View Past PerformanceNanoveu 대차대조표 건전성재무 건전성 기준 점검 5/6Nanoveu 의 총 주주 지분은 A$12.1M 이고 총 부채는 A$134.0K, 이는 부채 대 자기자본 비율을 1.1% 로 가져옵니다. 총자산과 총부채는 각각 A$13.6M 및 A$1.5M 입니다.핵심 정보1.11%부채/자본 비율AU$134.01k부채이자보상배율n/a현금AU$1.81m자본AU$12.09m총부채AU$1.46m총자산AU$13.55m최근 재무 건전성 업데이트업데이트 없음모든 업데이트 보기Recent updates공지 • Apr 10Nanoveu Limited, Annual General Meeting, May 29, 2026Nanoveu Limited, Annual General Meeting, May 29, 2026.공지 • Jan 20Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million.Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million. Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 85,227,274 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 1,363,636 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Transaction Features: Subsequent Direct Listing공지 • Dec 18Emass, A Nanoveu Subsidiary Pushes the Edge Further with 16Nm Ecs-DotEMASS, a Nanoveu subsidiary with next-generation semiconductor technology, announced that its next-generation ECS-DoT SoC built on a 16nm process node has entered the final phases of development, headed toward graphic data system (GDS) sign-off, tape-out and fabrication at TSMC. This new device builds on EMASS's existing 22nm ECS-DoT offering and strengthens the company's leadership in ultra-low-power Edge AI by extending always-on intelligence into more demanding and highly integrated applications. The new 16nm ECS-DoT builds on the 22nm's performance, energy consumption, compute capability and on-chip resources, while preserving the architectural concepts, developer workflow and ultra-low-power mission that define the ECS-DoT family. It continues to advance edge technology by integrating an on-chip Bluetooth Low Energy (BLE) subsystem, expanding on-chip SRAM with a new power management system and AI and processing acceleration enhancements. Enabling the Next Stage of Edge Intelligence: The 16nm ECS- DoT advances EMASS's edge AI capabilities through higher integration, expanded on-chip resources and improved power efficiency, enabling more capable always-on intelligence without increasing system complexity or energy demand. Key enhancements include: Fully integrated BLE subsystem -- Eliminates the need for external wireless ICs, reducing board area, bill-of-materials cost and design complexity; Dedicated object-detection accelerator -- Offloads vision workloads to increase throughput and reduce interference latency for edge vision use cases; Integrated floating-point unit (FP16/FP32) -- Accelerates DSP and mixed-precision AI workflows while simplifying developer toolchains and code migration. The new SoC maintains complete software and workflow compatibility with the current ECS-DoT family; This allows developers to deploy applications on either the 22nm or 16nm version with minimal redesign, while supporting larger and more demanding workloads without compromising ultra-low-power operation. The 16nm ECS-Do T also advances EMASS's "Atoms-to-Apps" methodology, connecting application requirements, algorithm design, silicon architecture and real-world deployment into a unified development philosophy.공지 • Sep 17Emass A Subsidiary of Nanoveu Ltd Introduces the Ecs-Dot, Their Edge Ai System-On-ChipEMASS a subsidiary of Nanoveu Ltd. introduced the ECS-DoT, their edge AI system-on-chip (SoC). The new design enables always-on, milliWatt-scale intelligence for edge devices, eliminating the need for cloud-based computation. With this chip, EMASS is targeting the extreme edge of the network, an area occupied by compact and lightweight connected devices powered by small batteries. Application examples include medical wearables and sensor modules operating adjacent to the sensors they support. The ECS-DoT is designed with four megabytes of on-board SRAM, enabling AI computations to run efficiently on edge and IoT devices. By processing data locally, the chip dramatically reduces latency and power consumption, opening the door for always-on intelligence in wearables, drones and predictive maintenance-dependent systems. Compared with leading competitors, ECS-DoT operates up to 93% faster while consuming 90% less energy, all while supporting true multimodal sensor fusion on-device, eliminating the need for cloud processing.재무 상태 분석단기부채: NNVU.F 의 단기 자산 ( A$2.7M )이 단기 부채( A$1.4M ).장기 부채: NNVU.F의 단기 자산(A$2.7M)이 장기 부채(A$71.9K)를 초과합니다.부채/자본 비율 추이 및 분석부채 수준: NNVU.F 총 부채보다 더 많은 현금을 보유하고 있습니다.부채 감소: NNVU.F의 부채 대비 자본 비율은 지난 5년 동안 0%에서 1.1%로 증가했습니다.대차대조표현금 보유 기간 분석과거에 평균적으로 손실을 기록해 온 기업의 경우, 최소 1년 이상의 현금 보유 기간이 있는지 평가합니다.안정적인 현금 활주로: NNVU.F 은 마지막 보고 무료 현금 흐름을 기준으로 4 개월 동안 충분한 현금 활주로를 보유하고 있지만 이후 추가 자본을 조달했다.예측 현금 활주로: NNVU.F 은 잉여현금흐름추정을 기준으로 3 개월 동안 충분한 현금 활주로를 확보할 것으로 예상되지만 이후 추가 자본을 조달했습니다.건전한 기업 찾아보기7D1Y7D1Y7D1YTech 산업의 건실한 기업.View Dividend기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/05/11 17:59종가2026/05/06 00:00수익2025/12/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Nanoveu Limited는 0명의 분석가가 다루고 있습니다. 이 중 0명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.
공지 • Apr 10Nanoveu Limited, Annual General Meeting, May 29, 2026Nanoveu Limited, Annual General Meeting, May 29, 2026.
공지 • Jan 20Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million.Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million. Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 85,227,274 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 1,363,636 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Transaction Features: Subsequent Direct Listing
공지 • Dec 18Emass, A Nanoveu Subsidiary Pushes the Edge Further with 16Nm Ecs-DotEMASS, a Nanoveu subsidiary with next-generation semiconductor technology, announced that its next-generation ECS-DoT SoC built on a 16nm process node has entered the final phases of development, headed toward graphic data system (GDS) sign-off, tape-out and fabrication at TSMC. This new device builds on EMASS's existing 22nm ECS-DoT offering and strengthens the company's leadership in ultra-low-power Edge AI by extending always-on intelligence into more demanding and highly integrated applications. The new 16nm ECS-DoT builds on the 22nm's performance, energy consumption, compute capability and on-chip resources, while preserving the architectural concepts, developer workflow and ultra-low-power mission that define the ECS-DoT family. It continues to advance edge technology by integrating an on-chip Bluetooth Low Energy (BLE) subsystem, expanding on-chip SRAM with a new power management system and AI and processing acceleration enhancements. Enabling the Next Stage of Edge Intelligence: The 16nm ECS- DoT advances EMASS's edge AI capabilities through higher integration, expanded on-chip resources and improved power efficiency, enabling more capable always-on intelligence without increasing system complexity or energy demand. Key enhancements include: Fully integrated BLE subsystem -- Eliminates the need for external wireless ICs, reducing board area, bill-of-materials cost and design complexity; Dedicated object-detection accelerator -- Offloads vision workloads to increase throughput and reduce interference latency for edge vision use cases; Integrated floating-point unit (FP16/FP32) -- Accelerates DSP and mixed-precision AI workflows while simplifying developer toolchains and code migration. The new SoC maintains complete software and workflow compatibility with the current ECS-DoT family; This allows developers to deploy applications on either the 22nm or 16nm version with minimal redesign, while supporting larger and more demanding workloads without compromising ultra-low-power operation. The 16nm ECS-Do T also advances EMASS's "Atoms-to-Apps" methodology, connecting application requirements, algorithm design, silicon architecture and real-world deployment into a unified development philosophy.
공지 • Sep 17Emass A Subsidiary of Nanoveu Ltd Introduces the Ecs-Dot, Their Edge Ai System-On-ChipEMASS a subsidiary of Nanoveu Ltd. introduced the ECS-DoT, their edge AI system-on-chip (SoC). The new design enables always-on, milliWatt-scale intelligence for edge devices, eliminating the need for cloud-based computation. With this chip, EMASS is targeting the extreme edge of the network, an area occupied by compact and lightweight connected devices powered by small batteries. Application examples include medical wearables and sensor modules operating adjacent to the sensors they support. The ECS-DoT is designed with four megabytes of on-board SRAM, enabling AI computations to run efficiently on edge and IoT devices. By processing data locally, the chip dramatically reduces latency and power consumption, opening the door for always-on intelligence in wearables, drones and predictive maintenance-dependent systems. Compared with leading competitors, ECS-DoT operates up to 93% faster while consuming 90% less energy, all while supporting true multimodal sensor fusion on-device, eliminating the need for cloud processing.