (BMS). The toolbox enables engineers to model, develop, and validate BMS applications in MATLAB and Simulink®, automate C code generation from MATLAB for NXP Battery Cell controllers, and also support NXP’s software solution, the BMS SDK components. BMS is crucial for EVs as it ensures the optimal performance, durability, and safety of the battery packs that power these advanced vehicles. The BMS design process increasingly relies on modeling and simulation to fine-tune algorithms tailored to EVs' specific battery cell types and battery pack configuration. Model-Based Design enables the efficient design of the BMS algorithms, providing a means to test them in simulation for different scenarios, such as driving habits, environmental conditions, and fault occurrences. MBDT for BMS makes it easy for engineers to transition directly from Simulink models to running and testing their BMS algorithms on an NXP processor. This capability simplifies the BMS development process and accelerates the prototyping and testing phases. The MBDT for BMS solution bridges the gap between theoretical design and practical application. Engineers can directly implement their Simulink BMS models onto NXP processors without any manual coding, thereby preserving the integrity and efficiency of their original algorithms. In addition, the MBDT BMS product features integrated Input/Output (IO) connectivity. This functionality allows engineers to perform dynamic, real-world testing on their BMS systems, providing immediate feedback from early hardware prototypes and insights into system performance under various conditions. This level of testing is critical for ensuring the reliability and safety of BMS solutions in real-world scenarios. Reported Earnings • Nov 06
Third quarter 2024 earnings released: EPS: US$2.82 (vs US$3.06 in 3Q 2023) Third quarter 2024 results: EPS: US$2.82 (down from US$3.06 in 3Q 2023). Revenue: US$3.25b (down 5.4% from 3Q 2023). Net income: US$718.0m (down 8.8% from 3Q 2023). Profit margin: 22% (in line with 3Q 2023). Revenue is forecast to grow 5.1% p.a. on average during the next 3 years, compared to a 7.7% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 15% per year but the company’s share price has only increased by 2% per year, which means it is significantly lagging earnings growth. Aankondiging • Nov 05
NXP Semiconductors N.V. Provides Earnings Guidance for the Fourth Quarter of 2024 NXP Semiconductors N.V. provided earnings guidance for the fourth quarter of 2024. For the quarter, the company expects total revenue in the low range of $3,000 million, mid-range of $3,100 million and high range of $3,200 million; Operating Income of low range of $810 million, mid-range of $872 million and high range of $936 million; Earnings Per Share - diluted of low range of $2.26, mid-range of $2.46 and high-range of $2.66. Aankondiging • Oct 15
NXP Semiconductors N.V. Introduces the New S32j Family of High-Performance Ethernet Switches and Network Controller NXP Semiconductors N.V. has introduced the new S32J family of high-performance Ethernet switches and network controllers. The S32J family shares a common switch core, NXP NETC, with NXP's latest S32 microcontrollers and processors, allowing them to operate together as one expanded virtual switch. The common networking switch core simplifies integration and software re-use with other solutions within the recently announced NXP CoreRide platform and offers OEMs more efficient and re-configurable networking choices. The S32J provides 80Gbps bandwidth with ports ranging from 10Mb to 10Gb, and powerful dual Arm Cortex-R52 cores to address diverse requirements of new vehicle architectures. The S32J devices meet time-sensitive networking (TSN) automotive standards and provide robust ASIL-D safety, hardware security engine (HSE) and MACsec ports for mixed-critical data traffic. The combination of the S32J family with the NXP CoreRide platform provides production-grade networking solutions with pre-integrated software and tooling. The solutions include a complete software enablement kit for HSE and MACsec security, TSN stacks and remote configuration and monitoring capabilities. A virtual development kit for the S32J family will be available by the end of 2024. The solution will be available to OEMs and Tier-1 suppliers in 2025. The building blocks for SDV networks. The NXP CoreRide platform marks a major step forward in helping automakers overcome software and hardware integration barriers, while scaling development efforts for new architectures in software-defined vehicles. The platform integrates NXP's S32 compute, networking and system power management with middleware, OSes and other software from the world's leading automotive software providers, including Accenture ESR Labs, ArcherMind, BlackBerry QNX, Elektrobit, ETAS, Green Hills Software, Sonatus, Synopsys, TTTech Auto, Vector Informatik GmbH, and Wind River, Tier-1 suppliers like Valeo, as well as integration service providers like Valeo, as well As integration service providers like Valeo and M&A. The S32J family will also offer OEMs more efficient and re - re-configurable networking choices, and offers OEMs more efficient, re-configurable networking choices". Declared Dividend • Sep 02
Second quarter dividend of US$1.01 announced Shareholders will receive a dividend of US$1.01. Ex-date: 12th September 2024 Payment date: 9th October 2024 Dividend yield will be 1.7%, which is higher than the industry average of 1.1%. Sustainability & Growth Dividend is well covered by both earnings (37% earnings payout ratio) and cash flows (37% cash payout ratio). The dividend has increased by an average of 26% per year over the past 6 years and payments have been stable during that time. EPS is expected to grow by 42% over the next 3 years, which should provide support to the dividend and adequate earnings cover. Aankondiging • Aug 30
NXP Semiconductors Announces Quarterly Dividend, Payable on October 9, 2024 NXP Semiconductors N.V. has approved the payment of an interim dividend of $1.014 per ordinary share for the third quarter of 2024. The interim dividend will be paid in cash on October 9, 2024, to shareholders of record as of September 12, 2024. Reported Earnings • Jul 24
Second quarter 2024 earnings released: EPS: US$2.58 (vs US$2.69 in 2Q 2023) Second quarter 2024 results: EPS: US$2.58 (down from US$2.69 in 2Q 2023). Revenue: US$3.13b (down 5.2% from 2Q 2023). Net income: US$658.0m (down 5.7% from 2Q 2023). Profit margin: 21% (in line with 2Q 2023). Revenue is forecast to grow 6.5% p.a. on average during the next 3 years, compared to a 8.3% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 23% per year but the company’s share price has only increased by 13% per year, which means it is significantly lagging earnings growth. Aankondiging • Jul 23
NXP Semiconductors N.V. Provides Earnings Guidance for the Third Quarter of 2024 NXP Semiconductors N.V. provided earnings guidance for the third quarter of 2024. The company expects total revenue in the low range of $3,150 million, mid-range of $3,250 million and high range of $3,350 million; Operating Income of low range of $906 million, mid-range of $970 million and high range of $1,036 million; Earnings Per Share - diluted of low range of $2.60, mid-range of $2.80 and high-range of $3.01. Buy Or Sell Opportunity • Jun 14
Now 22% undervalued Over the last 90 days, the stock has risen 17% to €255. The fair value is estimated to be €327, however this is not to be taken as a buy recommendation but rather should be used as a guide only. Revenue has grown by 11% over the last 3 years. Earnings per share has grown by 34%. For the next 3 years, revenue is forecast to grow by 6.0% per annum. Earnings are also forecast to grow by 11% per annum over the same time period. Recent Insider Transactions • Jun 13
President recently sold €2.2m worth of stock On the 10th of June, Kurt Sievers sold around 9k shares on-market at roughly €257 per share. This transaction amounted to 4.6% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Kurt has been a net seller over the last 12 months, reducing personal holdings by €13m. Declared Dividend • Jun 03
First quarter dividend of US$1.01 announced Shareholders will receive a dividend of US$1.01. Ex-date: 13th June 2024 Payment date: 10th July 2024 Dividend yield will be 1.5%, which is higher than the industry average of 1.1%. Sustainability & Growth Dividend is well covered by both earnings (37% earnings payout ratio) and cash flows (38% cash payout ratio). The dividend has increased by an average of 26% per year over the past 6 years and payments have been stable during that time. EPS is expected to grow by 38% over the next 3 years, which should provide support to the dividend and adequate earnings cover. Reported Earnings • Apr 30
First quarter 2024 earnings released: EPS: US$2.49 (vs US$2.37 in 1Q 2023) First quarter 2024 results: EPS: US$2.49 (up from US$2.37 in 1Q 2023). Revenue: US$3.13b (flat on 1Q 2023). Net income: US$639.0m (up 3.9% from 1Q 2023). Profit margin: 20% (in line with 1Q 2023). Revenue is forecast to grow 5.2% p.a. on average during the next 3 years, compared to a 8.0% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 34% per year but the company’s share price has only increased by 16% per year, which means it is significantly lagging earnings growth. Buy Or Sell Opportunity • Apr 24
Now 23% overvalued after recent price rise Over the last 90 days, the stock has risen 8.3% to €220. The fair value is estimated to be €179, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 14% over the last 3 years. Earnings per share has grown by 47%. For the next 3 years, revenue is forecast to grow by 4.5% per annum. Earnings are also forecast to grow by 8.7% per annum over the same time period. Aankondiging • Mar 28
NXP Semiconductors N.V. Breaks Through Integration Barriers for Software-Defined Vehicle Development with Open S32 CoreRide Platform NXP Semiconductors N.V. breaks through the integration barriers for next-generation software-defined vehicle (SDV) development with the introduction of its S32 CoreRide platform. The new industry-first vehicle software platform greatly simplifies complex vehicle architecture development and cuts costs for automakers and tier-1 suppliers. The S32 CoreRide platform brings together NXP’s established S32 compute, networking, system power management and ready-to-deploy software from the company’s extensive software partner ecosystem. The company is also unveiling its first S32 CoreRide solution for central compute based on NXP’s new S32N family of vehicle super-integration processors. It offers safe and scalable combinations of real-time and applications processing as well as vehicle networking. The rise of SDVs introduces promising yet challenging paths forward. A new software-defined approach is imminent as upgradable features and new revenue streams are in demand across vehicle fleets. The proliferation of hardware-defined variants across different vehicle classes has become impractical to maintain in the modern vehicle architecture development flow. NXP’s S32 CoreRide platform represents the next milestone in overcoming the software and hardware integration challenges blocking fast adoption of SDVs. Automakers have struggled to move functions from the traditional multi-ECU to zoned or centralized processing due to software and architectural inconsistencies. The new platform integrates NXP’s broad hardware portfolio with software from the world’s leading automotive experts across a comprehensive ecosystem, including Accenture ESR Labs, ArcherMind, Blackberry QNX, Elektrobit, ETAS, Green Hills Software, Sonatus, Synopsys, TTTech Auto, Vector Informatik GmbH, and Wind River as well as tier-1 suppliers like Valeo. Leveraging the scalable S32 compute in the S32 CoreRide platform, OEMs can consolidate ECUs and develop flexible architectures, from domain to zonal to centralized, that scale across vehicle classes and generations. The platform provides the ability to isolate vehicle functions, helping to ensure freedom from interference between each application and dynamically re-allocate resources so applications do not degrade in performance as they evolve over time. This level of integration and flexibility advances carmakers and tier-1 suppliers to the next point in their development since they can now utilize the S32 CoreRide platform to put more focus on differentiation and the creation of application software for new business models. NXP also introduces its first solutions in the S32 CoreRide platform: the central compute solution based on the new S32N family of vehicle super-integration processors, advanced vehicle networking, system power management, and pre-integrated software from the S32 CoreRide open partner ecosystem. The central compute solution allows automakers to safely and easily integrate many cross-vehicle functions running in isolation-ready execution environments enabled by the S32N family’s automotive-grade hardware isolation capabilities. The scalable S32N family, purpose-built for the higher level of automotive functional safety, offers multiple combinations of real-time and applications processing cores to meet a wide range of automakers’ central compute needs. All S32N devices integrate an advanced hardware security engine and multi-port TSN Ethernet switch and CAN hub, with some also supporting Ethernet packet acceleration, AI/ML acceleration, and cost-effective, inter-compute PCI Express services. The S32 CoreRide central compute solution is optimized to meet the network bandwidth, power delivery requirements and targets ISO 26262 ASIL D functional safety requirements. It can unlock the benefits of SDVs by providing vehicle data intelligence for streamlining deployment and monetization of enhanced capabilities and new services over a vehicle’s lifetime. Aankondiging • Mar 14
Impinj, Inc. Announces Successful Settlement of Patent Litigation with NXP Semiconductors N.V Impinj, Inc. announced a successful settlement of its patent disputes with NXP Semiconductors N.V. The agreement terminates all pending legal proceedings, releases each party from liability for past patent infringement, and licenses each party’s patents to the other. It also releases resellers and end users from infringement claims for the sale or use of the parties’ UHF RFID products before the date of the agreement. The agreement, which concludes a multi-year patent dispute during which Impinj prevailed in multiple trials, includes both an up-front payment and a yearly license fee to Impinj. Upcoming Dividend • Mar 13
Upcoming dividend of US$1.01 per share Eligible shareholders must have bought the stock before 20 March 2024. Payment date: 10 April 2024. Payout ratio is a comfortable 37% and this is well supported by cash flows. Trailing yield: 1.6%. Lower than top quartile of German dividend payers (5.0%). Higher than average of industry peers (1.0%). Declared Dividend • Mar 11
Fourth quarter dividend of US$1.01 announced Shareholders will receive a dividend of US$1.01. Ex-date: 20th March 2024 Payment date: 10th April 2024 Dividend yield will be 1.6%, which is higher than the industry average of 1.1%. Sustainability & Growth Dividend is well covered by both earnings (37% earnings payout ratio) and cash flows (41% cash payout ratio). The dividend has increased by an average of 26% per year over the past 6 years and payments have been stable during that time. EPS is expected to grow by 31% over the next 3 years, which should provide support to the dividend and adequate earnings cover. Aankondiging • Mar 07
NXP Semiconductors N.V. Approves Interim Dividend for the First Quarter of 2024, Payable on April 10, 2024 NXP Semiconductors N.V. board of directors has approved the payment of an interim dividend of $1.014 per ordinary share for the first quarter of 2024. The interim dividend will be paid in cash on April 10, 2024 to shareholders of record as of March 21, 2024. Recent Insider Transactions • Mar 01
President recently sold €5.1m worth of stock On the 27th of February, Kurt Sievers sold around 22k shares on-market at roughly €232 per share. This transaction amounted to 11% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Kurt has been a net seller over the last 12 months, reducing personal holdings by €11m. Reported Earnings • Feb 25
Full year 2023 earnings released: EPS: US$10.83 (vs US$10.64 in FY 2022) Full year 2023 results: EPS: US$10.83 (up from US$10.64 in FY 2022). Revenue: US$13.3b (flat on FY 2022). Net income: US$2.80b (flat on FY 2022). Profit margin: 21% (in line with FY 2022). Revenue is forecast to grow 4.7% p.a. on average during the next 3 years, compared to a 8.2% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 47% per year but the company’s share price has only increased by 13% per year, which means it is significantly lagging earnings growth. Buy Or Sell Opportunity • Feb 08
Now 13% undervalued Over the last 90 days, the stock has risen 20% to €207. The fair value is estimated to be €238, however this is not to be taken as a buy recommendation but rather should be used as a guide only. Revenue has grown by 14% over the last 3 years. Earnings per share has grown by 47%. For the next 3 years, revenue is forecast to grow by 5.0% per annum. Earnings are also forecast to grow by 8.9% per annum over the same time period. Reported Earnings • Feb 07
Full year 2023 earnings released: EPS: US$10.83 (vs US$10.64 in FY 2022) Full year 2023 results: EPS: US$10.83 (up from US$10.64 in FY 2022). Revenue: US$13.3b (flat on FY 2022). Net income: US$2.80b (flat on FY 2022). Profit margin: 21% (in line with FY 2022). Revenue is forecast to grow 5.0% p.a. on average during the next 3 years, compared to a 3.1% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 47% per year but the company’s share price has only increased by 11% per year, which means it is significantly lagging earnings growth. Aankondiging • Feb 07
NXP Semiconductors N.V. Provides Earnings Guidance for the First Quarter of 2024 NXP Semiconductors N.V. provided earnings guidance for the first quarter of 2024. For the period, the company expects total revenue in the low range of $3,025 million, mid-range of $3,125 million and high range of $3,225 million; Operating Income of low range of $775 million, mid-range of $839 million and high range of $903 million; Earnings Per Share - diluted of low range of $2.21, mid-range of $2.41 and high-range of $2.62. Aankondiging • Jan 10
Nxp Semiconductors N.V. Extends 28 Nm Rfcmos Radar One-Chip Family to Enable Adas Architectures for Software-Defined Vehicles NXP Semiconductors N.V. announced an extension of its automotive radar one-chip family. The new SAF86xx monolithically integrates a high-performance radar transceiver, a multi-core radar processor and a MACsec hardware engine for secure data communication over Automotive Ethernet. Combined with NXP's S32 high-performance processors, vehicle network connectivity and power management, the full system solution paves the way for advanced, software-defined radar. The highly integrated radar SoC (System-on-Chip) is intended for streaming rich low-level radar sensor data at up to 1 Gbit/s. It helps carmakers optimize next-generation ADAS partitioning for software-defined vehicles, while providing for a smooth transition to new architectures. Additionally, OEMs will be able to easily introduce new software-defined radar features during the lifetime of the vehicle through Over-the-Air (OTA) updates. It also shares a common architecture with the SAF85xx introduced last year and leverages 28 nm RFCMOS performance for significantly improved radar sensor capabilities, compared to prior-generation 40 nm or 45 nm products. It enables Tier-1 suppliers to build more compact and power-efficient radar sensors. Drivers and other road users will benefit from extended detection range beyond 300 m, along with more reliable detection of small objects like curb stones as well as vulnerable road users including cyclists and pedestrians. The new radar one-chip supports NCAP safety functions including emergency braking and blind-spot detection. It also supports advanced ADAS and autonomous driving applications, including advanced comfort features for SAE levels 2+ and 3 such as traffic jam assist, highway pilot and park assist, front and rear cross-traffic alerts, as well as lateral and rear collision avoidance. The comprehensive SAF8xxx family featuring the new SAF86xx and SAF85xx can be tailored for individual OEM use cases. It supports a range of sensor outputs, including object, point cloud-, or range-FFT-level data for smart sensors in today’s architectures and streaming sensors in future distributed architectures. Extending NXP’s 3rd generation RFCMOS radar platform: Built on the proven RFCMOS automotive radar expertise of NXP, which was the first to ramp to high volume series production and has already shipped tens of millions of units,The highly integrated 76 to 81 GHz SAF86xx radar SoC is optimized for streaming sensors and include a Gigabit Ethernet interface and enhanced MACsec security,The SAF86xx is developed in accordance to ISO 26262 Safety Element out of Context (SEooC) methodology supporting ASIL Level B, in accordance to ISO/SAE 21434 (as a component-out-of-context) and meets the latest security requirements through its HSE security engine. The SAF86xx radar SoC family is sampling now for alpha customers. CES is the perfect time of the year to connect and take innovation to the next level -- together. Come join at the LVCC, booth CP-18 and experience scalable radar portfolio. Buying Opportunity • Dec 18
Now 21% undervalued Over the last 90 days, the stock is up 14%. The fair value is estimated to be €264, however this is not to be taken as a buy recommendation but rather should be used as a guide only. Revenue has grown by 16% over the last 3 years. Meanwhile, the company has become profitable. For the next 3 years, revenue is forecast to grow by 5.2% per annum. Earnings is also forecast to grow by 8.9% per annum over the same time period. Recent Insider Transactions • Dec 13
President recently sold €1.8m worth of stock On the 11th of December, Kurt Sievers sold around 9k shares on-market at roughly €203 per share. This transaction amounted to 4.0% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Kurt has been a net seller over the last 12 months, reducing personal holdings by €6.0m. Upcoming Dividend • Dec 05
Upcoming dividend of US$1.01 per share at 2.0% yield Eligible shareholders must have bought the stock before 12 December 2023. Payment date: 05 January 2024. Payout ratio is a comfortable 36% and this is well supported by cash flows. Trailing yield: 2.0%. Lower than top quartile of German dividend payers (5.1%). Higher than average of industry peers (1.1%). Aankondiging • Nov 17
NXP Semiconductors N.V. Approves Payment of an Interim Dividend for the Fourth Quarter of 2023, Payable on January 5, 2023 NXP Semiconductors N.V. has approved the payment of an interim dividend of $1.014 per ordinary share for the fourth quarter of 2023. The interim dividend will be paid in cash on January 5, 2023 to shareholders of record as of December 13, 2023. Aankondiging • Nov 09
Nxp Semiconductors N.V. Provides Earnings Guidance for the Fourth Quarter 2023 NXP Semiconductors N.V. provided earnings guidance for the Fourth Quarter 2023. For the quarter, company expects Total Revenue to be in range of $3,300 million to $3,500 million, Gross Profit to be in range of $1,866 million to $2,017 million, Operating Income (loss) to be in range of $928 million to $1,059 million and Earnings Per Share - diluted of $2.71 to $3.13. Reported Earnings • Nov 08
Third quarter 2023 earnings released: EPS: US$3.06 (vs US$2.82 in 3Q 2022) Third quarter 2023 results: EPS: US$3.06 (up from US$2.82 in 3Q 2022). Revenue: US$3.43b (flat on 3Q 2022). Net income: US$787.0m (up 6.6% from 3Q 2022). Profit margin: 23% (up from 21% in 3Q 2022). Revenue is forecast to grow 5.1% p.a. on average during the next 3 years, compared to a 7.8% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 61% per year but the company’s share price has only increased by 12% per year, which means it is significantly lagging earnings growth. Aankondiging • Nov 08
Nxp Expands S32 Platform with Motor Control Solution for Software-Defined Vehicle Edge Nodes NXP Semiconductors N.V. expands its scalable S32 vehicle compute platform with the introduction of the S32M2. The purpose-built motor control solution is optimized for efficiency improvement across vehicle applications such as pumps, fans, sunroof and seat position, seat belt pretensioners, trunk openers and more. Building on the success of the S12 MagniV® portfolio, the S32M2 combines NXP’s motor control heritage and the software development benefits of the S32 platform. The highly integrated system-in-package solution adds the power and analog functions as well as extensive software libraries required for motor control to NXP’s widely adopted S32K microcontrollers. It addresses the needs of the emerging software-defined electric vehicle market and enables carmakers to fully optimize product development and to maximize software re-use across S32 platform implementations. Among the many types of electric motors, brushless direct current (BLDC) and permanent magnet synchronous (PMSM) motors are known for their endurance and robustness, small size, low weight and high efficiency, which all contribute to energy savings and range extension for EVs. The S32M2 enables simplified and more robust motor control functions that can run efficiently while maintaining performance headroom to integrate more functions and capabilities while optimizing costs. OEMs can perform motor diagnostic tests, transmit data to the zonal controller and optimize for higher performance to improve efficiency further and lower audible noise in the final application, which improves occupant comfort. Compared with discrete motor control implementations, the S32M2 enables OEMs to accelerate time-to-market and reduce the printed circuit board footprint, design risks and bill-of-material cost. With the addition of the S32M2, NXP’s S32 vehicle compute platform is consistent from top to bottom, while benefitting from the vast Arm® software ecosystem. The close and long-standing partnership with Arm and previous joint development efforts allow NXP to leverage the full potential of the Arm Cortex™-M processors in terms of power efficiency and safety capabilities in combination with the new motor control solution. Upcoming Dividend • Sep 05
Upcoming dividend of US$1.01 per share at 1.9% yield Eligible shareholders must have bought the stock before 12 September 2023. Payment date: 05 October 2023. Payout ratio is a comfortable 35% and this is well supported by cash flows. Trailing yield: 1.9%. Lower than top quartile of German dividend payers (4.8%). Higher than average of industry peers (1.1%). Aankondiging • Aug 25
NXP Semiconductors N.V. Approves Interim Dividend for the Third Quarter of 2023, Payable on October 5, 2023 On August 24, 2023, the Board of NXP Semiconductors N.V. approved the payment of an interim dividend of $1.014 per ordinary share for the third quarter of 2023. The interim dividend will be paid on October 5, 2023 to shareholders of record as of September 13, 2023. Recent Insider Transactions • Aug 03
President recently sold €4.3m worth of stock On the 1st of August, Kurt Sievers sold around 21k shares on-market at roughly €204 per share. This transaction amounted to 12% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. This was Kurt's only on-market trade for the last 12 months. Reported Earnings • Jul 26
Second quarter 2023 earnings released: EPS: US$2.69 (vs US$2.55 in 2Q 2022) Second quarter 2023 results: EPS: US$2.69 (up from US$2.55 in 2Q 2022). Revenue: US$3.30b (flat on 2Q 2022). Net income: US$698.0m (up 4.2% from 2Q 2022). Profit margin: 21% (in line with 2Q 2022). Revenue is forecast to grow 5.0% p.a. on average during the next 3 years, compared to a 8.1% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 73% per year but the company’s share price has only increased by 26% per year, which means it is significantly lagging earnings growth. Aankondiging • Jul 25
NXP Semiconductors N.V. Provides Earnings Guidance for the Third Quarter of 2023 NXP Semiconductors N.V. provided earnings guidance for the third quarter of 2023. For the quarter, the company expects GAAP total revenue to be in the range of $3,300 million to $3,500 million, GAAP operating income to be in the range of $921 million to $1,053 million and GAAP diluted earnings per diluted share to be in the range of $2.68 to $3.10. Aankondiging • Jul 18
Impinj Wins Patent Infringement Lawsuits Against NXP Semiconductors Impinj Inc. announced that it prevailed in two RAIN RFID patent-infringement lawsuits. On July 14, a federal jury in California found that NXP Semiconductors infringed two of Impinj’s patents, one willfully. The jury awarded Impinj approximately $18.5M in damages and lost profits. In June, a federal jury in Washington found that Impinj did not infringe an NXP patent on which NXP sued Impinj. The cases stem from a patent-infringement lawsuit Impinj filed against NXP’s UCODE products in 2019, after attempting unsuccessfully for nearly two years to resolve without litigation. The infringed patents include key Impinj endpoint IC technologies related to Impinj’s Enduro technology, which provides a robust IC-to-antenna connection, and power-harvesting circuitry, which improves RAIN RFID tag sensitivity. Impinj has more than 300 issued and allowed RAIN RFID patents, reflecting significant investment and inventiveness. Impinj also supports global, royalty-free standards and, in accordance with the GS1 IP policy, provides reciprocal, royalty-free access to intellectual property necessary to practice the GS1 Gen2 protocol. The patent claims in the trial improve the readability, reliability and manufacturability of RAIN RFID tags and are not necessary to practice Gen2. Aankondiging • Jun 07
NXP Semiconductors Announces A Family of Top-Side Cooled RF Amplifier Modules, Based on A Packaging Innovation Designed to Enable Thinner and Lighter Radios for 5G Infrastructure NXP Semiconductors announced a family of top-side cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure. These smaller base stations can be more easily and cost-effectively installed, and blend more discretely into their environment. NXP's GaN multi-chip module series, combined with the industry's first top-side cooling solution for RF power, helps to reduce not only the thickness and weight of the radio by more than 20%, but also the carbon footprint for the manufacture and deployment of 5G base stations. NXP's new top-side cooled devices deliver significant design and manufacturing benefits, including the removal of the dedicated RF shield, use of cost-effective and streamlined printed circuit board, and separation of thermal management from RF design. These features help networking solution providers create slimmer and lighter 5G radios for mobile network operators, while reducing their overall design cycle. NXP's first top-side cooled RF power module series is designed for 32T32R, 200 W radios covering 3.3 GHz to 3.8 GHz. The devices combine the company's in-house LDMOS and GaN semiconductor technologies to enable high gain and efficiency with wideband performance, delivering 31 dB gain and 46% efficiency over 400 MHz of instant bandwidth. The A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC products are available today. The A5M36TG140 -TC will be supported by NXP's RapidRF reference board series. Upcoming Dividend • Jun 06
Upcoming dividend of US$1.01 per share at 2.3% yield Eligible shareholders must have bought the stock before 13 June 2023. Payment date: 06 July 2023. Payout ratio is a comfortable 34% and this is well supported by cash flows. Trailing yield: 2.3%. Lower than top quartile of German dividend payers (4.7%). Higher than average of industry peers (1.0%). Recent Insider Transactions • Jun 02
Insider recently sold €1.7m worth of stock On the 30th of May, Christopher Jensen sold around 10k shares on-market at roughly €173 per share. This transaction amounted to 95% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth €2.3m. Insiders have been net sellers, collectively disposing of €3.9m more than they bought in the last 12 months. Buying Opportunity • May 11
Now 21% undervalued after recent price drop Over the last 90 days, the stock is down 15%. The fair value is estimated to be €188, however this is not to be taken as a buy recommendation but rather should be used as a guide only. Revenue has grown by 18% over the last 3 years. Earnings per share has grown by 82%. For the next 3 years, revenue is forecast to grow by 5.6% per annum. Earnings is also forecast to grow by 9.9% per annum over the same time period. Recent Insider Transactions • May 09
Executive VP recently sold €2.3m worth of stock On the 5th of May, Jennifer Wuamett sold around 15k shares on-market at roughly €151 per share. This transaction amounted to 33% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. This was the only on-market transaction from insiders over the last 12 months. Reported Earnings • May 03
First quarter 2023 earnings released: EPS: US$2.37 (vs US$2.50 in 1Q 2022) First quarter 2023 results: EPS: US$2.37 (down from US$2.50 in 1Q 2022). Revenue: US$3.12b (flat on 1Q 2022). Net income: US$615.0m (down 6.4% from 1Q 2022). Profit margin: 20% (down from 21% in 1Q 2022). Revenue is forecast to grow 6.4% p.a. on average during the next 3 years, compared to a 9.0% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 82% per year but the company’s share price has only increased by 20% per year, which means it is significantly lagging earnings growth. Upcoming Dividend • Mar 07
Upcoming dividend of US$1.01 per share at 2.3% yield Eligible shareholders must have bought the stock before 14 March 2023. Payment date: 05 April 2023. Payout ratio is a comfortable 32% and this is well supported by cash flows. Trailing yield: 2.3%. Lower than top quartile of German dividend payers (4.7%). Higher than average of industry peers (1.1%). Reported Earnings • Mar 03
Full year 2022 earnings released: EPS: US$10.64 (vs US$6.91 in FY 2021) Full year 2022 results: EPS: US$10.64 (up from US$6.91 in FY 2021). Revenue: US$13.2b (up 19% from FY 2021). Net income: US$2.79b (up 49% from FY 2021). Profit margin: 21% (up from 17% in FY 2021). The increase in margin was driven by higher revenue. Revenue is forecast to grow 3.3% p.a. on average during the next 3 years, compared to a 8.8% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 90% per year but the company’s share price has only increased by 19% per year, which means it is significantly lagging earnings growth. Reported Earnings • Feb 01
Full year 2022 earnings released: EPS: US$10.64 (vs US$6.91 in FY 2021) Full year 2022 results: EPS: US$10.64 (up from US$6.91 in FY 2021). Revenue: US$13.2b (up 19% from FY 2021). Net income: US$2.79b (up 49% from FY 2021). Profit margin: 21% (up from 17% in FY 2021). The increase in margin was driven by higher revenue. Revenue is forecast to grow 2.6% p.a. on average during the next 3 years, compared to a 8.4% growth forecast for the Semiconductor industry in Germany. Over the last 3 years on average, earnings per share has increased by 90% per year but the company’s share price has only increased by 11% per year, which means it is significantly lagging earnings growth. Aankondiging • Jan 06
NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen Adas and Autonomous Driving Systems NXP Semiconductors announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems. The new SAF85xx one-chip family combines NXP’s high performance radar sensing and processing technologies into a single device, offering tier ones and OEMs new flexibility in addressing short, medium and long range radar applications to serve ever more challenging NCAP safety requirements. The introduction of the one-chip radar family has added to NXP’s leading radar portfolio, built on more than 15 years of technology leadership and designed to surround drivers in a cocoon of safety to reduce accidents. DENSO Corporation, which works at the forefront of radar technology, has embraced NXP’s latest innovation as its lead customer. NXP’s new family of automotive radar SoCs is comprised of high-performance radar transceivers integrated with multi-core radar processors which are built on NXP’s S32R radar compute platform. The SAF85xx offers twice the RF performance and accelerates radar signal processing by up to 40%, compared to NXP’s previous generation. The one-chip family enables 4D sensing for corner and front radar, serving critical safety ADAS applications, such as automated emergency braking, adaptive cruise control, blind-spot monitoring, cross-traffic alert and automated parking. OEMs will benefit from the increased flexibility it offers in meeting the expanding NCAP safety requirements and the proliferation of radar sensors, which some analyst estimates project will range to up to five or more per car. When combined with power management and connectivity solutions from NXP, the system solution flexibly addresses a wide variety of today’s and tomorrow’s OEM needs. Developers can take advantage of the S32R family’s seamless performance scalability as well as its software and hardware design reuse benefits. NXP’s 3rd Generation RFCMOS Radar Platform Built on the proven RFCMOS expertise of NXP, which was the first to ramp to high volume series production for automotive radar and has already shipped tens of millions of units, Highly integrated 77 GHz radar smart transceiver SoC contains four high-performance transmitters, four receivers, a multi-core radar processor with hardware accelerator, Gigabit Ethernet communication interface and memory and Targets the Automotive Safety Integrity Level B (ASIL B) requirements, according to the ISO?26262 functional safety standard and the automotive cybersecurity standard ISO/SAE?21434 to meet the requirements of the automotive industry for safety and security. Availability: The SAF85xx one-chip family is sampling now for alpha customers.