ENXTPA:SOISemiconductor
Soitec’s 6G GaN Breakthrough Raises Long Term Materials Opportunity Questions
Soitec (ENXTPA:SOI) and NTU Singapore announced a 6G research breakthrough using high performance GaN devices at Mobile World Congress 2026.
The results showcase how Soitec's advanced wafers can support next generation 6G connectivity solutions.
The collaboration highlights Soitec's role in semiconductor materials for telecom infrastructure and future wireless standards.
For readers tracking ENXTPA:SOI, this update sits squarely in Soitec's core expertise in engineered wafers for power, RF...