공시 • Mar 13
Lasertec Corporation to Report Q3, 2026 Results on Apr 30, 2026 Lasertec Corporation announced that they will report Q3, 2026 results on Apr 30, 2026 공시 • Dec 12
Lasertec Corporation to Report Q2, 2026 Results on Jan 30, 2026 Lasertec Corporation announced that they will report Q2, 2026 results on Jan 30, 2026 공시 • Nov 01
Lasertec Corporation Provides Consolidated Earnings Guidance for the Year Ending June 30, 2026 Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2026. For the year, the company expects net sales of JPY 200,000 million; operating income of JPY 85,000 million; Net income attributable to owners of parents of 60,000 million and net income per share of JPY 665.75. 공시 • Mar 26
Lasertec Corporation Appoints Hiroki Miyai as Executive Officer, Effective April 1, 2025 Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025. 공시 • Jan 03
Lasertec Corporation to Report Q2, 2025 Results on Jan 31, 2025 Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025 공시 • Sep 24
Lasertec Releases SICA108, SiC Wafer Inspection and Review System Lasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes. 공시 • May 03
Lasertec Corporation Announces Chief Executive Officer Changes, as of July 1, 2024 Lasertec Corporation announced that it has resolved at the board of directors meeting held on April 30, 2024 to make changes in its representative directors and executive officers as follows (as of July 1, 2024): Osamu Okabayashi: Previous position: Representative Director, President & Chief Executive Officer; New position: Representative Director, Chairman & Executive Officer. Tetsuya Sendoda: Previous position: Director, Vice President & Executive Officer concurrently, Chief Sales Officer; New position: Chief Executive Officer. Resume of New Representative Director: Tetsuya Sendoda (April 26, 1977); Career Summary: Jan. 2008, Joined Lasertec Corporation; June 2020, General Manager, Technology Department 2; July 2022, Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; Sept. 2022 Executive Officer; Sales Officer; General Manager, Technology Department 2; and General Manager, Solution Sales Department 1; April 2023 Executive Officer; Sales Officer; and General Manager, Solution Sales Department 1; Sept. 2023 Director, Vice President & Executive Officer (current); and Chief Sales Officer (current). 공시 • Feb 11
Lasertec Corporation to Report Q3, 2024 Results on Apr 30, 2024 Lasertec Corporation announced that they will report Q3, 2024 results on Apr 30, 2024 공시 • Nov 25
Lasertec Corporation Releases ACTIS “A300” Series Actinic EUV Patterned Mask Inspection System Lasertec Corporation announced the release of ACTIS A300 series Actinic EUV Patterned Mask Inspection System for High-NA. ACTIS A150 actinic EUV patterned mask inspection system provided by Lasertec has been facilitating the adoption of EUV lithography to high-volume manufacturing. It is renowned for its excellent inspection performance in the industry. The newly released ACTIS A300 is a next-generation model that meets the requirements of manufacturing processes using high-NA EUV lithography to enable the further miniaturization of device geometries. The A300 series uses newly designed optics and high-brightness light source URASHIMA . It achieves a significant improvement in defect detection performance compared to the A150 series. The anamorphic optics used in high-NA lithography have adopted different magnifications of projection in the X and Y directions. Inspection of EUV masks for high-NA lithography, therefore, requires different levels of resolution in the two directions. The A300 series can also be used to inspect EUV masks for the current NA lithography as well as EUV masks for high-NA lithography. Lasertec is dedicated to supporting the needs of leading-edge semiconductor manufacturers, developing unique solutions, and facilitating quality and productivity improvement, thereby contributing to the advancement of the industry. Features: Inspection of EUV masks for high-NA lithography. Inspection of EUV masks for the current NA lithography. High productivity inspection with highly efficient optics and high-brightness light source URASHIMA. Applications: Quality assurance inspection during EUV mask manufacturing processes. Incoming EUV mask inspection and periodic quality assurance inspection at wafer fabs. 공시 • Nov 01
Lasertec Corporation to Report Q2, 2023 Results on Jan 31, 2023 Lasertec Corporation announced that they will report Q2, 2023 results on Jan 31, 2023 공시 • Aug 08
Lasertec Corporation Revises Earnings Guidance for the Fiscal Year Ended June 30, 2021 Lasertec Corporation revised earnings guidance for the fiscal year ended June 30, 2021. For the period, the company expects net sales of JPY 70,248 million compared to JPY 62,000 million forecasted previously. Operating income of JPY 26,074 million compared to JPY 20,000 million forecasted previously. Ordinary income of JPY 26,438 million compared to JPY 20,000 million forecasted previously. Net income attributable to owners of parent of JPY 19,250 million compared to JPY 14,000 million forecasted previously. Net income per share was JPY 213.47 compared to JPY 155.25 forecasted previously. 공시 • Feb 02
Lasertec Corporation Announces Revised Forecasts of Consolidated Financial Results for the Fiscal Year Ending June 30, 2021 Lasertec Corporation announced its revised forecasts of consolidated financial results for the fiscal year ending June 30, 2021. Net sales is forecasted as JPY 62,000 million against JPY 57,000 million forecasted earlier. Operating income is forecasted as JPY 20,000 million against JPY 17,000 million forecasted earlier. Net income attributable to owners of parent is forecasted as JPY 14,000 million against JPY 12,500 million forecasted earlier. Net income per share is forecasted as JPY 155.25 against JPY 138.61 forecasted earlier.